Author
Charles A. Harper
Bio: Charles A. Harper is an academic researcher. The author has contributed to research in topics: Electronic packaging & Printed circuit board. The author has an hindex of 12, co-authored 14 publications receiving 1386 citations.
Papers
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Book•
01 Sep 1996
TL;DR: In this article, the authors present a glossary of terms and definitions used in the Plastics Industry Appendix C: Important Properties for Designing With Plastics Appendix D: Electrical Properties of Resins and Compounds Appendix E: Sources of Specifications and Standards for Plastics and Composites Index
Abstract: Preface Contributors About the Editor Chapter 1: Thermoplastics Chapter 2: Thermosets, Reinforced Plastics, and Composites Chapter 3: Elastomeric Materials and Processes Chapter 4: Composite Materials and Processes Chapter 5: Metal Matrix Composites, Ceramic Matrix Composites, Carbon Matrix Composites, and Thermally Conductive Polymer Matrix Composites Chapter 6: Plastics in Coatings and Finishes Chapter 7: Plastics and Elastomers in Adhesives Chapter 8: Plastics Joining Chapter 9: Design and Processing of Plastic Parts Chapter 10: Automotive Plastics and Elastomer Applications Chapter 11: Plastics in Packaging Chapter 12: Plastics Recycling Appendix A: Glossary of Terms and Definitions Appendix B: Some Common Abbreviations Used in the Plastics Industry Appendix C: Important Properties for Designing With Plastics Appendix D: Electrical Properties of Resins and Compounds Appendix E: Sources of Specifications and Standards for Plastics and Composites Index
401 citations
Book•
18 Feb 2000
TL;DR: In this article, Plastics, elastomers, and composites are discussed, along with adhesives, underfills, and coatings for printed circuit board technology.
Abstract: Table of contents
CONTRIBUTORS
PREFACE
Chapter 1: Plastics, Elastomers, and Composites
Chapter 2: Adhesives, Underfills, and Coatings
Chapter 3: Thermal Management
Chapter 4: Connector and Interconnection Technology
Chapter 5: Solder Technologies for Electronic Packaging and Assembly
Chapter 6: Packaging and Interconnection of Integrated Circuits
Chapter 7: Hybrid Microelectronics and Multichip Modules
Chapter 8: Chip Scale, Flip Chip, and Advanced Chip Packaging Technologies
Chapter 9: Rigid and Flexible Printed Circuit Board Technology
Chapter 10: Packaging of High-Speed and Microwave Electronic Systems
INDEX
374 citations
Book•
27 Mar 2001
TL;DR: This chapter discusses Ceramics, Glasses, and Micas for Electrical Products, as well as Inorganic Glasses--Commercial Glass Families, Applications, and Manufacturing Methods.
Abstract: Chapter 1: Ceramic Materials and Properties. Chapter 2: Ceramics, Glasses, and Micas for Electrical Products. Chapter 3: Electronic Ceramics. Chapter 4: Advanced Ceramics and Composites. Chapter 5: Inorganic Glasses--Structure, Composition and Properties. Chapter 6: Inorganic Glasses--Commercial Glass Families, Applications, and Manufacturing Methods. Chapter 7: Advanced Applications of Glass. Chapter 8: Ceramics and Glasses in Microelectronics. Chapter 9: Industrial Diamond.
135 citations
Book•
29 Aug 2003
TL;DR: Handbook of building materials for fire protection as discussed by the authors, Handbook of Building Materials for Fire Protection (HBSFPA), Handbook of Fire Protection for Building Materials (HFPFPA).
Abstract: Handbook of building materials for fire protection , Handbook of building materials for fire protection , مرکز فناوری اطلاعات و اطلاع رسانی کشاورزی
129 citations
Book•
01 Aug 2003105 citations
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22 May 2009
TL;DR: In this article, the authors present key data on approximately 200 important polymers currently in industrial use or under study in industrial or academic research, including platics, artificial fibers, rubber, cellulose, and many other materials.
Abstract: Polymers are the compounds that includes platics, artificial fibers, rubber, cellulose, and many other materials, including coatings and adhesives. This book presents key data on approximately 200 important polymers currently in industrial use or under study in industrial or academic research. No other single source covers so many polymers or offers such a depth of data. The book standardizes and makes accessible a wealth of essential data for students, teachers, researchers, and other professionals in chemistry and chemical engineering.
2,281 citations
TL;DR: Hazardous substances used in polymer production for which the risks should be evaluated for decisions on the need for risk reduction measures, substitution, or even phase out are identified.
1,091 citations
TL;DR: The physical and particle properties of WEEE are presented and it is expected that a mechanical recycling process will be developed for the upgrading of low metal content scraps.
956 citations
TL;DR: Paper as discussed by the authors describes several low-cost methods for fabricating flexible electronic circuits on paper, which include metallic wires (e.g., tin or zinc) that are deposited on the substrate by evaporation, sputtering, or airbrushing, and discrete surface-mountable electronic components that are fastened with conductive adhesive directly to the wires.
Abstract: This paper describes several low-cost methods for fabricating flexible electronic circuits on paper. The circuits comprise i) metallic wires (e.g., tin or zinc) that are deposited on the substrate by evaporation, sputtering, or airbrushing, and ii) discrete surface-mountable electronic components that are fastened with conductive adhesive directly to the wires. These electronic circuits—like conventional printed circuit boards—can be produced with electronic components that connect on both sides of the substrate. Unlike printed circuit boards made from fiberglass, ceramics, or polyimides, however, paper can be folded and creased (repeatedly), shaped to form three-dimensional structures, trimmed using scissors, used to wick fluids (e.g., for microfluidic applications) and disposed of by incineration. Paper-based electronic circuits are thin and lightweight; they should be useful for applications in consumer electronics and packaging, for disposable systems for uses in the military and homeland security, for applications in medical sensing or low-cost portable diagnostics, for paper-based microelectromechanical systems, and for applications involving textiles.
705 citations
TL;DR: In this article, the authors used noncovalently functionalized, soluble single-walled carbon nanotubes (SWNTs) to construct composites with very low percolation threshold (0.05 − 0.1 wt
Abstract: Homogeneous carbon nanotube/polymer composites were fabricated using noncovalently functionalized, soluble single-walled carbon nanotubes (SWNTs). These composites showed dramatic improvements in the electrical conductivity with very low percolation threshold (0.05–0.1 wt % of SWNT loading). By significantly improving the dispersion of SWNTs in commercial polymers, we show that only very low SWNT loading is needed to achieve the conductivity levels required for various electrical applications without compromising the host polymer’s other preferred physical properties and processability. In contrast to previous techniques, our method is applicable to various host polymers and does not require lengthy sonication.
640 citations