Bruce Archambeault

Bio: Bruce Archambeault is an academic researcher from Missouri University of Science and Technology. The author has contributed to research in topics: Decoupling capacitor & Electromagnetic interference. The author has an hindex of 19, co-authored 109 publications receiving 1559 citations. Previous affiliations of Bruce Archambeault include Durham University & Research Triangle Park.

Feature selective validation (FSV) for validation of computational electromagnetics (CEM). part II- assessment of FSV performance

Abstract: The feature selective validation (FSV) method has been proposed as a technique to allow the objective, quantified, comparison of data for inter alia validation of computational electromagnetics. In the companion paper "Feature selective validation for validation of computational electromagnetics. Part I-The FSV method," the method was outlined in some detail. This paper addresses two specific issues related to the implementation of the FSV method, namely "how well does it produce results that agree with visual assessment?" and "what benefit can it provide in a practical validation environment?" The first of these questions is addressed by comparing the FSV output to the results of an extensive survey of EMC engineers from several countries. The second is approached via a case study analysis

Signal Integrity Design for High-Speed Digital Circuits: Progress and Directions

Abstract: This paper reviews recent progress and future directions of signal integrity design for high-speed digital circuits, focusing on four areas: signal propagation on transmission lines, discontinuity modeling and characterization, measurement techniques, and link-path design and analysis.

Review of Printed-Circuit-Board Level EMI/EMC Issues and Tools

Abstract: A comprehensive review of printed circuit board (PCB) electromagnetic compatibility (EMC) issues, analysis techniques, and possible solutions would fill a large book or more. This review takes a quick look at where the technology of PCB EMC control has been, where it is today, and where it needs to go for the future. As data rates on PCBs have increased, new problems have arisen, requiring new analysis techniques and new solutions. Further development will be needed to keep up with the ever-increasing data rates and smaller form factors.

Compact Configuration for Common Mode Filter Design based on Planar Electromagnetic Bandgap Structures

Abstract: A planar electromagnetic bandgap configuration of a compact common mode filter that is laid out on printed circuit board is studied. This filter is used to mitigate the common mode noise traveling on high-speed differential signal traces. These differential signal lines may be connected to I/O connectors and cables and small amounts of common mode noise can result in significant electromagnetic emissions. The filter is obtained by a very simple planar geometry based on the electromagnetic bandgap structures. A cavity made by a rectangular/square patch (together with a solid plane underneath) has a well known and predictable resonant behavior; the coupling between the differential pair routed on top of the patterned plane and the patch cavity, occurring when the traces cross the gap between adjacent patches, is used to reduce the energy associated with the propagation of the common mode noise. The properties of this filter are studied taking into account the layout of a real differential microstrip and the number of gap crossings. A compact configuration is proposed. Time domain simulations validate the suggested layout approach.

EMI Emissions from mismatches in High Speed Differential Signal Traces and Cables

Abstract: The use of so-called differential signaling for high speed signals has become very common in today's high speed system designs. While this signal strategy allows better data quality and signal integrity, there are some significant EMC and signal integrity issues that are not readily apparent. This paper demonstrates that a significant amount of common-mode current can be created when the two legs of the differential signal are skewed in time, or if the rise and fall times of the signals differ. These common mode currents can impact the EMC performance, causing significant levels of emissions unless careful design consideration is given to shielding and common-mode (ground) current return.

Overview of Power Integrity Solutions on Package and PCB: Decoupling and EBG Isolation

Abstract: Mitigating power distribution network (PDN) noise is one of the main efforts for power integrity (PI) design in high-speed or mixed-signal circuits. Possible solutions, which are based on decoupling or isolation concept, for suppressing PDN noise on package or printed circuit board (PCB) levels are reviewed in this paper. Keeping the PDN impedance very low in a wide frequency range, except at dc, by employing a shunt capacitors, which can be in-chip, package, or PCB levels, is the first priority way for PI design. The decoupling techniques including the planes structure, surface-mounted technology decoupling capacitors, and embedded capacitors will be discussed. The isolation approach that keeps part of the PDN at high impedance is another way to reduce the PDN noise propagation. Besides the typical isolation approaches such as the etched slots and filter, the new isolation concept using electromagnetic bandgap structures will also be discussed.

Overview of Signal Integrity and EMC Design Technologies on PCB: Fundamentals and Latest Progress

Abstract: This paper reviews the fundamentals and latest progress of modeling, analysis, and design technologies for signal integrity and electromagnetic compatibility on PCB and package in the past decades. Most results in this field are based on the very rich and highly educational literature produced by Prof. C. Paul in his long scientific career. The inclusion of parameters variability effects is also considered, and it is demonstrated how statistical simulations can become affordable by means of recently-introduced stochastic methods. Finally, the necessity of practical training of designers is mentioned, and an experience relying on realistic PCB demonstrators is illustrated.