Avram Bar-Cohen

TL;DR: In this article, the authors present a new technique based upon DNA melting curve analysis using a temperature gradient established using a silicon wafer, where along one edge of a square silicon substrate, two electrical connectors are mounted to deliver electrical current from a power supply.

TL;DR: In this paper, a quantum-well Si/SiC self-cooling concept for hot spot thermal management at the multi-fingered GaN high electron mobility transistor (HEMTs) in the GaN-on-SiC package is proposed and investigated using a three dimensional (3-D) thermal-electric coupling simulation.

TL;DR: It is anticipated that instructors of more comprehensive packaging courses, as well as more general heat transfer and thermal design courses, will find it possible to incorporate these modules in their syllabi and thus dramatically expand the number of engineering students exposed to these critical issues.

TL;DR: In this paper, it is suggested that the thermal community can take the lead in reversing the growing alienation of academic research from industrial needs by redefining its research agenda, by altering the format of technical meetings, by broadening and deepening training in heat transfer, and by supporting the establishment of product family research institutes at leading U.S. universities.

TL;DR: In this paper, the thermofluidic performance of a cryogenic micro-pin fin cooler with two-phase liquid nitrogen flows was investigated, and it was shown that the nominal value of the base heat transfer coefficients of the micro pin fin cooler, 240 kW/m2-K at a mass flow rate of 2.23 g/s, is an order of magnitude greater than that with FC-72 flows.