Ahmad Badri Ismail

Bio: Ahmad Badri Ismail is an academic researcher from Universiti Sains Malaysia. The author has contributed to research in topics: Soldering & Welding. The author has an hindex of 14, co-authored 36 publications receiving 1010 citations.

A Review on Die Attach Materials for SiC-Based High-Temperature Power Devices

Abstract: Recently, high-temperature power devices have become a popular discussion topic because of their various potential applications in the automotive, down-hole oil and gas industries for well logging, aircraft, space exploration, nuclear environments, and radars. Devices for these applications are fabricated on silicon carbide-based semiconductor material. For these devices to perform effectively, an appropriate die attach material with specific requirements must be selected and employed correctly. This article presents a review of this topic, with a focus on the die attach materials operating at temperatures higher than 623 K (350 °C). Future challenges and prospects related to high-temperature die attach materials also are proposed at the end of this article.

Advances in friction welding process: a review

Abstract: Friction welding is now well established as one of the most economical and highly productive methods in joining similar and dissimilar metals. It is widely used in automotive and aerospace industrial applications. Friction welding is often the only viable alternative in this field to overcome the difficulties encountered in joining the materials with widely varying physical characteristics. This process employs a machine that is designed to convert mechanical energy into heat at the joint to weld using relative movement between workpieces, without the use of electrical energy or heat from other sources. This review deals with the fundamental understanding of the process. The focus is on the mechanism of friction welding, types of relative motions of the process, influence of parameters, heat generation in the process, understanding the deformation, microstructure and the properties of similar and dissimilar welded materials.

Joining of dissimilar materials

Abstract: Emerging trends in manufacturing such as light weighting, increased performance and functionality increases the use of multi-material, hybrid structures and thus the need for joining of dissimilar materials. The properties of the different materials are jointly utilised to achieve product performance. The joining processes can, on the other hand be challenging due to the same different properties. This paper reviews and summarizes state of the art research in joining dissimilar materials. Current and emerging joining technologies are reviewed according to the mechanisms of joint formation, i.e.; mechanical, chemical, thermal, or hybrid processes. Methods for process selection are described and future challenges for research on joining dissimilar materials are summarized.

Survey of High-Temperature Reliability of Power Electronics Packaging Components

Abstract: In order to take the full advantage of the high-temperature SiC and GaN operating devices, package materials able to withstand high-temperature storage and large thermal cycles have been investigated. The temperature under consideration here are higher than 200 °C. Such temperatures are required for several potential applications such as down-hole oil and gas industry for well logging, aircrafts, automotive, and space exploration. This review focuses on the reliability of a selection of potential components or materials used in the package assembly as the substrates, the die attaches, the interconnections, and the encapsulation materials. It reveals that, substrates with low coefficient of thermal expansion (CTE) conductors or with higher fracture resistant ceramics are potential candidates for high temperatures. Die attaches and interconnections reliable solutions are also available with the use of compatible metallization schemes. At this level, the reliability can also be improved by reducing the CTE mismatch between assembled materials. The encapsulation remains the most limiting packaging component since hard materials present thermomechanical reliability issues, while soft materials have low degradation temperatures. The review allows identifying reliable components and materials for high-temperature wide bandgap semiconductors and is expected to be very useful for researchers working for the development on high-temperature electronics.