B. Jayant Baliga

Bio: B. Jayant Baliga is an academic researcher from North Carolina State University. The author has contributed to research in topics: Power MOSFET & MOSFET. The author has an hindex of 25, co-authored 167 publications receiving 4847 citations.

Fundamentals of Power Semiconductor Devices

Abstract: Fundamentals of Power Semiconductor Devices provides an in-depth treatment of the physics of operation of power semiconductor devices that are commonly used by the power electronics industry. Analytical models for explaining the operation of all power semiconductor devices are shown. The treatment focuses on silicon devicesandincludes the unique attributes and design requirements for emerging silicon carbide devices.

Modern power devices

Abstract: Carrier Transport Physics Breakdown Voltage Power Junction Field-Effect Transistors Power Field-Controlled Diodes Power Metal-Oxide-Semiconductor Field Effect Transistors Power MOS-Bipolar Devices New Rectifier Concepts Synopsis References Index

Gallium nitride devices for power electronic applications

Abstract: Recent success with the fabrication of high-performance GaN-on-Si high-voltage HFETs has made this technology a contender for power electronic applications. This paper discusses the properties of GaN that make it an attractive alternative to established silicon and emerging SiC power devices. Progress in development of vertical power devices from bulk GaN is reviewed followed by analysis of the prospects for GaN-on-Si HFET structures. Challenges and innovative solutions to creating enhancement-mode power switches are reviewed.

Advanced Power MOSFET Concepts

Abstract: D-MOSFET Structure.- U-MOSFET Structure.- SC-MOSFET Structure.- CC-MOSFET Structure.- GD-MOSFET Structure.- SJ-MOSFET Structure.- Integral Diode.- SiC Planar MOSFET Structures.- Synopsis.

Photoelectrolysis and physical properties of the semiconducting electrode WO2

Abstract: The behavior of semiconducting electrodes for photoelectrolysis of water is examined in terms of the physical properties of the semiconductor. The semiconductor‐electrolyte junction is treated as a simple Schottky barrier, and the photocurrent is described using this model. The approach is appropriate since large‐band‐gap semiconductors have an intrinsic oxygen overpotential which removes the electrode reaction kinetics as the rate‐limiting step. The model is successful in describing the wavelength and potential dependence of the photocurrent in WO3 and allows a determination of the band gap, optical absorption depth, minority‐carrier diffusion length, flat‐band potential, and the nature of the fundamental optical transition (direct or indirect). It is shown for WO3 that minority‐carrier diffusion plays a limited role in determining the photoresponse of the semiconductor‐electrolyte junction. There are indications that the diffusion length in this low carrier mobility material is determined by diffusion‐controlled bulk recombination processes rather than the more common trap‐limited recombination. It is also shown that the fundamental optical transition is indirect and that the band‐gap energy depends relatively strongly on applied potential and electrolyte. This effect seems to be the result of field‐induced crystallographic distortions in antiferroelectric WO3.

Fundamentals of Power Semiconductor Devices

Abstract: Fundamentals of Power Semiconductor Devices provides an in-depth treatment of the physics of operation of power semiconductor devices that are commonly used by the power electronics industry. Analytical models for explaining the operation of all power semiconductor devices are shown. The treatment focuses on silicon devicesandincludes the unique attributes and design requirements for emerging silicon carbide devices.

Status of silicon carbide (SiC) as a wide-bandgap semiconductor for high-temperature applications: A review

Abstract: Silicon carbide (SiC), a material long known with potential for high-temperature, high-power, high-frequency, and radiation hardened applications, has emerged as the most mature of the wide-bandgap (2.0 eV ≲ Eg ≲ 7.0 eV) semiconductors since the release of commercial 6HSiC bulk substrates in 1991 and 4HSiC substrates in 1994. Following a brief introduction to SiC material properties, the status of SiC in terms of bulk crystal growth, unit device fabrication processes, device performance, circuits and sensors is discussed. Emphasis is placed upon demonstrated high-temperature applications, such as power transistors and rectifiers, turbine engine combustion monitoring, temperature sensors, analog and digital circuitry, flame detectors, and accelerometers. While individual device performances have been impressive (e.g. 4HSiC MESFETs with fmax of 42 GHz and over 2.8 W mm−1 power density; 4HSiC static induction transistors with 225 W power output at 600 MHz, 47% power added efficiency (PAE), and 200 V forward blocking voltage), material defects in SiC, in particular micropipe defects, remain the primary impediment to wide-spread application in commercial markets. Micropipe defect densities have been reduced from near the 1000 cm−2 order of magnitude in 1992 to 3.5 cm−2 at the research level in 1995.

Comparison of 6H-SiC, 3C-SiC, and Si for power devices

Abstract: The drift region properties of 6H- and 3C-SiC-based Schottky rectifiers and power MOSFETs that result in breakdown voltages from 50 to 5000 V are defined. Using these values, the output characteristics of the devices are calculated and compared with those of Si devices. It is found that due to very low drift region resistance, 5000-V SiC Schottky rectifiers and power MOSFETs can deliver on-state current density of 100 A/cm/sup 2/ at room temperature with a forward drop of only 3.85 and 2.95 V, respectively. Both devices are expected to have excellent switching characteristics and ruggedness due to the absence of minority-carrier injection. A thermal analysis shows that 5000-V, 6H-, and 3C-SiC MOSFETs and Schottky rectifiers would be approximately 20 and 18 times smaller than corresponding Si devices, and that operation at higher temperatures and at higher breakdown voltages than conventional Si devices is possible. Also, a significant reduction in the die size is expected. >