B
Bao Yang
Researcher at University of Maryland, College Park
Publications - 166
Citations - 10647
Bao Yang is an academic researcher from University of Maryland, College Park. The author has contributed to research in topics: Thermal conductivity & Thermoelectric cooling. The author has an hindex of 44, co-authored 141 publications receiving 7219 citations. Previous affiliations of Bao Yang include Massachusetts Institute of Technology & University of California, Los Angeles.
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Activation field of ferroelectric (Pb,La)(Zr,Ti)O3 thin film capacitors
TL;DR: In this article, the activation field and frequency dependence of the coercive voltage in epitaxial ferroelectric thin film capacitors were measured as a function of La content, and it was shown that a larger c/a ratio leads to a larger activation field.
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Mini-Contact Enhanced Thermoelectric Coolers for On-Chip Hot Spot Cooling
TL;DR: In this article, a package-level numerical simulation is developed to predict the on-chip hot spot cooling capability achievable with such a mini-contact enhanced TEC, focusing on the hot-spot temperature reduction associated with variations in mini contact size and thermoelectric element height.
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Review Article: Thermoelectric Technology Assessment: Application to Air Conditioning and Refrigeration
TL;DR: A critical review of thermoelectric technology and assesses its potential applications in air conditioning and refrigeration is provided in this paper, with an emphasis on those related to air conditioning.
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Thermally Conductive, Electrical Insulating, Optically Transparent Bi-Layer Nanopaper.
Lihui Zhou,Lihui Zhou,Zhi Yang,Wei Luo,Xiaogang Han,Soo-Hwan Jang,Jiaqi Dai,Bao Yang,Liangbing Hu +8 more
TL;DR: For the first time, a thermally conductive, electrically insulating, and optically transparent nanopaper using a bilayer design where a thin layer of boron nitride nanosheets were coated on the CNF-nanopaper is reported.
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Textile Electronics for VR/AR Applications
TL;DR: A systematic review of the literature on the state‐of‐the‐art of interactive devices, fabrication technologies, system integration, promising applications, and challenges involved in textile‐based VR/AR systems is presented.