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Author

Chenming Hu

Other affiliations: Motorola, National Chiao Tung University, Semtech  ...read more
Bio: Chenming Hu is an academic researcher from University of California, Berkeley. The author has contributed to research in topics: MOSFET & Gate oxide. The author has an hindex of 119, co-authored 1296 publications receiving 57264 citations. Previous affiliations of Chenming Hu include Motorola & National Chiao Tung University.
Topics: MOSFET, Gate oxide, CMOS, Gate dielectric, Transistor


Papers
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Journal ArticleDOI
TL;DR: In this article, a compact model and analysis of key parameters on negative capacitance FinFET (NC-FinFET) operation is presented, and an experimental NC-Fin-FET device is accurately modeled and the experimentally calibrated parameters are used to analyze the performance and its dependence on several key parameters.
Abstract: In this letter, we present a compact model and analyze the impact of key parameters on negative capacitance FinFET (NC-FinFET) device operation. The developed model solves FinFET device electrostatics and Landau–Khalatnikov equations self-consistently. An experimental NC-FinFET device is accurately modeled and the experimentally calibrated parameters are used to analyze the NC-FinFETs device performance and its dependence on several key parameters.

73 citations

Journal ArticleDOI
TL;DR: In this article, the impact of device scaling and power supply voltage change on CMOS inverter's performance is investigated based on a new empirical mobility model that is solely dependent on V/sub gs/, V/ sub t/, and T/sub ox and a corresponding saturation drain current (I/sub dsat/) model.
Abstract: Based a new empirical mobility model that is solely dependent on V/sub gs/, V/sub t/, and T/sub ox/ and a corresponding saturation drain current (I/sub dsat/) model, the impact of device scaling and power supply voltage change on CMOS inverter's performance is investigated in this paper. It shows that the T/sub ox/ which maximizes inverter's speed may be thicker than reliability consideration requires. In addition, very high speed can be achieved even at low V/sub dd/ (for low power applications) if V/sub t/ can be lowered.

73 citations

Patent
06 Dec 2002
TL;DR: An inverter that includes a first multiple-gate transistor including a source connected to a power supply, a drain connected to an output terminal, and a gate electrode is described in this paper.
Abstract: An inverter that includes a first multiple-gate transistor including a source connected to a power supply, a drain connected to an output terminal, and a gate electrode; a second multiple-gate transistor including a source connected to a ground, a drain connected to the output terminal, and a gate electrode; and an input terminal connected to the gate electrodes of the first and second multiple-gate transistors. Each of the first and second multiple-gate transistors may further include a semiconductor fin formed vertically on an insulating layer on top of a substrate, a gate dielectric layer overlying the semiconductor fin, and a gate electrode wrapping around the semiconductor fin separating the source and drain regions.

73 citations

Journal ArticleDOI
TL;DR: In this article, the operation of a ferroelectric DRAM (dynamic random access memory) cell for nonvolatile RAM (NVRAM) applications is described, and the resistivity and endurance properties of ferro-electric films can be optimized by modifying the composition of the film.
Abstract: The operation of a ferroelectric DRAM (dynamic random access memory) cell for nonvolatile RAM (NVRAM) applications is described. Because polarization reversal only occurs during nonvolatile store/recall operations and not during read/write operations, ferroelectric fatigue is not a serious endurance problem. For a 3-V power supply, the worst-case effective silicon dioxide thickness of the unoptimized lead zirconate titanate film studied is less than 17 AA. The resistivity and endurance properties of ferroelectric films can be optimized by modifying the composition of the film. This cell can be the basis of a very-high-density NVRAM with practically no read/write cycle limit and at least 10/sup 10/ nonvolatile store/recall cycles. >

72 citations

Proceedings ArticleDOI
03 Dec 2001
TL;DR: In this paper, the use of complementary low-barrier silicides for reducing the series resistance of thin-body silicon-on-insulator (SOI) devices was investigated.
Abstract: The use of complementary low-barrier silicides is investigated for reducing the series resistance of thin-body silicon-on-insulator (SOI) devices. Two different thin-body device types are simulated, one in which the source/drain regions are formed by the silicide without doping, and another in which the silicide source/drains are terminated by a doped extension region.

72 citations


Cited by
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Journal ArticleDOI

[...]

08 Dec 2001-BMJ
TL;DR: There is, I think, something ethereal about i —the square root of minus one, which seems an odd beast at that time—an intruder hovering on the edge of reality.
Abstract: There is, I think, something ethereal about i —the square root of minus one. I remember first hearing about it at school. It seemed an odd beast at that time—an intruder hovering on the edge of reality. Usually familiarity dulls this sense of the bizarre, but in the case of i it was the reverse: over the years the sense of its surreal nature intensified. It seemed that it was impossible to write mathematics that described the real world in …

33,785 citations

28 Jul 2005
TL;DR: PfPMP1)与感染红细胞、树突状组胞以及胎盘的单个或多个受体作用,在黏附及免疫逃避中起关键的作�ly.
Abstract: 抗原变异可使得多种致病微生物易于逃避宿主免疫应答。表达在感染红细胞表面的恶性疟原虫红细胞表面蛋白1(PfPMP1)与感染红细胞、内皮细胞、树突状细胞以及胎盘的单个或多个受体作用,在黏附及免疫逃避中起关键的作用。每个单倍体基因组var基因家族编码约60种成员,通过启动转录不同的var基因变异体为抗原变异提供了分子基础。

18,940 citations

Journal ArticleDOI
TL;DR: In this paper, a review of the literature in the area of alternate gate dielectrics is given, based on reported results and fundamental considerations, the pseudobinary materials systems offer large flexibility and show the most promise toward success.
Abstract: Many materials systems are currently under consideration as potential replacements for SiO2 as the gate dielectric material for sub-0.1 μm complementary metal–oxide–semiconductor (CMOS) technology. A systematic consideration of the required properties of gate dielectrics indicates that the key guidelines for selecting an alternative gate dielectric are (a) permittivity, band gap, and band alignment to silicon, (b) thermodynamic stability, (c) film morphology, (d) interface quality, (e) compatibility with the current or expected materials to be used in processing for CMOS devices, (f) process compatibility, and (g) reliability. Many dielectrics appear favorable in some of these areas, but very few materials are promising with respect to all of these guidelines. A review of current work and literature in the area of alternate gate dielectrics is given. Based on reported results and fundamental considerations, the pseudobinary materials systems offer large flexibility and show the most promise toward success...

5,711 citations

Book
01 Jan 1999
TL;DR: The analysis and design techniques of CMOS integrated circuits that practicing engineers need to master to succeed can be found in this article, where the authors describe the thought process behind each circuit topology, but also consider the rationale behind each modification.
Abstract: The CMOS technology area has quickly grown, calling for a new text--and here it is, covering the analysis and design of CMOS integrated circuits that practicing engineers need to master to succeed. Filled with many examples and chapter-ending problems, the book not only describes the thought process behind each circuit topology, but also considers the rationale behind each modification. The analysis and design techniques focus on CMOS circuits but also apply to other IC technologies. Table of contents 1 Introduction to Analog Design 2 Basic MOS Device Physics 3 Single-Stage Amplifiers 4 Differential Amplifiers 5 Passive and Active Current Mirrors 6 Frequency Response of Amplifiers 7 Noise 8 Feedback 9 Operational Amplifiers 10 Stability and Frequency Compensation 11 Bandgap References 12 Introduction to Switched-Capacitor Circuits 13 Nonlinearity and Mismatch 14 Oscillators 15 Phase-Locked Loops 16 Short-Channel Effects and Device Models 17 CMOS Processing Technology 18 Layout and Packaging

4,826 citations

Journal ArticleDOI
TL;DR: Nanocrystals (NCs) discussed in this Review are tiny crystals of metals, semiconductors, and magnetic material consisting of hundreds to a few thousand atoms each that are among the hottest research topics of the last decades.
Abstract: Nanocrystals (NCs) discussed in this Review are tiny crystals of metals, semiconductors, and magnetic material consisting of hundreds to a few thousand atoms each. Their size ranges from 2-3 to about 20 nm. What is special about this size regime that placed NCs among the hottest research topics of the last decades? The quantum mechanical coupling * To whom correspondence should be addressed. E-mail: dvtalapin@uchicago.edu. † The University of Chicago. ‡ Argonne National Lab. Chem. Rev. 2010, 110, 389–458 389

3,720 citations