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Showing papers by "Avram Bar-Cohen published in 1999"



Journal ArticleDOI
TL;DR: In this paper, an attempt was made to experimentally determine the dependence of the fatigue life of two packaging epoxy adhesives on: temperature, peak cycling stress as a fraction of adhesion strength, and cyclic frequency.
Abstract: Adhesives used in electronic applications are subject to high cyclic shear stresses resulting from differential thermal expansion of the bonded materials. In this study, an attempt has been made to experimentally determine the dependence of the fatigue life of two packaging epoxy adhesives on: temperature, peak cycling stress as a fraction of adhesion strength, and cyclic frequency. Both epoxies were used to bond surfaces of aluminum and silicon. Tensile lap-shear specimens were used.

31 citations



Proceedings ArticleDOI
01 Jun 1999
TL;DR: An expanded team including international thermal design experts will develop case study modules on topics including portable electronics and three-dimensional packaging, and a series of internet based video conferences, that brings industry experts into the virtual classroom, on topics of current interest.
Abstract: Over the past year, a multi-institution team has pioneered the development of a series of internet based instructional modules on thermal design of electronic products. These include web based tutorials on specialized topics, case studies, and a virtual laboratory tour. These efforts are summarized, and the best practices usable in other similar undertakings are identified in this paper. The case study groups so far have been within the United States. As the next step in internet based distance learning, we propose to expand the scope of this effort globally. An expanded team including international thermal design experts will develop case study modules on topics including portable electronics and three-dimensional packaging. Also proposed is a series of internet based video conferences, that brings industry experts into the virtual classroom, on topics of current interest.

5 citations