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Author

Avram Bar-Cohen

Other affiliations: Auburn University, DARPA, Ben-Gurion University of the Negev  ...read more
Bio: Avram Bar-Cohen is an academic researcher from University of Maryland, College Park. The author has contributed to research in topics: Heat transfer & Heat sink. The author has an hindex of 50, co-authored 329 publications receiving 8329 citations. Previous affiliations of Avram Bar-Cohen include Auburn University & DARPA.


Papers
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01 Jan 1981
TL;DR: In this article, the authors developed composite relations for the variation of the heat transfer coefficient along the plate surfaces, and the mathematical development and verification of such composite relations as well as the formulation and solution of the optimizing equations for the various boundary conditions of interest constitute the core of the presentation.
Abstract: While component dissipation patterns and system operating modes vary widely, many electronic packaging configurations can be modeled by symmetrically or asymmetrically isothermal or isoflux plates. The idealized configurations are amenable to analytic optimization based on maximizing total heat transfer per unit volume or unit primary area. To achieve this anlaytic optimization, however, it is necessary to develop composite relations for the variation of the heat transfer coefficient along the plate surfaces. The mathematical development and verification of such composite relations as well as the formulation and solution of the optimizing equations for the various boundary conditions of interest constitute the core of this presentation.

481 citations

Journal ArticleDOI
TL;DR: In this paper, the authors developed composite relations for the variation of the heat transfer coefficient along the plate surfaces, and the mathematical development and verification of such composite relations as well as the formulation and solution of the optimizing equations for the various boundary conditions of interest constitute the core of the presentation.
Abstract: While component dissipation patterns and system operating modes vary widely, many electronic packaging configurations can be modeled by symmetrically or asymmetrically isothermal or isoflux plates. The idealized configurations are amenable to analytic optimization based on maximizing total heat transfer per unit volume or unit primary area. To achieve this anlaytic optimization, however, it is necessary to develop composite relations for the variation of the heat transfer coefficient along the plate surfaces. The mathematical development and verification of such composite relations as well as the formulation and solution of the optimizing equations for the various boundary conditions of interest constitute the core of this presentation.

462 citations

Book
01 Jan 1983
TL;DR: In this article, thermal analysis and control of electronic equipment, thermal analysis of electronic devices and their control, thermal control and control in the field of software engineering, is discussed. ǫ
Abstract: Thermal analysis and control of electronic equipment , Thermal analysis and control of electronic equipment , مرکز فناوری اطلاعات و اطلاع رسانی کشاورزی

339 citations

Journal ArticleDOI
25 Sep 2006
TL;DR: This paper begins with a discussion of the thermophysics of phase-change processes and a description of the available dielectric liquid cooling techniques and their history, and describes the phenomenology of pool boiling, spray/jet impingements, gas-assisted evaporation, and synthetic jet impingement with dielectrics liquids.
Abstract: The inexorable rise in chip power dissipation and emergence of on-chip hot spots with heat fluxes approaching 1 =kW/cm2 has turned renewed attention to direct cooling with dielectric liquids. Use of dielectric liquids in intimate contact with the heat dissipating surfaces eliminates the deleterious effects of solid-solid interface resistances and harnesses the highly efficient phase-change processes to the critical thermal management of advanced IC chips. In the interest of defining the state-of-the-art in direct liquid cooling, this paper begins with a discussion of the thermophysics of phase-change processes and a description of the available dielectric liquid cooling techniques and their history. It then describes the phenomenology of pool boiling, spray/jet impingement, gas-assisted evaporation, and synthetic jet impingement with dielectric liquids. Available correlations for predicting the heat transfer coefficients and limiting heat transfer rates, as well as documented empirical results for these promising techniques for on-chip hot spot cooling, are also provided and compared

208 citations

Book
01 Jul 1988
TL;DR: In this article, the authors present a comprehensive bibliograhy of project managers and lead engineers, packaging engineers and mechanical analysts, consultants, and academic, industrial, and government laboratory researchers.
Abstract: This volume opens with a sweeping overview of the physical design of electronic systems-methodology, technology, and future challenges-thermally induced failures in electronic systems. Subsequent chapters examine the causes for thermally induced failures of electronic components and the techniques used to analyze and prevent such failures. It gives a comprehensive bibliograhy of project managers and lead engineers, packaging engineers and mechanical analysts, consultants, and academic, industrial, and government laboratory researchers.

168 citations


Cited by
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Journal ArticleDOI
TL;DR: In this paper, a review of the history of thermal energy storage with solid-liquid phase change has been carried out and three aspects have been the focus of this review: materials, heat transfer and applications.

4,019 citations

Journal ArticleDOI
01 Jan 1977-Nature
TL;DR: Bergh and P.J.Dean as discussed by the authors proposed a light-emitting diode (LEDD) for light-aware Diodes, which was shown to have promising performance.
Abstract: Light-Emitting Diodes. (Monographs in Electrical and Electronic Engineering.) By A. A. Bergh and P. J. Dean. Pp. viii+591. (Clarendon: Oxford; Oxford University: London, 1976.) £22.

1,560 citations

Journal ArticleDOI
TL;DR: The role of defects and impurities on the transport and optical properties of bulk, epitaxial, and nanostructures material, the difficulty in p-type doping, and the development of processing techniques like etching, contact formation, dielectrics for gate formation, and passivation are discussed in this article.
Abstract: Gallium oxide (Ga2O3) is emerging as a viable candidate for certain classes of power electronics, solar blind UV photodetectors, solar cells, and sensors with capabilities beyond existing technologies due to its large bandgap. It is usually reported that there are five different polymorphs of Ga2O3, namely, the monoclinic (β-Ga2O3), rhombohedral (α), defective spinel (γ), cubic (δ), or orthorhombic (e) structures. Of these, the β-polymorph is the stable form under normal conditions and has been the most widely studied and utilized. Since melt growth techniques can be used to grow bulk crystals of β-GaO3, the cost of producing larger area, uniform substrates is potentially lower compared to the vapor growth techniques used to manufacture bulk crystals of GaN and SiC. The performance of technologically important high voltage rectifiers and enhancement-mode Metal-Oxide Field Effect Transistors benefit from the larger critical electric field of β-Ga2O3 relative to either SiC or GaN. However, the absence of clear demonstrations of p-type doping in Ga2O3, which may be a fundamental issue resulting from the band structure, makes it very difficult to simultaneously achieve low turn-on voltages and ultra-high breakdown. The purpose of this review is to summarize recent advances in the growth, processing, and device performance of the most widely studied polymorph, β-Ga2O3. The role of defects and impurities on the transport and optical properties of bulk, epitaxial, and nanostructures material, the difficulty in p-type doping, and the development of processing techniques like etching, contact formation, dielectrics for gate formation, and passivation are discussed. Areas where continued development is needed to fully exploit the properties of Ga2O3 are identified.

1,535 citations

Journal ArticleDOI
TL;DR: In this paper, the authors present a review of low temperature co-fired ceramic (LTCC) technologies for high frequency applications, which will be of immense help to researchers and technologists all over the world.
Abstract: Small, light weight and multifunctional electronic components are attracting much attention because of the rapid growth of the wireless communication systems and microwave products in the consumer electronic market. The component manufacturers are thus forced to search for new advanced integration, packaging and interconnection technologies. One solution is the low temperature cofired ceramic (LTCC) technology enabling fabrication of three-dimensional ceramic modules with low dielectric loss and embedded silver electrodes. During the past 15 years, a large number of new dielectric LTCCs for high frequency applications have been developed. About 1000 papers were published and ∼500 patents were filed in the area of LTCC and related technologies. However, the data of these several very useful materials are scattered. The main purpose of this review is to bring the data and science of these materials together, which will be of immense help to researchers and technologists all over the world. The comme...

968 citations