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Carlo Magro

Researcher at STMicroelectronics

Publications -  11
Citations -  512

Carlo Magro is an academic researcher from STMicroelectronics. The author has contributed to research in topics: Digital holography & Holographic interferometry. The author has an hindex of 5, co-authored 11 publications receiving 478 citations.

Papers
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Journal ArticleDOI

Compensation of the inherent wave front curvature in digital holographic coherent microscopy for quantitative phase-contrast imaging

TL;DR: An approach is proposed for removing the wavefront curvature introduced by the microscope imaging objective in digital holography, which otherwise hinders the phase contrast imaging at reconstruction planes and it is shown that a correction effect can be obtained at all reconstruction planes.
Proceedings ArticleDOI

Digital holography for characterization and testing of MEMS structures

TL;DR: Digital holography is proposed as a non-contact method for the inspection and characterization of MEMS and can be useful for assessing the fabrication process and the functionality as well as the reliability of micromachined structures.
Journal ArticleDOI

Digital holography microscope as tool for microelectromechanical systems characterization and design

TL;DR: The high sensitivity of the proposed method enables us to precisely determine the structure morphology and calculate the intrinsic stress and bending moment, in good agreement with an analytical model, and can be exploited to assess the fabrication process and the functionality as well as the reliability of micromachined structures.
Proceedings ArticleDOI

Characterization of MEMS structures by microscopic digital holography

TL;DR: In this article, the use of digital holography (DH) as a metrological tool for inspection and characterization of MEMS structures was proposed, which can be efficiently employed to assess the fabrication process of micro structures as well as to test their behaviour in operative conditions.
Patent

Microstructure device comprising a face to face electromagnetic near field coupling between stacked device portions and method of forming the device

TL;DR: In this article, a galvanic-isolated coupling of circuit portions is accomplished on the basis of a stacked chip configuration, which can be fabricated on any appropriate process technology, thereby incorporating one or more coupling elements, such as primary or secondary coils of a micro transformer, wherein the final characteristics of the micro transformer are adjusted during the wafer bond process.