scispace - formally typeset
Search or ask a question
Author

A.D. Oliver

Bio: A.D. Oliver is an academic researcher from Sandia National Laboratories. The author has contributed to research in topics: Beam (structure) & Optics. The author has an hindex of 6, co-authored 6 publications receiving 291 citations.

Papers
More filters
Journal ArticleDOI
TL;DR: In this paper, the rotary displacements are achieved by orthogonally arranged pairs of cascaded actuators that are used to rotate a gear, and they were fabricated using electroplated Ni, p/sup ++/Si, and polysilicon as structural materials.
Abstract: For Part I see L. Que, J.S. Park and Y.B. Gianchandani, ibid., vol.10, pp.247-54 (2001). This paper reports on the use of bent-beam electrothermal actuators for the purpose of generating rotary and long-throw rectilinear displacements. The rotary displacements are achieved by orthogonally arranged pairs of cascaded actuators that are used to rotate a gear. Devices were fabricated using electroplated Ni, p/sup ++/ Si, and polysilicon as structural materials. Displacements of 20-30 /spl mu/m with loading forces >150 /spl mu/N at actuation voltages 200 /spl mu/N at displacements >100 /spl mu/m were measured.

168 citations

22 Nov 1999
TL;DR: In this paper, the authors report on significant advances in electrothermal bent beam actuators and present designs for long throw linear and rotary actuators with linear displacements of 100m with 200m N loads.
Abstract: This paper reports on significant advances in electrothermal bent beam actuators. Designs for long throw linear and rotary actuators are described. Silicon p++ devices showed 20--30 {mu}m displacements with 150 {micro}N loads at actuation levels of 6--8 V, and 250--300 mW. An electroplated version provided 15 {mu}m displacements at 0.8 V and 450 mW. Inchworm type devices are reported that had linear displacements of 100 {micro}m with 200 {micro}N loads. Refinements in the modeling to account for non-linear thermal expansion coefficients and buckling are also reported.

37 citations

Proceedings ArticleDOI
23 Jan 2000
TL;DR: In this paper, the performance and application of bent-beam microactuators are reported. But the performance of the bending-beam actuators has not yet been investigated in the field of rotary drives.
Abstract: This paper reports on several aspects of the performance and application of bent-beam microactuators. Orthogonal pairs of p/sup +/ Si cascaded actuators with 500-1000 /spl mu/m long, 6.5 /spl mu/m thick beams designed for rotary drives are shown to produce 20-30 /spl mu/m non-resonant displacement with >150 /spl mu/N loading at less than 8 V, 300 mW. Inchworm type devices using 500-1500 /spl mu/m long, 8-14 /spl mu/m thick bent-beams are shown to produce up to 104 /spl mu/m displacement against 204 /spl mu/N loading farce with 250-750 mW DC and pulse actuation. Integrated passive locks reduce standby power to zero. Measured frequency response of bent-beam actuators and refinements in modeling that include non-linear thermal expansion coefficients and buckling are also reported.

34 citations

Journal ArticleDOI
TL;DR: In this article, the optical actuation of surface micromachines is described, where optical energy is absorbed and converted to heat, which causes differential thermal expansion between different parts of the device and up to 12 /spl mu/m of displacement.
Abstract: We report on the optical actuation of surface micromachines. Optical energy is absorbed by the micromachines and converted to heat, which causes differential thermal expansion between different parts of the device and up to 12 /spl mu/m of displacement. The polysilicon actuators are homogenous and electrically isolated.

28 citations

01 Apr 2003
TL;DR: In this article, the authors report on the dc and pulse mode lifetime testing of a class of actuators constructed using polysilicon and p/sup ++/ doped single crystal silicon.
Abstract: Microsystems using electrothermal bent-beam microactuators have been demonstrated for a variety of applications including optical attenuators, RF switches, and micro positioners, thus creating a need for information on the longevity of these devices. This paper reports on the dc and pulse mode lifetime testing of this class of actuators constructed using polysilicon and p/sup ++/ doped single crystal silicon. The relative temperature profile along the top surface of an actuator is experimentally verified by scanning probe microscopy. Displacement measurements are used to explore links between aging behavior and the design variables and operating conditions. At low power levels (which result in average operating temperatures of 300-400/spl deg/C) both polysilicon and p/sup ++/ Si devices provide continuous dc operation for >1400 min, in air without change in amplitude. While some types of p/sup ++/ Si devices show monotonic loss of amplitude in pulse tests, others have been operated up to 30 million cycles without degradation. The displacement for polysilicon actuators can either increase or decrease depending on the geometry of the device and operating conditions, both of which are related to temperature and stress of the structural members. Polysilicon grain transformations are observed over extended operation at high temperatures. Performance changes are correlated to material properties using SEM and TEM images.

17 citations


Cited by
More filters
Journal ArticleDOI
TL;DR: In this article, the authors describe electrothermal microactuators that generate rectilinear displacements and forces by leveraging deformations caused by localized thermal stresses, where an electric current is passed through a V-shaped beam anchored at both ends, and thermal expansion caused by joule heating pushes the apex outward.
Abstract: This paper describes electrothermal microactuators that generate rectilinear displacements and forces by leveraging deformations caused by localized thermal stresses. In one manifestation, an electric current is passed through a V-shaped beam anchored at both ends, and thermal expansion caused by joule heating pushes the apex outward. Analytical and finite element models of device performance are presented along with measured results of devices fabricated using electroplated Ni and p/sup ++/ Si as structural materials. A maskless process extension for incorporating thermal and electrical isolation is described. Nickel devices with 410-/spl mu/m-long, 6-/spl mu/m-wide, and 3-/spl mu/m-thick beams demonstrate 10 /spl mu/m static displacements at 79 mW input power; silicon devices with 800-/spl mu/m-long, 13.9-/spl mu/m-wide, and 3.7-/spl mu/m-thick beams demonstrate 5 /spl mu/m displacement at 180 mW input power. Cascaded silicon devices using three beams of similar dimensions offer comparable displacement with 50-60% savings in power consumption. The peak output forces generated are estimated to be in the range from 1 to 10 mN for the single beam devices and from 0.1 to 1 mN for the cascaded devices. Measured bandwidths are /spl ap/700 Hz for both. The typical drive voltages used are /spl les/12 V, permitting the use of standard electronic interfaces that are generally inadequate for electrostatic actuators.

373 citations

Journal ArticleDOI
TL;DR: In this paper, the design and optimization of thermal actuators employed in a novel MEMS-based material testing system is addressed and analytical expressions of the actuator thermomechanical response are derived and discussed.
Abstract: This paper addresses the design and optimization of thermal actuators employed in a novel MEMS-based material testing system. The testing system is designed to measure the mechanical properties of a variety of materials/structures from thin films to one-dimensional structures, e.g. carbon nanotubes (CNTs) and nanowires (NWs). It includes a thermal actuator and a capacitive load sensor with a specimen in-between. The thermal actuator consists of a number of V-shaped beams anchored at both ends. It is capable of generating tens of milli-Newton force and a few micrometers displacement depending on the beams' angle and their number. Analytical expressions of the actuator thermomechanical response are derived and discussed. From these expressions, a number of design criteria are drawn and used to optimize the device response. The analytical predictions are compared with both finite element multiphysics analysis (FEA) and experiments. To demonstrate the actuator performance, polysilicon freestanding specimens cofabricated with the testing system are tested.

224 citations

Journal ArticleDOI
TL;DR: In this paper, the authors describe the development and experimental validation of a finite-difference thermal model of a thermomechanical in-plane microactuator (TIM).
Abstract: Thermomechanical microactuators possess a number of desirable attributes including ease of fabrication and large force and displacement capabilities relative to other types of microactuators. These advantages provide motivation for improving thermomechanical microactuator designs that are more energy efficient and thus better suited for low-power applications. To this end, this paper describes the development and experimental validation of a finite-difference thermal model of a thermomechanical in-plane microactuator (TIM). Comparisons between the model and experimental results demonstrate the importance of including the temperature dependence of several parameters in the model. Strategies for reducing the power and energy requirements of the TIM were investigated using model simulations as a guide. Based on design insights gained from the model, the energy efficiency of the TIM has been improved significantly by operating in a vacuum environment and providing short-duration, high-current pulse inputs. These improvements have been validated experimentally.

200 citations

Journal ArticleDOI
TL;DR: In this paper, the rotary displacements are achieved by orthogonally arranged pairs of cascaded actuators that are used to rotate a gear, and they were fabricated using electroplated Ni, p/sup ++/Si, and polysilicon as structural materials.
Abstract: For Part I see L. Que, J.S. Park and Y.B. Gianchandani, ibid., vol.10, pp.247-54 (2001). This paper reports on the use of bent-beam electrothermal actuators for the purpose of generating rotary and long-throw rectilinear displacements. The rotary displacements are achieved by orthogonally arranged pairs of cascaded actuators that are used to rotate a gear. Devices were fabricated using electroplated Ni, p/sup ++/ Si, and polysilicon as structural materials. Displacements of 20-30 /spl mu/m with loading forces >150 /spl mu/N at actuation voltages 200 /spl mu/N at displacements >100 /spl mu/m were measured.

168 citations

Journal ArticleDOI
TL;DR: In this paper, the authors address a range of issues on modeling electrothermal microactuators, including the physics of temperature dependent material properties and Finite Element Analysis (FEA) modeling techniques.
Abstract: This work addresses a range of issues on modeling electrothermal microactuators, including the physics of temperature dependent material properties and Finite Element Analysis (FEA) modeling techniques. Electrical and thermal conductivity are a nonlinear function of temperature that can be explained with electron and phonon transport models, respectively. Parametric forms of these equations are developed for polysilicon and a technique to extract these parameters from experimental data is given. A modeling technique to capture the convective and conductive cooling effects on a thermal actuator in air is then presented. Using this modeling technique and the established polysilicon material properties, simulation results are compared with measured actuator responses. Both static and transient analyzes have been performed on two styles of actuators and the results compare well with measured data.

156 citations