International Technology Roadmap for Semiconductors 2003の要求清浄度について － シリコンウエハ表面と雰囲気環境に要求される清浄度, 分析方法の現状について －

Infrared thermography for condition monitoring – A review

High-performance parallel computer architecture and systems have been improved at a phenomenal rate. In the meantime, VLSI computer-aided design (CAD) software for multibillion-transistor IC design has become increasingly complex and requires prohibitively high computational resources. Recent studies have shown that, numerous CAD problems, with their high computational complexity, can greatly benefit from the fast-increasing parallel computation capabilities. However, parallel programming imposes big challenges for CAD applications. Fully exploiting the computational power of emerging general-purpose and domain-specific multicore/many-core processor systems, calls for fundamental research and engineering practice across every stage of parallel CAD design, from algorithm exploration, programming models, design-time and run-time environment, to CAD applications, such as verification, optimization, and simulation. This journal special section will cover recent progress on parallel CAD research, including algorithm foundations, programming models, parallel architectural-specific optimization, and verification. More specifically, papers with in-depth and extensive coverage of the following topics will be considered, as well as other topics relevant to the design of parallel CAD algorithms and software tools. 1. Parallel algorithm design and specification for CAD applications 2. Parallel programming models and languages of particular use in CAD 3. Runtime support and performance optimization for CAD applications 4. Parallel architecture-specific design and optimization for CAD applications 5. Parallel program debugging and verification techniques particularly relevant for CAD The papers should be submitted via the Manuscript Central website and should adhere to standard ACM TODAES formatting requirements (http://todaes.acm.org/). The page count limit is 25.

Parallel CAD: Algorithm Design and Programming Special Section Call for Papers TODAES: ACM Transactions on Design Automation of Electronic Systems

From GuI to TuI Humans have evolved a heightened ability to sense and manipulate the physical world, yet the digital world takes little advantage of our capacity for hand-eye coordination. A tangible user interface (TUI) builds upon our dexterity by embodying digital information in physical space. Tangible design expands the affordances of physical objects so they can Graphical user interfaces (GUIs) let users see digital information only through a screen, as if looking into a pool of water, as depicted in Figure 1 on page 40. We interact with the forms below through remote controls, such as a mouse, a keyboard, or a touchscreen (Figure 1a). Now imagine an iceberg, a mass of ice that penetrates the surface of the water and provides a handle for the mass beneath. This metaphor describes tangible user interfaces: They act as physical manifestations of computation, allowing us to interact directly with the portion that is made tangible—the “tip of the iceberg” (Figure 1b). Radical Atoms takes a leap beyond tangible interfaces by assuming a hypothetical generation of materials that can change form and CoVer STorY

/pdf/radical-atoms-beyond-tangible-bits-toward-transformable-30aywdnl16.pdf

Radical atoms: beyond tangible bits, toward transformable materials

Cambridge University Press. Paperback. Book Condition: New. Paperback. 480 pages. Numerical analysis presents different faces to the world. For mathematicians it is a bona fide mathematical theory with an applicable flavour. For scientists and engineers it is a practical, applied subject, part of the standard repertoire of modelling techniques. For computer scientists it is a theory on the interplay of computer architecture and algorithms for real-number calculations. The tension between these standpoints is the driving force of this book, which presents a rigorous account of the fundamentals of numerical analysis of both ordinary and partial differential equations. The exposition maintains a balance between theoretical, algorithmic and applied aspects. This new edition has been extensively updated, and includes new chapters on emerging subject areas: geometric numerical integration, spectral methods and conjugate gradients. Other topics covered include multistep and Runge-Kutta methods; finite difference and finite elements techniques for the Poisson equation; and a variety of algorithms to solve large, sparse algebraic systems. This item ships from multiple locations. Your book may arrive from Roseburg,OR, La Vergne,TN. Paperback.

A First Course in the Numerical Analysis of Differential Equations: Stiff equations

An apparatus including a socket having a socket body and a cavity within the socket body. The apparatus further including a thermoelectric cooler coupled to an in-substrate voltage regulator positioned within the cavity. A method including coupling a thermoelectric cooler to an in-substrate voltage regulator positioned within a cavity of a socket and electrically coupling the thermoelectric cooler to the socket using a contact of the socket. A system including an electronic appliance having a processor including an in-substrate voltage regulator positioned within a cavity of a socket coupled to the processor. The system further including a thermoelectric cooler positioned within the cavity and coupled to the in-substrate voltage regulator.

Socket enabled current delivery to a thermoelectric cooler to cool an in-substrate voltage regulator

A cooling system including one or more piezo fans for an electronic assembly is disclosed. The electronic assembly may include heat-generating components coupled with a front side of a printed circuit board (PCB) and one or more piezo fans coupled with a back side of the PCB. One or more piezo fans may be capable of cooling the heat-generating components from the back side. The cooling system may further include a heat sink coupled with the back side of the PCB.

Piezo fans for cooling an electronic device

https://escholarship.org/content/qt1n52c3d8/qt1n52c3d8.pdf?t=nai6yu

Compact thermal modeling for packaged microprocessor design with practical power maps

Efficient temperature estimation is vital for designing thermally efficient, lower power and robust integrated circuits in nanometer regime. Thermal simulation based on the detailed thermal structures no longer meets the demanding tasks for efficient design space exploration. The compact and composable model-based simulation provides a viable solution to this difficult problem. However, building such thermal models from detailed thermal structures was not well addressed in the past. In this article, we propose a new compact thermal modeling technique, called ThermComp, standing for thermal modeling with composable modules. ThermComp can be used for fast thermal design space exploration for multicore microprocessors. The new approach builds the composable model from detailed structures for each basic module using the finite difference method and reduces the model complexity by the sampling-based model order reduction technique. These composable models are then used to assemble different multicore architecture thermal models and realized into SPICE-like netlists. The resulting thermal models can be simulated by the general circuit simulator SPICE. ThermComp tries to preserve the accuracy of fine-grained models with the speed of coarse-grained models. Experimental results on a number of multicore microprocessor architectures show the new approach can easily build accurate thermal systems from compact composable models for fast architecture thermal analysis and optimization and is much faster than the existing HotSpot method with similar accuracy.

Composable thermal modeling and simulation for architecture-level thermal designs of multicore microprocessors

A microelectronic package. The package includes a substrate; a die mounted onto the substrate; an integrated heat spreader mounted onto the substrate, and thermally coupled to a backside of the die; and a sealant material bonding the integrated heat spreader to the substrate, the sealant material having a bulk thermal conductivity above about 1 W/m/° C. and a modulus of elasticity lower than a modulus of elasticity of solder.

Ashish Gupta

Papers

Socket enabled current delivery to a thermoelectric cooler to cool an in-substrate voltage regulator

Piezo fans for cooling an electronic device

Compact thermal modeling for packaged microprocessor design with practical power maps

Composable thermal modeling and simulation for architecture-level thermal designs of multicore microprocessors

Microelectronic package including thermally conductive sealant between heat spreader and substrate