C. Prakash

Bio: C. Prakash is an academic researcher from University of Minnesota. The author has contributed to research in topics: Heat transfer coefficient & Rayleigh number. The author has an hindex of 2, co-authored 2 publications receiving 123 citations.

Introduction to Computational Fluid Dynamics

Abstract: Introduction to Computational Fluid Dynamics is a textbook for advanced undergraduate and first year graduate students in mechanical, aerospace and chemical engineering. The book emphasizes understanding CFD through physical principles and examples. The author follows a consistent philosophy of control volume formulation of the fundamental laws of fluid motion and energy transfer, and introduces a novel notion of 'smoothing pressure correction' for solution of flow equations on collocated grids within the framework of the well-known SIMPLE algorithm. The subject matter is developed by considering pure conduction/diffusion, convective transport in 2-dimensional boundary layers and in fully elliptic flow situations and phase-change problems in succession. The book includes chapters on discretization of equations for transport of mass, momentum and energy on Cartesian, structured curvilinear and unstructured meshes, solution of discretised equations, numerical grid generation and convergence enhancement. Practising engineers will find this particularly useful for reference and for continuing education.

Thermal Control of Electronic Equipment and Devices

Abstract: Publisher Summary Thermal control of electronic components has one principal objective, to maintain relatively constant component temperature equal to or below the manufacturer's maximum specified service temperature, typically between 85 and 100°C. It is noted that even a single component operating 10°C beyond this temperature can reduce the reliability of certain systems by as much as 50%. Therefore, it is important for the new thermal control schemes to be capable of eliminating hot spots within the electronic devices, removing heat from these devices and dissipating this heat to the surrounding environment. Several strategies have developed over the years for controlling and removing the heat generated in multichip modules, which include advanced air-cooling schemes, direct cooling, and miniature thermosyphons or free-falling liquid films. The chapter summarizes analytical, numerical, and experimental work in literature, in order to facilitate the improvement of existing schemes and provide a basis for the development of new ones. The chapter focuses on investigations performed over the past decade and includes information on the thermal control of semiconductor devices, modules, and total systems.