Many of the recent advances in enhancing the thermoelectric figure of merit are linked to nanoscale phenomena found both in bulk samples containing nanoscale constituents and in nanoscale samples themselves. Prior theoretical and experimental proof-of-principle studies on quantum-well superlattice and quantum-wire samples have now evolved into studies on bulk samples containing nanostructured constituents prepared by chemical or physical approaches. In this Review, nanostructural composites are shown to exhibit nanostructures and properties that show promise for thermoelectric applications, thus bringing together low-dimensional and bulk materials for thermoelectric applications. Particular emphasis is given in this Review to the ability to achieve 1) a simultaneous increase in the power factor and a decrease in the thermal conductivity in the same nanocomposite sample and for transport in the same direction and 2) lower values of the thermal conductivity in these nanocomposites as compared to alloy samples of the same chemical composition. The outlook for future research directions for nanocomposite thermoelectric materials is also discussed.

https://www.bc.edu/content/dam/files/schools/cas_sites/physics/pdf/Ren/AdvMater_19_1043_2007.pdf

New Directions for Low-Dimensional Thermoelectric Materials**

Part I: Background and Fundamentals Introduction, Mohamed Gad-el-Hak, University of Notre Dame Scaling of Micromechanical Devices, William Trimmer, Standard MEMS, Inc., and Robert H. Stroud, Aerospace Corporation Mechanical Properties of MEMS Materials, William N. Sharpe, Jr., Johns Hopkins University Flow Physics, Mohamed Gad-el-Hak, University of Notre Dame Integrated Simulation for MEMS: Coupling Flow-Structure-Thermal-Electrical Domains, Robert M. Kirby and George Em Karniadakis, Brown University, and Oleg Mikulchenko and Kartikeya Mayaram, Oregon State University Liquid Flows in Microchannels, Kendra V. Sharp and Ronald J. Adrian, University of Illinois at Urbana-Champaign, Juan G. Santiago and Joshua I. Molho, Stanford University Burnett Simulations of Flows in Microdevices, Ramesh K. Agarwal and Keon-Young Yun, Wichita State University Molecular-Based Microfluidic Simulation Models, Ali Beskok, Texas A&M University Lubrication in MEMS, Kenneth S. Breuer, Brown University Physics of Thin Liquid Films, Alexander Oron, Technion, Israel Bubble/Drop Transport in Microchannels, Hsueh-Chia Chang, University of Notre Dame Fundamentals of Control Theory, Bill Goodwine, University of Notre Dame Model-Based Flow Control for Distributed Architectures, Thomas R. Bewley, University of California, San Diego Soft Computing in Control, Mihir Sen and Bill Goodwine, University of Notre Dame Part II: Design and Fabrication Materials for Microelectromechanical Systems Christian A. Zorman and Mehran Mehregany, Case Western Reserve University MEMS Fabrication, Marc J. Madou, Nanogen, Inc. LIGA and Other Replication Techniques, Marc J. Madou, Nanogen, Inc. X-Ray-Based Fabrication, Todd Christenson, Sandia National Laboratories Electrochemical Fabrication (EFAB), Adam L. Cohen, MEMGen Corporation Fabrication and Characterization of Single-Crystal Silicon Carbide MEMS, Robert S. Okojie, NASA Glenn Research Center Deep Reactive Ion Etching for Bulk Micromachining of Silicon Carbide, Glenn M. Beheim, NASA Glenn Research Center Microfabricated Chemical Sensors for Aerospace Applications, Gary W. Hunter, NASA Glenn Research Center, Chung-Chiun Liu, Case Western Reserve University, and Darby B. Makel, Makel Engineering, Inc. Packaging of Harsh-Environment MEMS Devices, Liang-Yu Chen and Jih-Fen Lei, NASA Glenn Research Center Part III: Applications of MEMS Inertial Sensors, Paul L. Bergstrom, Michigan Technological University, and Gary G. Li, OMM, Inc. Micromachined Pressure Sensors, Jae-Sung Park, Chester Wilson, and Yogesh B. Gianchandani, University of Wisconsin-Madison Sensors and Actuators for Turbulent Flows. Lennart Loefdahl, Chalmers University of Technology, and Mohamed Gad-el-Hak, University of Notre Dame Surface-Micromachined Mechanisms, Andrew D. Oliver and David W. Plummer, Sandia National Laboratories Microrobotics Thorbjoern Ebefors and Goeran Stemme, Royal Institute of Technology, Sweden Microscale Vacuum Pumps, E. Phillip Muntz, University of Southern California, and Stephen E. Vargo, SiWave, Inc. Microdroplet Generators. Fan-Gang Tseng, National Tsing Hua University, Taiwan Micro Heat Pipes and Micro Heat Spreaders, G. P. "Bud" Peterson, Rensselaer Polytechnic Institute Microchannel Heat Sinks, Yitshak Zohar, Hong Kong University of Science and Technology Flow Control, Mohamed Gad-el-Hak, University of Notre Dame) Part IV: The Future Reactive Control for Skin-Friction Reduction, Haecheon Choi, Seoul National University Towards MEMS Autonomous Control of Free-Shear Flows, Ahmed Naguib, Michigan State University Fabrication Technologies for Nanoelectromechanical Systems, Gary H. Bernstein, Holly V. Goodson, and Gregory L. Snider, University of Notre Dame Index

The MEMS Handbook

A colloidal mixture of nano-sized particles in a base fluid, called nanofluids, tremendously enhances the heat transfer characteristics of the original fluid, and is ideally suited for practical applications due to its marvelous characteristics. This article addresses the unique features of nanofluids, such as enhancement of heat transfer, improvement in thermal conductivity, increase in surface volume ratio, Brownian motion, thermophoresis, etc. In addition, the article summarizes the recent research in experimental and theoretical studies on forced and free convective heat transfer in nanofluids, their thermo-physical properties and their applications, and identifies the challenges and opportunities for future research.

Enhancement of heat transfer using nanofluids—An overview

Cooling of photovoltaic cells under concentrated illumination: a critical review

Light emitting diodes reliability review

Preface. Contributors. 1. Basic Concepts (Allan D. Kraus). 2. Thermophysical Properties of Fluids and Materials (R. T Jacobsen, E. W. Lemmon, S. G. Penoncello, Z. Shan, and N. T. Wright). 3. Conduction Heat Transfer (A. Aziz). 4. Thermal Spreading and Contact Resistances (M. M. Yovanovich and E. E. Marotta). 5. Forced Convection: Internal Flows (Adrian Bejan). 6. Forced Convection: External Flows (Yogendra Joshi and Wataru Nakayama). 7. Natural Convection (Yogesh Jaluria). 8. Thermal Radiation (Michael F. Modest). 9. Boiling (John R. Thome). 10. Condensation (M. A. Kedzierski, J. C. Chato, and T. J. Rabas). 11. Heat Exchangers (Allan D. Kraus). 12. Experimental Methods (Jose L. Lage). 13. Heat Transfer in Electronic Equipment (Avram Bar-Cohen, Abhay A. Watwe, and Ravi S. Prasher). 14. Heat Transfer Enhancement (R. M. Manglik). 15. Porous Media (Adrian Bejan). 16. Heat Pipes (Jay M. Ochterbeck). 17. Heat Transfer in Manufacturing and Materials Processing (Richard N. Smith, C. Haris Doumanidis, and Ranga Pitchumani). 18. Microscale Heat Transfer (Andrew N. Smith and Pamela M. Norris). 19. Direct Contact Heat Transfer (Robert F. Boehm). Author Index. Subject Index. About the CD-ROM.

Heat transfer handbook

Preface. Convection with Simplified Constraints. Convection with Real Constraints. Convective Optimizations. Convection Coefficients. Linear Transformations. Elements of Linear Transformations. Algorithms for Finned Array Assembly. Advanced Array Methods and Array Optimization. Finned Passages. Compact Heat Exchangers. Longitudinal Fin Double-Pipe Exchangers. Transverse High-Fin Exchangers. Fins with Radiation. Optimum Design of Radiating and Convecting-Radiating Fins. Multidimensional Heat Transfer in Fins and Fin Assemblies. Transient Heat Transfer in Extended Surfaces. Periodic Heat Flow in Fins. Boiling From Finned Surfaces. Condensation on Finned Surfaces. Augmentation and Additional Studies. Appendix A: Gamma and Bessel Functions. Appendix B: Matrices and Determinants. References. Author Index. Subject Index.

Extended surface heat transfer

Thermal analysis and control of electronic equipment , Thermal analysis and control of electronic equipment , مرکز فناوری اطلاعات و اطلاع رسانی کشاورزی

Thermal Analysis and Control of Electronic Equipment

This volume opens with a sweeping overview of the physical design of electronic systems-methodology, technology, and future challenges-thermally induced failures in electronic systems. Subsequent chapters examine the causes for thermally induced failures of electronic components and the techniques used to analyze and prevent such failures. It gives a comprehensive bibliograhy of project managers and lead engineers, packaging engineers and mechanical analysts, consultants, and academic, industrial, and government laboratory researchers.

Advances in Thermal Modeling of Electronic Components and Systems. Volume 1

Linear Transformations. Elements of the Linear Transformations. Singular Fins and Spines and Single Elements. Algorithms for Finned Array Assembly. Examples of Finned Array Analysis. Reciprocity and Node Analysis. A General Array Method. Convective Optimizations. Heat Transfer-Parallel Plate Heat Sinks. References. Appendices. Indexes.

Allan D. Kraus

Papers

Heat transfer handbook

Extended surface heat transfer

Thermal Analysis and Control of Electronic Equipment

Advances in Thermal Modeling of Electronic Components and Systems. Volume 1

Design and analysis of heat sinks