Chenming Hu

Bio: Chenming Hu is an academic researcher from University of California, Berkeley. The author has contributed to research in topics: MOSFET & Gate oxide. The author has an hindex of 119, co-authored 1296 publications receiving 57264 citations. Previous affiliations of Chenming Hu include Motorola & National Chiao Tung University.

MOSFET Modeling & BSIM3 User's Guide

Abstract: Preface. 1. Introduction. 2. Significant Physical Effects In Modern MOSFETs. 3. Threshold Voltage Model. 4. I-V Model. 5. Capacitance Model. 6. Substrate Current Model. 7. Noise Model. 8. Source/Drain Parasitics Model. 9. Temperature Dependence Model. 10. Non-quasi Static (NQS) Model. 11. BSIM3v3 Model Implementation. 12. Model Testing. 13. Model Parameter Extraction. 14. RF and Other Compact Model Applications. Appendices. Index.

Stress-induced current in thin silicon dioxide films

Abstract: Low-field current following Fowler-Nordheim stress of thin gate oxides is studied The conduction mechanism is attributed to trap-assisted tunneling of electrons For oxides thicker than 100 AA, this stress-induced current is observed to decay as traps are filled without significant tunneling out of traps In thinner oxides, steady-state current flows when there is an equilibrium between trap filling and emptying processes This model is observed to be consistent with stress-induced current behavior in a wide range of oxide thicknesses (60 AA to 130 AA) and process technologies >

An adjustable work function technology using Mo gate for CMOS devices

Abstract: Nitrogen implantation of Mo gate was used to fabricate MOS capacitors and CMOS transistors. Initial studies demonstrate that the work function of Mo is sensitive to nitrogen implantation energy. Mo with (110) orientation exhibits a high work function, making it suitable for bulk p-MOSFET gate electrodes. Nitrogen implantation can be used to lower the Mo work function, making it suitable for n-MOSFET gate electrodes. A gate work function reduction of 0.42 eV was achieved for the n-FETs on CMOS wafers. With further optimization, this single metal gate technology may potentially replace conventional poly-Si gate technology for CMOS and can also be used for multiple-VTtechnologies.

A simple method to characterize substrate current in MOSFET's

Abstract: Experimental verification of substrate current characteristics is thoroughly carried out. V DS - V DSAT , instead of V DS , is shown to be the driving force of all hot-electron effects. A simple relationship between substrate current and V DS - V DSAT is found. This relationship provides a convenient tool to characterize the substrate current or the channel electric field, and, hence, all hot-electron effects. Measurements of I SUB /I D and V DS - V DSAT at two bias points and any one channel length are sufficient to fully characterize the substrate currents for all channel lengths V DS 's and V G 's for a given technology.

Direct tunneling leakage current and scalability of alternative gate dielectrics

Abstract: We explore the scaling limits of alternative gate dielectrics based on their direct tunneling characteristics and gate leakage requirements for future complementary metal–oxide–semiconductor technology generations. Important material parameters such as the tunneling effective mass are extracted for several promising high-κ gate dielectrics. We also introduce a figure of merit for comparing the relative advantages of gate dielectric candidates. Using an accurate direct tunneling gate current model and specifications from the International Technology Roadmap for Semiconductors, we provide guidelines for the selection of gate dielectrics to satisfy the off-state leakage current requirements of future high-performance and low power technologies.

I and i

Abstract: There is, I think, something ethereal about i —the square root of minus one. I remember first hearing about it at school. It seemed an odd beast at that time—an intruder hovering on the edge of reality. Usually familiarity dulls this sense of the bizarre, but in the case of i it was the reverse: over the years the sense of its surreal nature intensified. It seemed that it was impossible to write mathematics that described the real world in …

疟原虫var基因转换速率变化导致抗原变异[英]／Paul H, Robert P, Christodoulou Z, et al//Proc Natl Acad Sci U S A

Abstract: 抗原变异可使得多种致病微生物易于逃避宿主免疫应答。表达在感染红细胞表面的恶性疟原虫红细胞表面蛋白1（PfPMP1）与感染红细胞、内皮细胞、树突状细胞以及胎盘的单个或多个受体作用，在黏附及免疫逃避中起关键的作用。每个单倍体基因组var基因家族编码约60种成员，通过启动转录不同的var基因变异体为抗原变异提供了分子基础。

High-κ gate dielectrics: Current status and materials properties considerations

Abstract: Many materials systems are currently under consideration as potential replacements for SiO2 as the gate dielectric material for sub-0.1 μm complementary metal–oxide–semiconductor (CMOS) technology. A systematic consideration of the required properties of gate dielectrics indicates that the key guidelines for selecting an alternative gate dielectric are (a) permittivity, band gap, and band alignment to silicon, (b) thermodynamic stability, (c) film morphology, (d) interface quality, (e) compatibility with the current or expected materials to be used in processing for CMOS devices, (f) process compatibility, and (g) reliability. Many dielectrics appear favorable in some of these areas, but very few materials are promising with respect to all of these guidelines. A review of current work and literature in the area of alternate gate dielectrics is given. Based on reported results and fundamental considerations, the pseudobinary materials systems offer large flexibility and show the most promise toward success...

Design of Analog CMOS Integrated Circuits

Abstract: The CMOS technology area has quickly grown, calling for a new text--and here it is, covering the analysis and design of CMOS integrated circuits that practicing engineers need to master to succeed. Filled with many examples and chapter-ending problems, the book not only describes the thought process behind each circuit topology, but also considers the rationale behind each modification. The analysis and design techniques focus on CMOS circuits but also apply to other IC technologies. Table of contents 1 Introduction to Analog Design 2 Basic MOS Device Physics 3 Single-Stage Amplifiers 4 Differential Amplifiers 5 Passive and Active Current Mirrors 6 Frequency Response of Amplifiers 7 Noise 8 Feedback 9 Operational Amplifiers 10 Stability and Frequency Compensation 11 Bandgap References 12 Introduction to Switched-Capacitor Circuits 13 Nonlinearity and Mismatch 14 Oscillators 15 Phase-Locked Loops 16 Short-Channel Effects and Device Models 17 CMOS Processing Technology 18 Layout and Packaging

Prospects of Colloidal Nanocrystals for Electronic and Optoelectronic Applications

Abstract: Nanocrystals (NCs) discussed in this Review are tiny crystals of metals, semiconductors, and magnetic material consisting of hundreds to a few thousand atoms each. Their size ranges from 2-3 to about 20 nm. What is special about this size regime that placed NCs among the hottest research topics of the last decades? The quantum mechanical coupling * To whom correspondence should be addressed. E-mail: dvtalapin@uchicago.edu. † The University of Chicago. ‡ Argonne National Lab. Chem. Rev. 2010, 110, 389–458 389