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Arthur E. Bergles

Bio: Arthur E. Bergles is an academic researcher. The author has contributed to research in topics: Condenser (heat transfer) & Heat transfer. The author has an hindex of 1, co-authored 1 publications receiving 7 citations.

Papers
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Book ChapterDOI
01 Jan 1972
TL;DR: In this article, the operating characteristics of an experimental submerged condenser system are described and related to specific operational modes, and the relevant thermal transport mechanism is examined and shown to accurately define the upper and lower bounds of system operation.
Abstract: The operating characteristics of an experimental submerged condenser system are described and related to specific operational modes. The relevant thermal transport mechanism are examined and shown to accurately define the upper and lower bounds of system operation. A non-dimensional vapor bubble collapse length is shown to govern the rate and mechanism of heat transfer at the submerged condenser surface.

8 citations


Cited by
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Book ChapterDOI
TL;DR: The chapter summarizes analytical, numerical, and experimental work in literature, in order to facilitate the improvement of existing schemes and provide a basis for the development of new ones on the thermal control of semiconductor devices, modules, and total systems.
Abstract: Publisher Summary Thermal control of electronic components has one principal objective, to maintain relatively constant component temperature equal to or below the manufacturer's maximum specified service temperature, typically between 85 and 100°C. It is noted that even a single component operating 10°C beyond this temperature can reduce the reliability of certain systems by as much as 50%. Therefore, it is important for the new thermal control schemes to be capable of eliminating hot spots within the electronic devices, removing heat from these devices and dissipating this heat to the surrounding environment. Several strategies have developed over the years for controlling and removing the heat generated in multichip modules, which include advanced air-cooling schemes, direct cooling, and miniature thermosyphons or free-falling liquid films. The chapter summarizes analytical, numerical, and experimental work in literature, in order to facilitate the improvement of existing schemes and provide a basis for the development of new ones. The chapter focuses on investigations performed over the past decade and includes information on the thermal control of semiconductor devices, modules, and total systems.

285 citations

Journal ArticleDOI
TL;DR: In this paper, a brief review of the mechanisms that may be responsible for delayed nucleation and examines the limited literature on incipience superheat excursions is presented. But the authors do not consider the effect of temperature variations on the nucleation of microelectronic components.
Abstract: Many of the candidate fluids for immersion cooling of microelectronic components possess both low surface tension and high gas solubility. As a consequence, ebullient heat transfer with such fluids is accompanied by nucleation anomalies and a frequently observed wall temperature overshoot. The difficulty in preventing this thermal excursion and in predicting its magnitude constrains the development of immersion cooling systems. This paper begins with a brief review of the mechanisms that may be responsible for delayed nucleation and examines the limited literature on incipience superheat excursions.

75 citations

Book ChapterDOI
01 Jan 1994
TL;DR: In this paper, the theory and practice of direct liquid cooling of microelectronic components is discussed, and a morphological analysis is suggested for the classification of liquid-cooling concepts.
Abstract: The present work reviews the theory and practice of direct liquid cooling of microelectronic components. A morphological analysis is suggested for the classification of liquid-cooling concepts. While both immersion and microgroove cooling of chips are discussed, the emphasis is on immersion cooling. The performance of individual chips and liquid incapsulated modules, including the submerged condenser, is reviewed in detail, with data presented. Flow-through modules and falling-film techniques are also discussed. Finally, figures-of-merit for coolants are noted.

20 citations

Journal ArticleDOI
TL;DR: In this paper, a review of possible immersion cooling configurations and the thermal mechanisms active in vapor-space and submerged condenser modules is presented, with a focus on the operational limits and relations for predicting the performance of submerged condensers.
Abstract: Direct immersion of electronic components in low-boiling point, dielectric fluids can provide a benign local ambience and accommodate substantial spatial and temporal power variations while minimizing component temperature excursions and failure rates. Following a review of possible immersion cooling configurations and the thermal mechanisms active in vapor-space and submerged condenser modules, attention is focused on the operational limits and relations for predicting submerged condenser performance. Finally, descriptions of three likely applications of submerged condenser technology are presented.

19 citations