Author
Arif Sanli Ergun
Other affiliations: Princeton University, Stanford University, Bilkent University ...read more
Bio: Arif Sanli Ergun is an academic researcher from TOBB University of Economics and Technology. The author has contributed to research in topics: Capacitive micromachined ultrasonic transducers & Ultrasonic sensor. The author has an hindex of 33, co-authored 80 publications receiving 3713 citations. Previous affiliations of Arif Sanli Ergun include Princeton University & Stanford University.
Papers published on a yearly basis
Papers
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TL;DR: The first pulse-echo phased array B-scan sector images using a 128-element, one-dimensional (1-D) linear CMUT array is presented and preliminary investigations on the effects of crosstalk among array elements on the image quality are performed.
Abstract: Piezoelectric materials have dominated the ultrasonic transducer technology. Recently, capacitive micromachined ultrasonic transducers (CMUTs) have emerged as an alternative technology offering advantages such as wide bandwidth, ease of fabricating large arrays, and potential for integration with electronics. The aim of this paper is to demonstrate the viability of CMUTs for ultrasound imaging. We present the first pulse-echo phased array B-scan sector images using a 128-element, one-dimensional (1-D) linear CMUT array. We fabricated 64- and 128-element 1-D CMUT arrays with 100% yield and uniform element response across the arrays. These arrays have been operated in immersion with no failure or degradation in performance over the time. For imaging experiments, we built a resolution test phantom roughly mimicking the attenuation properties of soft tissue. We used a PC-based experimental system, including custom-designed electronic circuits to acquire the complete set of 128/spl times/128 RF A-scans from all transmit-receive element combinations. We obtained the pulse-echo frequency response by analyzing the echo signals from wire targets. These echo signals presented an 80% fractional bandwidth around 3 MHz, including the effect of attenuation in the propagating medium. We reconstructed the B-scan images with a sector angle of 90 degrees and an image depth of 210 mm through offline processing by using RF beamforming and synthetic phased array approaches. The measured 6-dB lateral and axial resolutions at 135 mm depth were 0.0144 radians and 0.3 mm, respectively. The electronic noise floor of the image was more than 50 dB below the maximum mainlobe magnitude. We also performed preliminary investigations on the effects of crosstalk among array elements on the image quality. In the near field, some artifacts were observable extending out from the array to a depth of 2 cm. A tail also was observed in the point spread function (PSF) in the axial direction, indicating the existence of crosstalk. The relative amplitude of this tail with respect to the mainlobe was less than -20 dB.
508 citations
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TL;DR: In this paper, a new method for fabricating capacitive micromachined ultrasonic transducers (CMUTs) that uses a wafer bonding technique is introduced. But the method is not suitable for large CMUTs.
Abstract: Introduces a new method for fabricating capacitive micromachined ultrasonic transducers (CMUTs) that uses a wafer bonding technique. The transducer membrane and cavity are defined on an SOI (silicon-on-insulator) wafer and on a prime wafer, respectively. Then, using silicon direct bonding in a vacuum environment, the two wafers are bonded together to form a transducer. This new technique, capable of fabricating large CMUTs, offers advantages over the traditionally micromachined CMUTs. First, forming a vacuum-sealed cavity is relatively easy since the wafer bonding is performed in a vacuum chamber. Second, this process enables better control over the gap height, making it possible to fabricate very small gaps (less than 0.1 /spl mu/m). Third, since the membrane is made of single crystal silicon, it is possible to predict and control the mechanical properties of the membrane to within 5%. Finally, the number of process steps involved in making a CMUT has been reduced from 22 to 15, shortening the device turn-around time. All of these advantages provide repeatable fabrication of CMUTs featuring predictable center frequency, bandwidth, and collapse voltage.
312 citations
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TL;DR: Combining the transducers array and IC allows for better utilization of large arrays, improves receive sensitivity, and may lead to new imaging techniques that depend on transducer arrays that are closely coupled to IC electronics.
Abstract: For three-dimensional (3D) ultrasound imaging, connecting elements of a two-dimensional (2D) transducer array to the imaging system's front-end electronics is a challenge because of the large number of array elements and the small element size. To compactly connect the transducer array with electronics, we flip-chip bond a 2D 16 times 16-element capacitive micromachined ultrasonic transducer (CMUT) array to a custom-designed integrated circuit (IC). Through-wafer interconnects are used to connect the CMUT elements on the top side of the array with flip-chip bond pads on the back side. The IC provides a 25-V pulser and a transimpedance preamplifier to each element of the array. For each of three characterized devices, the element yield is excellent (99 to 100% of the elements are functional). Center frequencies range from 2.6 MHz to 5.1 MHz. For pulse-echo operation, the average -6-dB fractional bandwidth is as high as 125%. Transmit pressures normalized to the face of the transducer are as high as 339 kPa and input-referred receiver noise is typically 1.2 to 2.1 rnPa/ radicHz. The flip-chip bonded devices were used to acquire 3D synthetic aperture images of a wire-target phantom. Combining the transducer array and IC, as shown in this paper, allows for better utilization of large arrays, improves receive sensitivity, and may lead to new imaging techniques that depend on transducer arrays that are closely coupled to IC electronics.
270 citations
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TL;DR: In this article, the authors discuss the principles of capacitive transducer operation that underlie these aspects and demonstrate the feasibility of using CMUTs by showing imaging examples in air and in immersion.
Abstract: Capacitive micromachined ultrasonic transducers ~CMUTs!, introduced about a decade ago, have been shown to be a good alternative to conventional piezoelectric transducers in various aspects, such as sensitivity, transduction efficiency, and bandwidth. In this paper, we discuss the principles of capacitive transducer operation that underlie these aspects. Many of the key features of capacitive ultrasonic transducers are enabled with micromachining technology. Micromachining allows us to miniaturize device dimensions and produce capacitive transducers that perform comparably to their piezoelectric counterparts. The fabrication process is described briefly, and the performance of the CMUT transducers is evaluated by demonstrating characterization results. It is shown that the transduction efficiency as defined by the electromechanical coupling coefficient can be close to unity with proper device design and operating voltage. It is also shown that CMUTs provide large bandwidth ~123% fractional bandwidth! in immersion applications which translate into high temporal and axial resolution. Finally, the feasibility of using CMUTs is demonstrated by showing imaging examples in air and in immersion.
255 citations
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TL;DR: The finite element method (FEM) is used for the calculation and measurement of coupling coefficient for capacitive micromachined ultrasonic transducers (CMUTs) and indicates that the electromechanical coupling coefficient is independent of any series capacitance that may exist in the structure.
Abstract: The electromechanical coupling coefficient is an important figure of merit of ultrasonic transducers. The transducer bandwidth is determined by the electromechanical coupling efficiency. The coupling coefficient is, by definition, the ratio of delivered mechanical energy to the stored total energy in the transducer. In this paper, we present the calculation and measurement of coupling coefficient for capacitive micromachined ultrasonic transducers (CMUTs). The finite element method (FEM) is used for our calculations, and the FEM results are compared with the analytical results obtained with parallel plate approximation. The effect of series and parallel capacitances in the CMUT also is investigated. The FEM calculations of the CMUT indicate that the electromechanical coupling coefficient is independent of any series capacitance that may exist in the structure. The series capacitance, however, alters the collapse voltage of the membrane. The parallel parasitic capacitance that may exist in a CMUT or is external to the transducer reduces the coupling coefficient at a given bias voltage. At the collapse, regardless of the parasitics, the coupling coefficient reaches unity. Our experimental measurements confirm a coupling coefficient of 0.85 before collapse, and measurements are in agreement with theory.
225 citations
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TL;DR: There is, I think, something ethereal about i —the square root of minus one, which seems an odd beast at that time—an intruder hovering on the edge of reality.
Abstract: There is, I think, something ethereal about i —the square root of minus one. I remember first hearing about it at school. It seemed an odd beast at that time—an intruder hovering on the edge of reality.
Usually familiarity dulls this sense of the bizarre, but in the case of i it was the reverse: over the years the sense of its surreal nature intensified. It seemed that it was impossible to write mathematics that described the real world in …
33,785 citations
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01 Aug 2008
TL;DR: In this article, the oxide semiconductor film has at least a crystallized region in a channel region, which is defined as a region of interest (ROI) for a semiconductor device.
Abstract: An object is to provide a semiconductor device of which a manufacturing process is not complicated and by which cost can be suppressed, by forming a thin film transistor using an oxide semiconductor film typified by zinc oxide, and a manufacturing method thereof. For the semiconductor device, a gate electrode is formed over a substrate; a gate insulating film is formed covering the gate electrode; an oxide semiconductor film is formed over the gate insulating film; and a first conductive film and a second conductive film are formed over the oxide semiconductor film. The oxide semiconductor film has at least a crystallized region in a channel region.
1,501 citations
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TL;DR: In this article, the use of acoustic fields, principally ultrasonics, for application in microfluidics is reviewed, and the abundance of interesting phenomena arising from nonlinear interactions in ultrasound that easily appear at these small scales is considered, especially in surface acoustic wave devices that are simple to fabricate with planar lithography techniques.
Abstract: This article reviews acoustic microfiuidics: the use of acoustic fields, principally ultrasonics, for application in microfiuidics. Although acoustics is a classical field, its promising, and indeed perplexing, capabilities in powerfully manipulating both fluids and particles within those fluids on the microscale to nanoscale has revived interest in it. The bewildering state of the literature and ample jargon from decades of research is reorganized and presented in the context of models derived from first principles. This hopefully will make the area accessible for researchers with experience in materials science, fluid mechanics, or dynamics. The abundance of interesting phenomena arising from nonlinear interactions in ultrasound that easily appear at these small scales is considered, especially in surface acoustic wave devices that are simple to fabricate with planar lithography techniques common in microfluidics, along with the many applications in microfluidics and nanofluidics that appear through the literature.
975 citations
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TL;DR: The use of ultrasonic arrays for non-destructive evaluation has been extensively studied in the literature as mentioned in this paper, where the main advantages of arrays are their increased flexibility over traditional single element transducers, and their ability to produce immediate images of the test structure.
Abstract: An ultrasonic array is a single transducer that contains a number of individually connected elements. Recent years have seen a dramatic increase in the use of ultrasonic arrays for non-destructive evaluation. Arrays offer great potential to increase inspection quality and reduce inspection time. Their main advantages are their increased flexibility over traditional single element transducer methods, meaning that one array can be used to perform a number of different inspections, and their ability to produce immediate images of the test structure. These advantages have led to the rapid uptake of arrays by the engineering industry. These industrial applications are underpinned by a wide range of published research which describes new piezoelectric materials, array geometries, modelling methods and inspection modalities. The aim of this paper is to bring together the most relevant published work on arrays for non-destructive evaluation applications, comment on the state-of the art and discuss future directions. There is also a significant body of published literature referring to use of arrays in the medical and sonar fields and the most relevant papers from these related areas are also reviewed. However, although there is much common ground, the use of arrays in non-destructive evaluation offers some distinctly different challenges to these other disciplines.
818 citations
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TL;DR: It is demonstrated that by using a simple construction, an acoustically reflecting surface can acquire hybrid resonances and becomes impedance-matched to airborne sound at tunable frequencies, such that no reflection is generated.
Abstract: Acoustic impedance-matched surfaces do not reflect incident waves. Traditional means of acoustic absorption have so far resulted in imperfect impedance matching and bulky structures, or require costly and sophisticated electrical design. Inspired by electromagnetic metamaterials, a subwavelength acoustically reflecting surface with hybrid resonances and impedance-matched to airborne sound at tunable frequencies is now demonstrated.
757 citations