Author
Chih-Chung Chang
Other affiliations: National Taiwan University, National Kaohsiung University of Applied Sciences
Bio: Chih-Chung Chang is an academic researcher from China Steel. The author has contributed to research in topics: Heat exchanger & Air cooling. The author has an hindex of 10, co-authored 18 publications receiving 523 citations. Previous affiliations of Chih-Chung Chang include National Taiwan University & National Kaohsiung University of Applied Sciences.
Papers
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TL;DR: In this article, the authors investigated the thermal performance of a heat pipe with phase change material (PCM) for electronic cooling, which can store and release thermal energy depending upon the heating powers of evaporator and fan speeds of condenser.
218 citations
TL;DR: In this paper, a theoretical model of thermal analogy network is developed to predict the thermal performance of the thermoelectric air-cooling module, and the results show that the prediction by the model agrees with the experimental data.
119 citations
TL;DR: In this paper, a two-phase closed thermosyphon vapor-chamber system for electronic cooling was investigated and a thermal resistance net work was developed in order to study the effects of heating power, fill ratio of working fluid, and evaporator surface structure on the thermal performance of the system.
70 citations
TL;DR: In this paper, the thermal performance of a large-scale motor with a capacity of 2350kW has been investigated, and several methods have been adopted, which are aiming to enhance the fan performance by changing the geometry, to redesign a new heat exchanger with guide vanes, and to optimize the distance between the axial fans.
40 citations
TL;DR: In this paper, the authors investigated the thermal performance of a two-phase closed-loop thermosyphon with a thermal resistance model for electronic cooling, and the results indicated that the condenser thermal resistance clearly increased with increasing fill ratio.
Abstract: This study experimentally investigated the thermal performance of a two-phase closed-loop thermosyphon with a thermal resistance model for electronic cooling. The evaporator, rising tube, condenser, and falling tube, which are the four main devices, formed a closed-loop system with water as the working fluid. The experimental parameters were the evaporator surface type, fill ratio of working fluid, and input heating power. The results indicated that the evaporator and condenser thermal resistance decrease with increasing input heating power. The condenser thermal resistance clearly increased with increasing fill ratio. A groove-type evaporator surface with 0.2 mm height and 1 mm width had the best performance, decreasing the evaporator thermal resistance about 15.5% compared to a smooth surface. Correlations for evaporator and condenser thermal resistance were also developed, and their precisions, when compared with the experimental data, were about 9.6 and 11.6%, respectively. Because of the intermittent...
37 citations
Cited by
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TL;DR: In this article, the state of the art of phase change materials for thermal energy storage applications is reviewed and an insight into recent efforts to develop new phase change material with enhanced performance and safety.
1,399 citations
TL;DR: In this paper, the authors provide a comprehensive review of the thermal runaway phenomenon and related fire dynamics in singe and multi-cell battery packs, as well as potential fire prevention measures.
667 citations
TL;DR: In this paper, basic knowledge of thermoelectric materials and an overview of parameters that affect the figure of merit ZT are provided, as well as the prospects for the optimization and their applications are also discussed.
Abstract: Developing thermoelectric materials with superior performance means tailoring interrelated thermoelectric physical parameters – electrical conductivities, Seebeck coefficients, and thermal conductivities – for a crystalline system. High electrical conductivity, low thermal conductivity, and a high Seebeck coefficient are desirable for thermoelectric materials. Therefore, knowledge of the relation between electrical conductivity and thermal conductivity is essential to improve thermoelectric properties. In general, research in recent years has focused on developing thermoelectric structures and materials of high efficiency. The importance of this parameter is universally recognized; it is an established, ubiquitous, routinely used tool for material, device, equipment and process characterization both in the thermoelectric industry and in research. In this paper, basic knowledge of thermoelectric materials and an overview of parameters that affect the figure of merit ZT are provided. The prospects for the optimization of thermoelectric materials and their applications are also discussed.
663 citations
TL;DR: In this paper, the authors reviewed the recent advances of thermoelectric materials, modeling approaches, and applications, and summarized the achievements in past decade have been summarized and the modeling techniques have been described for both the thermoelement modeling and TEC modeling.
593 citations
TL;DR: In this paper, a review of organic phase change materials (PCMs) is presented, focusing on three aspects: the materials, encapsulation and applications of organic PCMs, and providing an insight on the recent developments in applications of these materials.
579 citations