Assaf Shacham

Bio: Assaf Shacham is an academic researcher from Qualcomm. The author has contributed to research in topics: Packet switching & Burst switching. The author has an hindex of 16, co-authored 59 publications receiving 2231 citations. Previous affiliations of Assaf Shacham include Columbia University.

Photonic Networks-on-Chip for Future Generations of Chip Multiprocessors

Abstract: The design and performance of next-generation chip multiprocessors (CMPs) will be bound by the limited amount of power that can be dissipated on a single die We present photonic networks-on-chip (NoC) as a solution to reduce the impact of intra-chip and off-chip communication on the overall power budget A photonic interconnection network can deliver higher bandwidth and lower latencies with significantly lower power dissipation We explain why on-chip photonic communication has recently become a feasible opportunity and explore the challenges that need to be addressed to realize its implementation We introduce a novel hybrid micro-architecture for NoCs combining a broadband photonic circuit-switched network with an electronic overlay packet-switched control network We address the critical design issues including: topology, routing algorithms, deadlock avoidance, and path-setup/tear-down procedures We present experimental results obtained with POINTS, an event-driven simulator specifically developed to analyze the proposed idea, as well as a comparative power analysis of a photonic versus an electronic NoC Overall, these results confirm the unique benefits for future generations of CMPs that can be achieved by bringing optics into the chip in the form of photonic NoCs

On the Design of a Photonic Network-on-Chip

Abstract: Recent remarkable advances in nanoscale silicon-photonic integrated circuitry specifically compatible with CMOS fabrication have generated new opportunities for leveraging the unique capabilities of optical technologies in the on-chip communications infrastructure. Based on these nano-photonic building blocks, we consider a photonic network-on-chip architecture designed to exploit the enormous transmission bandwidths, low latencies, and low power dissipation enabled by data exchange in the optical domain. The novel architectural approach employs a broadband photonic circuit-switched network driven in a distributed fashion by an electronic overlay control network which is also used for independent exchange of short messages. We address the critical network design issues for insertion in chip multiprocessors (CMP) applications, including topology, routing algorithms, path-setup and tear-down procedures, and deadlock avoidance. Simulations show that this class of photonic networks-on-chip offers a significant leap in the performance for CMP intrachip communication systems delivering low-latencies and ultra-high throughputs per core while consuming minimal power

Photonic NoC for DMA Communications in Chip Multiprocessors

Abstract: As multicore architectures prevail in modern high- performance processor chip design, the communications bottleneck has begun to penetrate on-chip interconnects. With vastly growing numbers of cores and on-chip computation, a high-bandwidth, low-latency, and, perhaps most importantly, low-power communication infrastructure is critically required for next generation chip multiprocessors. Recent remarkable advances in silicon photonics and the integration of photonic elements with standard CMOS processes suggest the use of photonic networks-on-chip. In this paper we review the previously proposed architecture of a hybrid electronic/photonic NoC. We improve the former internally blocking switches by designing a non-blocking photonic switch, and we estimate the optical loss budget and area requirements of a practical NoC implementation based on the new switches. Additionally, we tackle one of the key performance challenges: the latency associated with setting-up photonic paths. Simulations show that the technique suggested can substantially reduce the latency and increase the effective bandwidth. Finally, we consider the DMA communication model in the context of the photonic network and evaluate the optimal DMA block size.

A fully implemented 12 /spl times/ 12 data vortex optical packet switching interconnection network

Abstract: A fully functional optical packet switching (OPS) interconnection network based on the data vortex architecture is presented. The photonic switching fabric uniquely capitalizes on the enormous bandwidth advantage of wavelength division multiplexing (WDM) wavelength parallelism while delivering minimal packet transit latency. Utilizing semiconductor optical amplifier (SOA)-based switching nodes and conventional fiber-optic technology, the 12-port system exhibits a capacity of nearly 1 Tb/s. Optical packets containing an eight-wavelength WDM payload with 10 Gb/s per wavelength are routed successfully to all 12 ports while maintaining a bit error rate (BER) of 10/sup -12/ or better. Median port-to-port latencies of 110 ns are achieved with a distributed deflection routing network that resolves packet contention on-the-fly without the use of optical buffers and maintains the entire payload path in the optical domain.

The Data Vortex Optical Packet Switched Interconnection Network

Abstract: A complete review of the data vortex optical packet switched (OPS) interconnection network architecture is presented. The distributed multistage network topology is based on a banyan structure and incorporates a deflection routing scheme ideally suited for implementation with optical components. An implemented 12-port system prototype employs broadband semiconductor optical amplifier switching nodes and is capable of successfully routing multichannel wavelength-division multiplexing packets while maintaining practically error-free signal integrity (BER < 10-12) with median latencies of 110 ns. Packet contentions are resolved without the use of optical buffers via a distributed deflection routing control scheme. The entire payload path in the optical domain exhibits a capacity of nearly 1 Tb/s. Further experimental measurements investigate the OPS interconnection network's flexibility and robustness in terms of optical power dynamic range and network timing. Subsequent experimental investigations support the physical layer scalability of the implemented architecture and serve to substantiate the merits of the data vortex OPS network architectural paradigm. Finally, modified design considerations that aim to increase the network throughput and device-level performance are presented.

Device Requirements for Optical Interconnects to Silicon Chips

Abstract: We examine the current performance and future demands of interconnects to and on silicon chips. We compare electrical and optical interconnects and project the requirements for optoelectronic and optical devices if optics is to solve the major problems of interconnects for future high-performance silicon chips. Optics has potential benefits in interconnect density, energy, and timing. The necessity of low interconnect energy imposes low limits especially on the energy of the optical output devices, with a ~ 10 fJ/bit device energy target emerging. Some optical modulators and radical laser approaches may meet this requirement. Low (e.g., a few femtofarads or less) photodetector capacitance is important. Very compact wavelength splitters are essential for connecting the information to fibers. Dense waveguides are necessary on-chip or on boards for guided wave optical approaches, especially if very high clock rates or dense wavelength-division multiplexing (WDM) is to be avoided. Free-space optics potentially can handle the necessary bandwidths even without fast clocks or WDM. With such technology, however, optics may enable the continued scaling of interconnect capacity required by future chips.

Single-chip microprocessor that communicates directly using light

Abstract: An electronic–photonic microprocessor chip manufactured using a conventional microelectronics foundry process is demonstrated; the chip contains 70 million transistors and 850 photonic components and directly uses light to communicate to other chips. The rapid transfer of data between chips in computer systems and data centres has become one of the bottlenecks in modern information processing. One way of increasing speeds is to use optical connections rather than electrical wires and the past decade has seen significant efforts to develop silicon-based nanophotonic approaches to integrate such links within silicon chips, but incompatibility between the manufacturing processes used in electronics and photonics has proved a hindrance. Now Chen Sun et al. describe a 'system on a chip' microprocessor that successfully integrates electronics and photonics yet is produced using standard microelectronic chip fabrication techniques. The resulting microprocessor combines 70 million transistors and 850 photonic components and can communicate optically with the outside world. This result promises a way forward for new fast, low-power computing systems architectures. Data transport across short electrical wires is limited by both bandwidth and power density, which creates a performance bottleneck for semiconductor microchips in modern computer systems—from mobile phones to large-scale data centres. These limitations can be overcome1,2,3 by using optical communications based on chip-scale electronic–photonic systems4,5,6,7 enabled by silicon-based nanophotonic devices8. However, combining electronics and photonics on the same chip has proved challenging, owing to microchip manufacturing conflicts between electronics and photonics. Consequently, current electronic–photonic chips9,10,11 are limited to niche manufacturing processes and include only a few optical devices alongside simple circuits. Here we report an electronic–photonic system on a single chip integrating over 70 million transistors and 850 photonic components that work together to provide logic, memory, and interconnect functions. This system is a realization of a microprocessor that uses on-chip photonic devices to directly communicate with other chips using light. To integrate electronics and photonics at the scale of a microprocessor chip, we adopt a ‘zero-change’ approach to the integration of photonics. Instead of developing a custom process to enable the fabrication of photonics12, which would complicate or eliminate the possibility of integration with state-of-the-art transistors at large scale and at high yield, we design optical devices using a standard microelectronics foundry process that is used for modern microprocessors13,14,15,16. This demonstration could represent the beginning of an era of chip-scale electronic–photonic systems with the potential to transform computing system architectures, enabling more powerful computers, from network infrastructure to data centres and supercomputers.

Photonic Networks-on-Chip for Future Generations of Chip Multiprocessors

Abstract: The design and performance of next-generation chip multiprocessors (CMPs) will be bound by the limited amount of power that can be dissipated on a single die We present photonic networks-on-chip (NoC) as a solution to reduce the impact of intra-chip and off-chip communication on the overall power budget A photonic interconnection network can deliver higher bandwidth and lower latencies with significantly lower power dissipation We explain why on-chip photonic communication has recently become a feasible opportunity and explore the challenges that need to be addressed to realize its implementation We introduce a novel hybrid micro-architecture for NoCs combining a broadband photonic circuit-switched network with an electronic overlay packet-switched control network We address the critical design issues including: topology, routing algorithms, deadlock avoidance, and path-setup/tear-down procedures We present experimental results obtained with POINTS, an event-driven simulator specifically developed to analyze the proposed idea, as well as a comparative power analysis of a photonic versus an electronic NoC Overall, these results confirm the unique benefits for future generations of CMPs that can be achieved by bringing optics into the chip in the form of photonic NoCs

A role for graphene in silicon-based semiconductor devices

Abstract: As silicon-based electronics approach the limit of improvements to performance and capacity through dimensional scaling, attention in the semiconductor field has turned to graphene, a single layer of carbon atoms arranged in a honeycomb lattice. Its high mobility of charge carriers (electrons and holes) could lead to its use in the next generation of high-performance devices. Graphene is unlikely to replace silicon completely, however, because of the poor on/off current ratio resulting from its zero bandgap. But it could be used to improve silicon-based devices, in particular in high-speed electronics and optical modulators.

Corona: System Implications of Emerging Nanophotonic Technology

Abstract: We expect that many-core microprocessors will push performance per chip from the 10 gigaflop to the 10 teraflop range in the coming decade. To support this increased performance, memory and inter-core bandwidths will also have to scale by orders of magnitude. Pin limitations, the energy cost of electrical signaling, and the non-scalability of chip-length global wires are significant bandwidth impediments. Recent developments in silicon nanophotonic technology have the potential to meet these off- and on-stack bandwidth requirements at acceptable power levels. Corona is a 3D many-core architecture that uses nanophotonic communication for both inter-core communication and off-stack communication to memory or I/O devices. Its peak floating-point performance is 10 teraflops. Dense wavelength division multiplexed optically connected memory modules provide 10 terabyte per second memory bandwidth. A photonic crossbar fully interconnects its 256 low-power multithreaded cores at 20 terabyte per second bandwidth. We have simulated a 1024 thread Corona system running synthetic benchmarks and scaled versions of the SPLASH-2 benchmark suite. We believe that in comparison with an electrically-connected many-core alternative that uses the same on-stack interconnect power, Corona can provide 2 to 6 times more performance on many memory intensive workloads, while simultaneously reducing power.