Many of the recent advances in enhancing the thermoelectric figure of merit are linked to nanoscale phenomena found both in bulk samples containing nanoscale constituents and in nanoscale samples themselves. Prior theoretical and experimental proof-of-principle studies on quantum-well superlattice and quantum-wire samples have now evolved into studies on bulk samples containing nanostructured constituents prepared by chemical or physical approaches. In this Review, nanostructural composites are shown to exhibit nanostructures and properties that show promise for thermoelectric applications, thus bringing together low-dimensional and bulk materials for thermoelectric applications. Particular emphasis is given in this Review to the ability to achieve 1) a simultaneous increase in the power factor and a decrease in the thermal conductivity in the same nanocomposite sample and for transport in the same direction and 2) lower values of the thermal conductivity in these nanocomposites as compared to alloy samples of the same chemical composition. The outlook for future research directions for nanocomposite thermoelectric materials is also discussed.

https://www.bc.edu/content/dam/files/schools/cas_sites/physics/pdf/Ren/AdvMater_19_1043_2007.pdf

New Directions for Low-Dimensional Thermoelectric Materials**

Part I: Background and Fundamentals Introduction, Mohamed Gad-el-Hak, University of Notre Dame Scaling of Micromechanical Devices, William Trimmer, Standard MEMS, Inc., and Robert H. Stroud, Aerospace Corporation Mechanical Properties of MEMS Materials, William N. Sharpe, Jr., Johns Hopkins University Flow Physics, Mohamed Gad-el-Hak, University of Notre Dame Integrated Simulation for MEMS: Coupling Flow-Structure-Thermal-Electrical Domains, Robert M. Kirby and George Em Karniadakis, Brown University, and Oleg Mikulchenko and Kartikeya Mayaram, Oregon State University Liquid Flows in Microchannels, Kendra V. Sharp and Ronald J. Adrian, University of Illinois at Urbana-Champaign, Juan G. Santiago and Joshua I. Molho, Stanford University Burnett Simulations of Flows in Microdevices, Ramesh K. Agarwal and Keon-Young Yun, Wichita State University Molecular-Based Microfluidic Simulation Models, Ali Beskok, Texas A&M University Lubrication in MEMS, Kenneth S. Breuer, Brown University Physics of Thin Liquid Films, Alexander Oron, Technion, Israel Bubble/Drop Transport in Microchannels, Hsueh-Chia Chang, University of Notre Dame Fundamentals of Control Theory, Bill Goodwine, University of Notre Dame Model-Based Flow Control for Distributed Architectures, Thomas R. Bewley, University of California, San Diego Soft Computing in Control, Mihir Sen and Bill Goodwine, University of Notre Dame Part II: Design and Fabrication Materials for Microelectromechanical Systems Christian A. Zorman and Mehran Mehregany, Case Western Reserve University MEMS Fabrication, Marc J. Madou, Nanogen, Inc. LIGA and Other Replication Techniques, Marc J. Madou, Nanogen, Inc. X-Ray-Based Fabrication, Todd Christenson, Sandia National Laboratories Electrochemical Fabrication (EFAB), Adam L. Cohen, MEMGen Corporation Fabrication and Characterization of Single-Crystal Silicon Carbide MEMS, Robert S. Okojie, NASA Glenn Research Center Deep Reactive Ion Etching for Bulk Micromachining of Silicon Carbide, Glenn M. Beheim, NASA Glenn Research Center Microfabricated Chemical Sensors for Aerospace Applications, Gary W. Hunter, NASA Glenn Research Center, Chung-Chiun Liu, Case Western Reserve University, and Darby B. Makel, Makel Engineering, Inc. Packaging of Harsh-Environment MEMS Devices, Liang-Yu Chen and Jih-Fen Lei, NASA Glenn Research Center Part III: Applications of MEMS Inertial Sensors, Paul L. Bergstrom, Michigan Technological University, and Gary G. Li, OMM, Inc. Micromachined Pressure Sensors, Jae-Sung Park, Chester Wilson, and Yogesh B. Gianchandani, University of Wisconsin-Madison Sensors and Actuators for Turbulent Flows. Lennart Loefdahl, Chalmers University of Technology, and Mohamed Gad-el-Hak, University of Notre Dame Surface-Micromachined Mechanisms, Andrew D. Oliver and David W. Plummer, Sandia National Laboratories Microrobotics Thorbjoern Ebefors and Goeran Stemme, Royal Institute of Technology, Sweden Microscale Vacuum Pumps, E. Phillip Muntz, University of Southern California, and Stephen E. Vargo, SiWave, Inc. Microdroplet Generators. Fan-Gang Tseng, National Tsing Hua University, Taiwan Micro Heat Pipes and Micro Heat Spreaders, G. P. "Bud" Peterson, Rensselaer Polytechnic Institute Microchannel Heat Sinks, Yitshak Zohar, Hong Kong University of Science and Technology Flow Control, Mohamed Gad-el-Hak, University of Notre Dame) Part IV: The Future Reactive Control for Skin-Friction Reduction, Haecheon Choi, Seoul National University Towards MEMS Autonomous Control of Free-Shear Flows, Ahmed Naguib, Michigan State University Fabrication Technologies for Nanoelectromechanical Systems, Gary H. Bernstein, Holly V. Goodson, and Gregory L. Snider, University of Notre Dame Index

The MEMS Handbook

A colloidal mixture of nano-sized particles in a base fluid, called nanofluids, tremendously enhances the heat transfer characteristics of the original fluid, and is ideally suited for practical applications due to its marvelous characteristics. This article addresses the unique features of nanofluids, such as enhancement of heat transfer, improvement in thermal conductivity, increase in surface volume ratio, Brownian motion, thermophoresis, etc. In addition, the article summarizes the recent research in experimental and theoretical studies on forced and free convective heat transfer in nanofluids, their thermo-physical properties and their applications, and identifies the challenges and opportunities for future research.

Enhancement of heat transfer using nanofluids—An overview

Cooling of photovoltaic cells under concentrated illumination: a critical review

Light emitting diodes reliability review

The challenges posed by high chip heat fluxes and ever more stringent performance and reliability constraints make thermal management a key enabling technology in the development of microelectronic systems for the twenty-first century. Thus, thermal packaging efforts must be performed in the context of the salient trends and parameters that characterize the IC technology and the electronic products industry.



Recent road-mapping efforts, have affirmed the expectation that improvements in CMOS semiconductor technology will continue unabated into the early part of the twenty-first century. Exploiting the potential of this IC technology, with the attendant increase in chip size, switching speed, and transistor density, will necessitate significant improvements in packaging technology.


Keywords:

thermal management;
thermal packaging;
thermal modeling;
thermal resistance networks;
convection

Thermal Analysis and Design of Electronic Systems

Analysis of Heat Loadings in the Forced Cooled Electronic Chassis or Cold Plate

The Case for the Elliptical Spine

14.1 Motivation 14-1 Thermal Packaging Options 14.2 Thermal Modeling 14-4 Conduction Heat Transfer • Convective Heat Transfer • Phase Change Heat Transfer • Flow Resistance • Radiative Heat Transfer • Environmental Heat Transfer 14.3 Thermal Resistance Networks 14-20 Chip Module Thermal Resistance • Multichip Modules • Radar System Applications

Allan D. Kraus

Papers

Thermal Analysis and Design of Electronic Systems

Analysis of Heat Loadings in the Forced Cooled Electronic Chassis or Cold Plate

The Case for the Elliptical Spine

Thermal analysis and design of electronic systems