Brandon W. Pillans

Bio: Brandon W. Pillans is an academic researcher from Raytheon. The author has contributed to research in topics: Radio frequency & Capacitive sensing. The author has an hindex of 13, co-authored 33 publications receiving 1313 citations.

Lifetime characterization of capacitive RF MEMS switches

Abstract: The first experimental characterization of dielectric charging within capacitive RF MEMS switches has been demonstrated. Standard devices have been inserted into a time domain setup and their lifetimes have been characterized as a function of actuation voltage. Switch lifetimes were measured using a dual-pulse waveform with 30 to 65 V of actuation voltage. Resulting lifetimes were between 10/sup 4/ and 10/sup 8/ switch actuations, demonstrating an exponential relationship between lifetime and actuation voltage.

X-band RF MEMS phase shifters for phased array applications

Abstract: In this work, development of a low-loss radio frequency (RF) microelectromechanical (MEMS) 4-bit X-band monolithic phase shifter is presented. These microstrip circuits are fabricated on 0.021-in-thick high-resistivity silicon and are based on a reflection topology using 3-dB Lange couplers. The average insertion loss of the circuit is 1.4 dB with the return loss >11 dB at 8 GHz. To the best of our knowledge, this is a lowest reported loss for X-band phase shifter and promises to greatly reduce the cost of designing and building phase arrays.

Ka-band RF MEMS phase shifters

Abstract: As the need for low-loss phase shifters increases, so does the interest in radio frequency (RF) MEMS as a solution to provide them. In this paper, progress in building low loss Ka-band phase shifters using RF MEMS capacitive switches is demonstrated. Using a switched transmission line 4-bit resonant phase shifter, an average insertion loss of 2.25 dB was obtained with better than 15-dB return loss, a similar 3-bit phase shifter produced an average insertion loss of 1.7 dB with better than 13-dB return loss. Both devices had a phase error of less than 13/spl deg/ in the fundamental states. To our knowledge, these devices represent the lowest loss Ka-band phase shifters reported to date.

Micro-electro-mechanical switch, and methods of making and using it.

Abstract: A micro-electro-mechanical (MEMS) switch (10, 110) has an electrode (22, 122) covered by a dielectric layer (23, 123), and has a flexible conductive membrane (31, 131) which moves between positions spaced from and engaging the dielectric layer. At least one of the membrane and dielectric layer has a textured surface (138) that engages the other thereof in the actuated position. The textured surface reduces the area of physical contact through which electric charge from the membrane can tunnel into and become trapped within the dielectric layer. This reduce the amount of trapped charge that could act to latch the membrane in its actuated position, which in turn effects a significant increase in the operational lifetime of the switch.

An intelligently controlled RF power amplifier with a reconfigurable MEMS-varactor tuner

Abstract: This paper presents an intelligently controlled RF power amplifier with a reconfigurable output tuner using microelectromechanical system (MEMS) switches and a varactor. By switching on/off the MEMS switches and varying the bias voltage of the varactor, the performance of the amplifier is optimized for input signals with known or unknown frequencies in a range of 8-12 GHz. Fabrication-related unit-to-unit variations of the amplifier are overcome by the reconfigurable tuner. Directed algorithms based on a characterization table and on black-box genetic algorithms are developed for optimization and search.

RF MEMS switches and switch circuits

Abstract: MEMS switches are devices that use mechanical movement to achieve a short circuit or an open circuit in the RF transmission line. RF MEMS switches are the specific micromechanical switches that are designed to operate at RF-to-millimeter-wave frequencies (0.1 to 100 GHz). The forces required for the mechanical movement can be obtained using electrostatic, magnetostatic, piezoelectric, or thermal designs. To date, only electrostatic-type switches have been demonstrated at 0.1-100 GHz with high reliability (100 million to 10 billion cycles) and wafer-scale manufacturing techniques. It is for this reason that this article will concentrate on electrostatic switches.

Interferometric modulation of radiation

Abstract: An Interferometric Modulator (IMod) is a microelectromechanical device for modulating light using interference. The colors of these devices may be determined in a spatial fashion, and their inherent color shift may be compensated for using several optical compensation mechanisms. Brightness, addressing, and driving of IMods may be accomplished in a variety of ways with appropriate packaging, and peripheral electronics which can be attached and/or fabricated using one of many techniques. The devices may be used in both embedded and directly perceived applications, the latter providing multiple viewing modes as well as a multitude of product concepts ranging in size from microscopic to architectural in scope.

Photonic mems and structures

Abstract: An interference modulator (Imod) incorporates anti-reflection coatings and/or micro-fabricated supplemental lighting sources. An efficient drive scheme is provided for matrix addressed arrays of IMods or other micromechanical devices. An improved color scheme provides greater flexibility. Electronic hardware can be field reconfigured to accommodate different display formats and/or application functions. An IMod's electromechanical behavior can be decoupled from its optical behavior. An improved actuation means is provided, some one of which may be hidden from view. An IMod or IMod array is fabricated and used in conjunction with a MEMS switch or switch array. An IMod can be used for optical switching and modulation. Some IMods incorporate 2-D and 3-D photonic structures. A variety of applications for the modulation of light are discussed. A MEMS manufacturing and packaging approach is provided based on a continuous web fed process. IMods can be used as test structures for the evaluation of residual stress in deposited materials.

A method for fabricating a structure for a microelectromechanical systems (mems) device

Abstract: The invention provides a microfabrication process which may be used to manufacture a MEMS device. The process comprises depositing one or a stack of layers on a base layer, said one layer or an uppermost layer in said stack of layers being a sacrificial layer; patterning said one or a stack of layers to provide at least one aperture therethrough through which said base layer is exposed; depositing a photosensitive layer over said one or a stack of layers; and passing light through said at least one aperture to expose said photosensitive layer.

Process for modifying offset voltage characteristics of an interferometric modulator

Abstract: An interferometric modulator manufactured according to a particular set of processing parameters may have a non-zero offset voltage. A process has been developed for modifying the processing parameters to shift the non-zero offset voltage closer to zero. For example, the process may involve identifying a set of processing parameters for manufacturing an interferometric modulator that results in a non-zero offset voltage for the interferometric modulator. The set of processing parameters may then be modified to shift the non-zero offset voltage closer to zero. For example, modifying the set of processing parameters may involve modifying one or more deposition parameters used to make the interferometric modulator, applying a current (e.g., a counteracting current) to the interferometric modulator, and/or annealing the interferometric modulator. Interferometric modulators made according to the set of modified processing parameters may have improved performance and/or simpler drive schemes.