Benjamin J. Blalock

Bio: Benjamin J. Blalock is an academic researcher from University of Tennessee. The author has contributed to research in topics: CMOS & Power semiconductor device. The author has an hindex of 36, co-authored 235 publications receiving 5091 citations. Previous affiliations of Benjamin J. Blalock include Mississippi State University & Georgia Institute of Technology.

Designing 1-V op amps using standard digital CMOS technology

Abstract: This paper addresses the difficulty of designing 1-V capable analog circuits in standard digital complementary metal-oxide-semiconductor (CMOS) technology, Design techniques for facilitating 1-V operation are discussed and 1-V analog building block circuits are presented. Most of these circuits use the bulk-driving technique to circumvent the metal-oxide-semiconductor field-effect transistor turn-on (threshold) voltage requirement. Finally, techniques are combined within a 1-V CMOS operational amplifier with rail-to-rail input and output ranges. While consuming 300 /spl mu/W, the 1-V rail-to-rail CMOS op amp achieves 1.3-MHz unity-gain frequency and 57/spl deg/ phase margin for a 22-pF load capacitance.

Active Gate Driver for Crosstalk Suppression of SiC Devices in a Phase-Leg Configuration

Abstract: In a phase-leg configuration, the high-switching-speed performance of silicon carbide (SiC) devices is limited by the interaction between the upper and lower devices during the switching transient (crosstalk), leading to additional switching losses and overstress of the power devices. To utilize the full potential of fast SiC devices, this paper proposes two gate assist circuits to actively suppress crosstalk on the basis of the intrinsic properties of SiC power devices. One gate assist circuit employs an auxiliary transistor in series with a capacitor to mitigate crosstalk by gate loop impedance reduction. The other gate assist circuit consists of two auxiliary transistors with a diode to actively control the gate voltage for crosstalk elimination. Based on CREE CMF20120D SiC MOSFETs, the experimental results show that both active gate drivers are effective to suppress crosstalk, enabling turn-on switching losses reduction by up to 17%, and negative spurious gate voltage minimization without the penalty of decreasing the switching speed. Furthermore, both gate assist circuits, even without a negative isolated power supply, are more effective in improving the switching behavior of SiC devices in comparison to the conventional gate driver with a -2 V turn-off gate voltage. Accordingly, the proposed active gate assist circuits are simple, efficient, and cost-effective solutions for crosstalk suppression.

A di/dt Feedback-Based Active Gate Driver for Smart Switching and Fast Overcurrent Protection of IGBT Modules

Abstract: This paper presents an active gate driver (AGD) for IGBT modules to improve their overall performance under normal condition as well as fault condition. Specifically, during normal switching transients, a di/dt feedback controlled current source and current sink is introduced together with a push-pull buffer for dynamic gate current control. Compared to a conventional gate drive strategy, the proposed one has the capability of reducing the switching loss, delay time, and Miller plateau duration during turn-on and turn-off transient without sacrificing current and voltage stress. Under overcurrent condition, it provides a fast protection function for IGBT modules based on the evaluation of fault current level through the di/dt feedback signal. Moreover, the AGD features flexible protection modes, which overcomes the interruption of converter operation in the event of momentary short circuits. A step-down converter is built to evaluate the performance of the proposed driving schemes under various conditions, considering variation of turn-on/off gate resistance, current levels, and short-circuit fault types. Experimental results and detailed analysis are presented to verify the feasibility of the proposed approach.

Temperature-Dependent Short-Circuit Capability of Silicon Carbide Power MOSFETs

Abstract: This paper presents a comprehensive short-circuit ruggedness evaluation and numerical investigation of up-to-date commercial silicon carbide (SiC) MOSFETs. The short-circuit capability of three types of commercial 1200-V SiC MOSFETs is tested under various conditions, with case temperatures from 25 to 200 °C and dc bus voltages from 400 to 750 V. It is found that the commercial SiC MOSFETs can withstand short-circuit current for only several microseconds with a dc bus voltage of 750 V and case temperature of 200 °C. The experimental short-circuit behaviors are compared, and analyzed through numerical thermal dynamic simulation. Specifically, an electrothermal model is built to estimate the device internal temperature distribution, considering the temperature-dependent thermal properties of SiC material. Based on the temperature information, a leakage current model is derived to calculate the main leakage current components (i.e., thermal, diffusion, and avalanche generation currents). Numerical results show that the short-circuit failure mechanisms of SiC MOSFETs can be thermal generation current induced thermal runaway or high-temperature-related gate oxide damage.

Design and Performance Evaluation of Overcurrent Protection Schemes for Silicon Carbide (SiC) Power MOSFETs

Abstract: Overcurrent protection of silicon carbide (SiC) metal-oxide-semiconductor field-effect transistors (MOSFETs) remains a challenge due to lack of practical knowledge. This paper presents three overcurrent protection methods to improve the reliability and overall cost of SiC MOSFET-based converters. First, a solid-state circuit breaker (SSCB) composed primarily by a Si IGBT and a commercial gate driver IC is connected in series with the dc bus to detect and clear overcurrent faults. Second, the desaturation technique using a sensing diode to detect the drain-source voltage under overcurrent faults is implemented as well. Third, a novel active overcurrent protection scheme through dynamic evaluation of fault current level is proposed. The design considerations and potential issues of the protection methods are described and analyzed in detail. A phase-leg configuration-based step-down converter is built to evaluate the performance of the protection schemes under various conditions, considering variation of fault type, decoupling capacitance, protection circuit parameters, etc. Finally, a comparison is made in terms of fault response time, temperature-dependent characteristics, and applications to help designers select a proper protection method.

Design of Analog CMOS Integrated Circuits

Abstract: The CMOS technology area has quickly grown, calling for a new text--and here it is, covering the analysis and design of CMOS integrated circuits that practicing engineers need to master to succeed. Filled with many examples and chapter-ending problems, the book not only describes the thought process behind each circuit topology, but also considers the rationale behind each modification. The analysis and design techniques focus on CMOS circuits but also apply to other IC technologies. Table of contents 1 Introduction to Analog Design 2 Basic MOS Device Physics 3 Single-Stage Amplifiers 4 Differential Amplifiers 5 Passive and Active Current Mirrors 6 Frequency Response of Amplifiers 7 Noise 8 Feedback 9 Operational Amplifiers 10 Stability and Frequency Compensation 11 Bandgap References 12 Introduction to Switched-Capacitor Circuits 13 Nonlinearity and Mismatch 14 Oscillators 15 Phase-Locked Loops 16 Short-Channel Effects and Device Models 17 CMOS Processing Technology 18 Layout and Packaging

Design Of Analog Cmos Integrated Circuits

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GaN-on-Si Power Technology: Devices and Applications

Abstract: In this paper, we present a comprehensive reviewand discussion of the state-of-the-art device technology and application development of GaN-on-Si power electronics. Several device technologies for realizing normally off operation that is highly desirable for power switching applications are presented. In addition, the examples of circuit applications that can greatly benefit from the superior performance of GaN power devices are demonstrated. Comparisonwith other competingpower device technology, such as Si superjunction-MOSFET and SiC MOSFET, is also presented and analyzed. Critical issues for commercialization of GaN-on-Si power devices are discussed with regard to cost, reliability, and ease of use.

Design Of Analog Cmos Integrated Circuits

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Review of Commercial GaN Power Devices and GaN-Based Converter Design Challenges

Abstract: Gallium nitride (GaN) power devices are an emerging technology that have only recently become available commercially. This new technology enables the design of converters at higher frequencies and efficiencies than those achievable with conventional Si devices. This paper reviews the characteristics and commercial status of both vertical and lateral GaN power devices, providing the background necessary to understand the significance of these recent developments. In addition, the challenges encountered in GaN-based converter design are considered, such as the consequences of faster switching on gate driver design and board layout. Other issues include the unique reverse conduction behavior, dynamic $R_{\mathrm {{ds}},\mathrm {{on}}}$ , breakdown mechanisms, thermal design, device availability, and reliability qualification. This review will help prepare the reader to effectively design GaN-based converters, as these devices become increasingly available on a commercial scale.