scispace - formally typeset
C

Chenming Hu

Researcher at University of California, Berkeley

Publications -  1300
Citations -  60963

Chenming Hu is an academic researcher from University of California, Berkeley. The author has contributed to research in topics: MOSFET & Gate oxide. The author has an hindex of 119, co-authored 1296 publications receiving 57264 citations. Previous affiliations of Chenming Hu include Motorola & National Chiao Tung University.

Papers
More filters
Proceedings ArticleDOI

Characterization and modeling of a highly reliable metal-to-metal antifuse for high-performance and high-density field-programmable gate arrays

TL;DR: In this article, the reliability of a new amorphous silicon/dielectric antifuse is characterized and modeled, where both breakdown and leakage criteria are used to investigate their effects on time-to-fail.
Journal ArticleDOI

Modeling of GaN-Based Normally-Off FinFET

TL;DR: In this paper, a macromodel for normally off (enhancement mode) AlGaN/GaN-based FinFET (2-DEG channel at top with two MOS like sidewall channels) is proposed.
Journal ArticleDOI

Loop-based interconnect modeling and optimization approach for multigigahertz clock network design

TL;DR: Closed-form loop resistance and inductance models are proposed for fully shielded global clock interconnect structures, which capture high-frequency effects including inductance and proximity effects.
Proceedings ArticleDOI

Negative Capacitance, n-Channel, Si FinFETs: Bi-directional Sub-60 mV/dec, Negative DIBL, Negative Differential Resistance and Improved Short Channel Effect

TL;DR: In this article, negative capacitance (NC) FinFETs with ferroelectric Hf 0.5 Zr 0.2 O 2 (HZO) as gate dielectric on fully depleted silicon on insulator (FDSOI) substrate are presented.
Journal ArticleDOI

Separation by plasma implantation of oxygen (SPIMOX) operational phase space

TL;DR: In this paper, the phase space for SPIMOX implantation was developed for a definite implantation voltage and dose which are dependent on the dimensions of the SOI structure to be fabricated.