Avram Bar-Cohen

Bio: Avram Bar-Cohen is an academic researcher. The author has contributed to research in topics: Boiling & Boiling point. The author has an hindex of 1, co-authored 1 publications receiving 8 citations.

Boiling and condensation in a liquid-filled enclosure,

Abstract: Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 1971.

Modular liquid cooling of electronic assemblies

Abstract: An electronic system includes an array of electronic assemblies at a first location within a system. An array of liquid cooling assemblies is placed at a second location within the system. Hoses or other liquid transport pathways connect the cooling assemblies to the electronic assemblies, for cooling the electronic assemblies. As more electronic assemblies are added to the system, additional cooling assemblies may be provided to manage the increased thermal demands.

Experimental Investigation of a Direct Liquid Immersion Cooled Prototype for High Performance Electronic Systems

Abstract: As the demand grows for electronics to become faster and more compact, the expectation for tomorrow’s data center is no different. Like many of the current high performance data center installations, design considerations on all scales must be taken into account. The proposed solution does just this by looking at the entire cooling approach from the chip level all the way to the plenum level. The solution’s enclosure, where all the heated elements are immersed in either FC-72 or Novec 649, has dimensions of $150~{\rm mm} \times 300~{\rm mm} \times 38$ mm ( $H \times L \times W$ ). The design is versatile allowing for either flow or pool boiling heat transfer. Under pool boiling conditions, heat transfer coefficients as high as 11.5 kW/ $\text{m}^{2}\,\cdot \,\text{K}$ were achieved with surface enhancements and maximum power dissipations as high as 320 W were yielded as chip temperatures were roughly 58 °C, well below typical operating conditions. With the introduction of dielectric fluid flow within the enclosure, maximum power dissipations achieved increased substantially, reaching 605 W, which corresponds to a volumetric power dissipation of 0.354 W/cm3.

Immersion Cooling of Digital Computers

Abstract: The present work reviews the theory and practice of direct liquid cooling of microelectronic components. A morphological analysis is suggested for the classification of liquid-cooling concepts. While both immersion and microgroove cooling of chips are discussed, the emphasis is on immersion cooling. The performance of individual chips and liquid incapsulated modules, including the submerged condenser, is reviewed in detail, with data presented. Flow-through modules and falling-film techniques are also discussed. Finally, figures-of-merit for coolants are noted.

Thermal Design of Immersion Cooling Modules for Electronic Components

Abstract: Direct immersion of electronic components in low-boiling point, dielectric fluids can provide a benign local ambience and accommodate substantial spatial and temporal power variations while minimizing component temperature excursions and failure rates. Following a review of possible immersion cooling configurations and the thermal mechanisms active in vapor-space and submerged condenser modules, attention is focused on the operational limits and relations for predicting submerged condenser performance. Finally, descriptions of three likely applications of submerged condenser technology are presented.