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Abdelillah Abed Belarbi

Bio: Abdelillah Abed Belarbi is an academic researcher. The author has contributed to research in topics: Electronics cooling & Thermal energy. The author has an hindex of 2, co-authored 3 publications receiving 10 citations.

Papers
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Journal ArticleDOI
TL;DR: In this article, experimental investigation of thermal and aerodynamic performances of a rectangular mini-channel heat sink subjected to an impinging air jet was carried out with the aim of improving the cooling performance of personal computer CPUs.
Abstract: Received: 20 July 2018 Accepted: 24 December 2018 In this study, experimental investigation of thermal and aerodynamic performances of a rectangular mini-channel heat sink subjected to an impinging air jet was carried out with the aim to improve the cooling performance of personal computer CPUs. The influence of the impinging distance on the velocity profile, the pressure drop, the case temperature, the thermal resistance, and the heat transfer coefficient are studied. Moreover, the effect of the positioning of the microprocessor (heat source) on the thermal performance was investigated. The results show a ratio \"height jet/diameter\" Y/D=0.606 offer a better cooling, and a longitudinal displacement of the heat source (central processor unit) 10 mm from the original position (center) improve the cooling performance. The enhancement rate was in a range of 10% compared to the initial position (central position before shifting the source).

9 citations

Book ChapterDOI
01 Jan 2020
TL;DR: In this paper, experiments are performed to investigate the coupling of thermoelectric module and rectangular fin heat sink subjected to an impacting air jet for cooling desktop micro-processors.
Abstract: In this study, experiments are performed to investigate the coupling of thermoelectric module and rectangular fin heat sink subjected to an impacting air jet for cooling desktop microprocessors. A controlled thermoelectric test system was conceived and performed for this purpose. The control of the thermoelectric forced air combined cooling system was designed on the basis of electronic Arduino card. The proposed thermoelectric forced convection cooling combined system was compared with the conventional forced air cooling technique. Three electrical powers for the heat source (CPU) were adopted and compared in this experimental study: 60, 87 and 95 W. Performance of thermoelectric cooling module with three preset temperature was experimentally investigated below diverse working conditions. Effects of thermoelectric input current and air jet velocity on the case temperature (Tcase) were analysed. The thermoelectric cooler had a considerable effect on the cooling of the CPU. However, the consumption of the energy was also augmented. Experimental results indicated that the cooling effect improved with increasing of thermoelectric operating current. However, Temperature of the heat source increased with high power input of the CPU. For a power input of 95 W of the CPU, the Tcase was maintained under 50 °C with thermoelectric input power of 45 and 5.8 W for the fan, giving improvement around 15% comparing to conventional forced air cooling.

Cited by
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Journal ArticleDOI
29 Oct 2021
TL;DR: In this paper, the state-of-the-art in electronic cooling, classified into direct and indirect cooling, are reviewed and discussed in detail, along with the pros and cons of these thermal management methods.
Abstract: The cooling or thermal management issues are facing critical challenges with the continuous miniaturization and rapid increase of heat flux of electronic devices. Significant efforts have been made to develop high-efficient cooling and flexible thermal management solutions and corresponding design tools. This article reviews the latest progress and the state-of-the-art in electronic cooling, which could help inspire future research. The commonly used methods in electronic cooling, classified into direct and indirect cooling, are reviewed and discussed in detail. Direct cooling consists of air cooling, spray and jet impingement cooling, immersion cooling, and droplet electrowetting. As for indirect cooling, the most popular and hot topics of using microchannel, heat pipe, vapour chamber, thermoelectric, and PCM are overviewed. The effectiveness of the thermal management methods for different-level requirements of electronic cooling and the ways how heat transfer capability can be improved are also introduced in detail. Meanwhile, the pros and cons of these thermal management methods are discussed based on their inherent heat transfer performances/characteristics, optimisation methods, and relevant applications. In addition, the current challenges of electronic cooling and thermal management technologies are explored, along with the outlook of possible future advances.

17 citations

Journal ArticleDOI
TL;DR: In this paper, the authors used an impingement jet technique for attaining high convective heat transfer coefficients and increasing the heat transfer from cooling surfaces, which can be used to solve increased thermal load problem of the electronic equipments such as microchips.
Abstract: Impinging jet is a method for attaining high convective heat transfer coefficients and so increasing the heat transfer from cooling surfaces. In this work, improvement in the heat transfer from copper plate patterned surfaces having high heat flux depending on developing technologies in order to solve increased thermal load problem of the electronic equipments such as microchips are numerically examined by using an impingement jet technique. Five different patterned surfaces as reverse and straight circles are placed inside rectangular channels consisting of one open and three blocked sides. Governing 3D Navier–Stokes and energy equations as steady are solved by using Ansys Fluent software program with k-e turbulence model. Air used as jet fluid has 300-K inlet temperature. A constant heat flux of 1000 W/m2 is implemented to the patterned surfaces while top and side surfaces are adiabatic. The study is conformed for different Re numbers ranging from 4000 to 10000 and different jet-to-plate distances (H/Dh) from 4 to 12 for two different surface configurations. The numerical results are agreed well with numerical and experimental studies existed in the literature. The results are presented as mean Nu numbers and surface temperature variations for each of the analyzed patterned surfaces. The velocity and temperature contours and jet flow streamline distributions are assessed for different Re numbers and H/Dh ratios. For Re = 10000 and H/Dh = 12, the mean Nu number value on the straight-circle-patterned surfaces is 24.13% higher than that of the reverse-circle-patterned.

10 citations

Journal ArticleDOI
TL;DR: In this paper, an innovative arrangement based on wire-to-plane fins by direct current (DC) positive corona discharge in atmospheric air for applications was analyzed, where the multicriteria geometry of the electrodes was optimized to improve heat exchange.
Abstract: Electro-fluid-dynamic cooling devices (EFAs) are being recognized due to their enormous advantages for their application in several industrial sectors, their performance benefits from generated ionic winds and their singular features, which make them competitive with conventional fans and heatsinks. Due to the problems in the electronics industry, where traditional refrigeration systems are not effective due to their dimensions, this study analyzes an innovative arrangement based on wire-to-plane fins by direct current (DC) positive corona discharge in atmospheric air for applications. The paper focuses on optimizing the multicriteria geometry of the electrodes. Several parameters are analyzed such as the gap between emitter and ground electrodes, the electrode materials and geometry, the diameter of the high-voltage electrode and the influence of the dielectric barriers located near the corona electrode to improve heat exchange. Experimental validation shows the potential of this arrangement related to weight, volume, non-mobile parts and silence.

8 citations

Journal ArticleDOI
TL;DR: In this article , the effect of heat transfer rate on the performance of TEGs under both steady and transient conditions was analyzed using a liquid saturated porous medium, and the experimental results showed that power generated with Cu particles exceeds that of Al particles with 14%.
Abstract: Low-temperature heat sources are widely available in nature, they are considered to be unusable, even though the conversion of such low-grade energy into electricity (high-grade energy) is highly desirable. Thermoelectric generators (TEGs) are achieving increasing interest in converting low temperature heat into electricity. TEG suffers from low performance, improving the performance of TEG will allow there use in huge engineering applications. In this paper the effect of heat transfer rate on the performance of TEGs will be analysed under both steady and transient conditions. Enhancing heat transfer from the TEG surface will be studied using a liquid saturated porous medium. Aluminium and copper particles are used and their influences are compared to forced convection heat transfer from TEG surfaces with and without liquids. The experimental results showed that power generated with Cu particles exceeds that of Al particles with 14%. The free to forced convection power generation ratio was 26.5% for Al,36% for Cu and the enhancement of TEG performance reached 149% for liquid saturated Cu particles.

7 citations