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Chang Young Lee

Researcher at Ulsan National Institute of Science and Technology

Publications -  60
Citations -  4358

Chang Young Lee is an academic researcher from Ulsan National Institute of Science and Technology. The author has contributed to research in topics: Carbon nanotube & Nanotube. The author has an hindex of 26, co-authored 57 publications receiving 3484 citations. Previous affiliations of Chang Young Lee include University of Illinois at Urbana–Champaign & RMIT University.

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High-resolution electrohydrodynamic jet printing

TL;DR: Key aspects of the physics of this approach, which has some features in common with related but comparatively low-resolution techniques for graphic arts, are revealed through direct high-speed imaging of the droplet formation processes.
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Wearable smart sensor systems integrated on soft contact lenses for wireless ocular diagnostics.

TL;DR: A multifunctional contact lens sensor that can measure the glucose level in tear fluid and intraocular pressure simultaneously but yet independently based on different electrical responses is developed.
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Soft, smart contact lenses with integrations of wireless circuits, glucose sensors, and displays

TL;DR: This study reports an unconventional approach for the fabrication of a soft, smart contact lens in which glucose sensors, wireless power transfer circuits, and display pixels to visualize sensing signals in real time are fully integrated using transparent and stretchable nanostructures.
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Coherence Resonance in a Single-Walled Carbon Nanotube Ion Channel

TL;DR: It is shown that a single-walled carbon nanotube demonstrates oscillations in electroosmotic current through its interior at specific ranges of electric field that are the signatures of coherence resonance, illustrating how simple ionic transport can generate coherent waveforms within an inherently noisy environment.
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Three-Dimensional, High-Resolution Printing of Carbon Nanotube/Liquid Metal Composites with Mechanical and Electrical Reinforcement

TL;DR: The material and the processing required for stretchable 3D interconnections on the soft forms of devices and substrates with high resolutions are introduced.