Chenming Hu

Bio: Chenming Hu is an academic researcher from University of California, Berkeley. The author has contributed to research in topics: MOSFET & Gate oxide. The author has an hindex of 119, co-authored 1296 publications receiving 57264 citations. Previous affiliations of Chenming Hu include Motorola & National Chiao Tung University.

SOI and device scaling

Abstract: In the past five years, impressive progress has been made in SOI materials, device and process demonstrations, and product research, yet SOI IC technology remains a promise more than a reality. An important reason is that the rate of bulk technology scaling, in terms of gate length, gate oxide thickness, threshold voltage (V/sub t/), and performance has exceeded earlier expectations (Hu, 1995). In an environment of rapidly advancing bulk technology, it was difficult to overcome the concern over the known and unknown risks of adopting SOI technology, as it was not known how the situation might change with future scaling. This paper attempts to highlight some considerations in three phases of device scaling-when bulk device scaling may proceed rapidly, slowly, and with extreme difficulty.

Suppressing Non-Uniform Tunneling in InAs/GaSb TFET With Dual-Metal Gate

Abstract: Non-uniformity in electric field causes early onset of tunneling near the edge of InAs/GaSb hetero-junction tunneling field-effect transistors. When a small area, often an edge, of the tunneling junction has a lower turn-on voltage, the steep switching characteristic is degraded. Fermi pinning at InAs surface greatly worsen the uniformity. We propose a dual-metal gate structure to address the non-uniformity issue. With proper choice of work functions, the dual-metal gate structure can effectively suppress the early onset of edge tunneling and significantly improve the subthreshold swing.

Simulation of SOI devices and circuits using BSIM3SOI

Abstract: A versatile SOI model derived from the BSIM3v3 bulk MOSFET model is capable of simulating partially and fully depleted devices with options for self-heating and floating body effects. The model can automatically switch between fully and partially depleted regimes. After refining body current models we for the first time present successful dc and transient device and circuit simulation of an SOI MOSFET technology with L/sub eff/ below 0.2 /spl mu/m.

Flicker-Noise Impact on Scaling of Mixed-Signal CMOS With HfSiON

Abstract: The flicker noise in MOSFETs with short gate lengths (L < 1 mum) is severely degraded by the presence of a thick high-k gate dielectric layer. The gate length dependence of flicker noise becomes stronger with increasing high-k dielectric thickness - but only for n-FET. To explain these phenomena, a model based on excess traps at the gate edges has been developed. This model explains the flicker-noise dependence on high-k dielectric thickness and gate length and has successfully reproduced the experimental data. Based on the model, the impact of gate-length scaling is evaluated for future mixed-signal ICs using high-k gate-dielectric technology. The deployment of high-k gate dielectric adds another gate-length-scaling limit for analog devices due to the noise consideration.

SOI chip with mesa isolation and recess resistant regions

Abstract: A semiconductor-on-insulator structure includes a substrate and a buried insulator layer overlying the substrate. A plurality of semiconductor islands overlie the buried insulator layer. The semiconductor islands are isolated from one another by trenches. A plurality of recess resistant regions overlie the buried insulator layer at a lower surface of the trenches.

I and i

Abstract: There is, I think, something ethereal about i —the square root of minus one. I remember first hearing about it at school. It seemed an odd beast at that time—an intruder hovering on the edge of reality. Usually familiarity dulls this sense of the bizarre, but in the case of i it was the reverse: over the years the sense of its surreal nature intensified. It seemed that it was impossible to write mathematics that described the real world in …

疟原虫var基因转换速率变化导致抗原变异[英]／Paul H, Robert P, Christodoulou Z, et al//Proc Natl Acad Sci U S A

Abstract: 抗原变异可使得多种致病微生物易于逃避宿主免疫应答。表达在感染红细胞表面的恶性疟原虫红细胞表面蛋白1（PfPMP1）与感染红细胞、内皮细胞、树突状细胞以及胎盘的单个或多个受体作用，在黏附及免疫逃避中起关键的作用。每个单倍体基因组var基因家族编码约60种成员，通过启动转录不同的var基因变异体为抗原变异提供了分子基础。

High-κ gate dielectrics: Current status and materials properties considerations

Abstract: Many materials systems are currently under consideration as potential replacements for SiO2 as the gate dielectric material for sub-0.1 μm complementary metal–oxide–semiconductor (CMOS) technology. A systematic consideration of the required properties of gate dielectrics indicates that the key guidelines for selecting an alternative gate dielectric are (a) permittivity, band gap, and band alignment to silicon, (b) thermodynamic stability, (c) film morphology, (d) interface quality, (e) compatibility with the current or expected materials to be used in processing for CMOS devices, (f) process compatibility, and (g) reliability. Many dielectrics appear favorable in some of these areas, but very few materials are promising with respect to all of these guidelines. A review of current work and literature in the area of alternate gate dielectrics is given. Based on reported results and fundamental considerations, the pseudobinary materials systems offer large flexibility and show the most promise toward success...

Design of Analog CMOS Integrated Circuits

Abstract: The CMOS technology area has quickly grown, calling for a new text--and here it is, covering the analysis and design of CMOS integrated circuits that practicing engineers need to master to succeed. Filled with many examples and chapter-ending problems, the book not only describes the thought process behind each circuit topology, but also considers the rationale behind each modification. The analysis and design techniques focus on CMOS circuits but also apply to other IC technologies. Table of contents 1 Introduction to Analog Design 2 Basic MOS Device Physics 3 Single-Stage Amplifiers 4 Differential Amplifiers 5 Passive and Active Current Mirrors 6 Frequency Response of Amplifiers 7 Noise 8 Feedback 9 Operational Amplifiers 10 Stability and Frequency Compensation 11 Bandgap References 12 Introduction to Switched-Capacitor Circuits 13 Nonlinearity and Mismatch 14 Oscillators 15 Phase-Locked Loops 16 Short-Channel Effects and Device Models 17 CMOS Processing Technology 18 Layout and Packaging

Prospects of Colloidal Nanocrystals for Electronic and Optoelectronic Applications

Abstract: Nanocrystals (NCs) discussed in this Review are tiny crystals of metals, semiconductors, and magnetic material consisting of hundreds to a few thousand atoms each. Their size ranges from 2-3 to about 20 nm. What is special about this size regime that placed NCs among the hottest research topics of the last decades? The quantum mechanical coupling * To whom correspondence should be addressed. E-mail: dvtalapin@uchicago.edu. † The University of Chicago. ‡ Argonne National Lab. Chem. Rev. 2010, 110, 389–458 389