Showing papers by "Avram Bar-Cohen published in 1983"
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01 Jan 1983
TL;DR: In this article, thermal analysis and control of electronic equipment, thermal analysis of electronic devices and their control, thermal control and control in the field of software engineering, is discussed. ǫ
Abstract: Thermal analysis and control of electronic equipment , Thermal analysis and control of electronic equipment , مرکز فناوری اطلاعات و اطلاع رسانی کشاورزی
339 citations
01 Jan 1983
TL;DR: In this article, a model analytique et experimentale du transfert de chaleur par ebullition dans l'eau sur une paire de plaques plates, a flux thermiques egaux.
Abstract: Etude analytique et experimentale du transfert de chaleur par ebullition dans l'eau sur une paire de plaques plates, a flux thermiques egaux. Resultats experimentaux pour la temperature de la paroi en fonction de la localisation axiale du flux thermique et de l'espacement des plaques. Modele theorique du debit liquide a travers le canal et correlation de la vitesse du transfert de chaleur des parois du canal
25 citations
TL;DR: In this paper, a review of possible immersion cooling configurations and the thermal mechanisms active in vapor-space and submerged condenser modules is presented, with a focus on the operational limits and relations for predicting the performance of submerged condensers.
Abstract: Direct immersion of electronic components in low-boiling point, dielectric fluids can provide a benign local ambience and accommodate substantial spatial and temporal power variations while minimizing component temperature excursions and failure rates. Following a review of possible immersion cooling configurations and the thermal mechanisms active in vapor-space and submerged condenser modules, attention is focused on the operational limits and relations for predicting submerged condenser performance. Finally, descriptions of three likely applications of submerged condenser technology are presented.
19 citations
TL;DR: In this paper, the authors derived analytic relations for natural convection heat transfer coefficients along isothermal or isoflux channel surfaces for thermal optimization of printed circuit cards and fin arrays.
Abstract: Recently derived analytic relations for natural convection heat transfer coefficients along isothermal or isoflux channel surfaces are applied to the thermal optimization of printed circuit cards and fin arrays. The procedure used and the governing relations, for both thermally symmetric and asymmetric card arrays, are presented. A similar development for arrays of natural convection fins, addressing the influence of fin thickness on the optimum fin spacing and maximum array heat dissipation, is also shown.
15 citations
TL;DR: In this article, a critical review of the available results and a detailed analysis of two-phase flow regimes in boiler tubes appear to indicate that a reduced circumferential temperature difference is associated with transition from intermittent to annular flow, rather than the termination of stratified flow.
13 citations