In this paper the potentiality of impact avalanche transit time (IMPATT) devices based on different semiconductor materials such as GaAs, Si, InP, 4H-SiC and Wurtzite-GaN (Wz-GaN) has been explored for operation at terahertz frequencies. Drift–diffusion model is used to design double-drift region (DDR) IMPATTs based on different materials at millimeter-wave (mm-wave) and terahertz (THz) frequencies. The performance limitations of these devices are studied from the avalanche response times at different mm-wave and THz frequencies. Results show that the upper cut-off frequency limits of GaAs and Si DDR IMPATTs are 220 GHz and 0.5 THz, respectively, whereas the same for InP and 4H-SiC DDR IMPATTs is 1.0 THz. Wz-GaN DDR IMPATTs are found to be excellent candidate for generation of RF power at THz frequencies of the order of 5.0 THz with appreciable DC to RF conversion efficiency. Further, it is observed that up to 1.0 THz, 4H-SiC DDR IMPATTs excel Wz-GaN DDR IMPATTs as regards their RF power outputs. Thus, the wide bandgap semiconductors such as Wz-GaN and 4H-SiC are highly suitable materials for DDR IMPATTs at both mm-wave and THz frequency ranges.

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Prospects of IMPATT devices based on wide bandgap semiconductors as potential terahertz sources

Potentiality of Impact Avalanche Transit Time (IMPATT) devices based on different semiconductor materials such as InP, 4H-SiC, and Wurtzite-GaN (Wz-GaN) has been explored for operation at terahertz (THz) frequencies. Drift-diffusion model is used to design double-drift region (DDR) IMPATTs based on above mentioned materials at different millimeter-wave (mm-wave) and THz frequencies and the upper cut-off frequency limits of those devices are obtained from the avalanche response times at those mm-wave and THz frequencies. Results show that the upper cut-off frequency limits of both InP and 4H-SiC DDR IMPATTs are 1.0 THz; whereas, the same is 5.0 THz in Wz-GaN DDR IMPATTs. The Wz-GaN DDR IMPATTs emerge as the most suitable devices for generation of THz frequencies due to their small avalanche response time, high DC to RF conversion ratio, and sufficiently high RF power output at THz frequencies. But, it is observed that up to 1.0 THz, 4H-SiC DDR IMPATTs excel Wz-GaN DDR IMPATTs due to their higher ou...

Potentiality of IMPATT Devices as Terahertz Source: An Avalanche Response Time-based Approach to Determine the Upper Cut-off Frequency Limits

An attempt is made in this paper to study the influence of skin depth on the parasitic series resistance of millimeter-wave IMPATT devices based on Silicon. The method is based on the concept of depletion width modulation of the device under large-signal condition. A large-signal simulation model based on non-sinusoidal voltage excitation is used for this study. The electric field snap-shots of 35 GHz Single-Drift Region (SDR) and 94 GHz Double-Drift Region (DDR) IMPATT devices are first obtained from which the series resistances are estimated by incorporating the effect of skin depth in the modeling and simulation. The series resistances of these devices are also obtained by neglecting the effect of skin depth. The values of series resistances obtained from the simulation are compared with the corresponding experimentally reported values. It is observed that the series resistance estimated by including the skin effect is in closer agreement with the experimental values as compared to that without including the same. Thus the skin effect plays an important role for determining the series resistance of IMPATT devices at millimeter-wave frequency bands.

Influence of skin effect on the series resistance of millimeter-wave IMPATT devices

The authors have developed a large-signal simulation technique extending an in-house small-signal simulation code for analyzing a 94 GHz double-drift region impact avalanche transit time device based on silicon with a non-sinusoidal voltage excitation and studied the effect of junction temperature between 300 and 550 K on the large-signal characteristics of the device for both continuous wave (CW) and pulsed modes of operation. Results show that the large-signal RF power output of the device in both CW and pulsed modes increases with the increase of voltage modulation factor up to 60%, but decreases sharply with further increase of voltage modulation factor for a particular junction temperature; while the same parameter increases with the increase of junction temperature for a particular voltage modulation factor. Heat sinks made of copper and type-IIA diamond are designed to carry out the steady-state and transient thermal analysis of the device operating in CW and pulsed modes respectively. Authors have adopted Olson's method to carry out the transient analysis of the device, which clearly establishes the superiority of type-IIA diamond over copper as the heat sink material of the device from the standpoint of the undesirable effect of frequency chirping due to thermal transients in the pulsed mode.

http://iopscience.iop.org/article/10.1088/1674-4926/34/2/024001/pdf

Effect of junction temperature on the large-signal properties of a 94 GHz silicon based double-drift region impact avalanche transit time device

Large-signal (L-S) characterization of double-drift region (DDR) impact avalanche transit time (IMPATT) devices based on silicon designed to operate at different millimeter-wave (mm-wave) and terahertz (THz) frequencies up to 0.5 THz is carried out in this paper using an L-S simulation method developed by the authors based on non-sinusoidal voltage excitation (NSVE) model. L-S simulation results show that the device is capable of delivering peak RF power of 657.64 mW with 8.25% conversion efficiency at 94 GHz for 50% voltage modulation; whereas RF power output and efficiency reduce to 89.61 mW and 2.22% respectively at 0.5 THz for same voltage modulation. Effect of parasitic series resistance on the L-S properties of DDR Si IMPATTs is also investigated, which shows that the decrease in RF power output and conversion efficiency of the device due to series resistance is more pronounced at higher frequencies especially at the THz regime. The NSVE L-S simulation results are compared with well established double-iterative field maximum (DEFM) small-signal (S-S) simulation results and finally both are compared with the experimental results. The comparative study shows that the proposed NSVE L-S simulation results are in closer agreement with experimental results as compared to those of DEFM S-S simulation.

Large-signal characterization of DDR silicon IMPATTs operating up to 0.5 THz

For the first time silicon double-drift IMPATT structures have been grown completely by Si molecular-beam epitaxy. The n-type layers are grown at 750 °C on low-resistivity n+-type substrates followed by p-type layers at 650 °C. The highly doped p+-layers are grown by solid-phase epitaxy in the MBE system. Device design is made for CW operation in W-band. The material is investigated by inspection of beveled samples, defect etching, TEM, SIMS, and spreading resistance measurements. Double-drift flat-profile diodes are housed and mounted employing a technological procedure approved for single-drift diodes. For initial device characterization, dc measurements are performed. Information about doping profile, series, and thermal resistances is obtained. Preliminary RF measurements delivered a maximum output power of 600 mW at 94 GHz with 6.7-percent efficiency from an unoptimized structure.

A. Casel

Papers

A 90-GHz double-drift IMPATT diode made with Si MBE