Chin-Chi Hsu

Bio: Chin-Chi Hsu is an academic researcher from National United University. The author has contributed to research in topics: Wetting & Contact angle. The author has an hindex of 12, co-authored 24 publications receiving 407 citations. Previous affiliations of Chin-Chi Hsu include Industrial Technology Research Institute & National Taiwan University.

Pool boiling of nanoparticle-modified surface with interlaced wettability.

Abstract: This study investigated the pool boiling heat transfer under heating surfaces with various interlaced wettability. Nano-silica particles were used as the coating element to vary the interlaced wettability of the surface. The experimental results revealed that when the wettability of a surface is uniform, the critical heat flux increases with the more wettable surface; however, when the wettability of a surface is modified interlacedly, regardless of whether the modified region becomes more hydrophilic or hydrophobic, the critical heat flux is consistently higher than that of the isotropic surface. In addition, this study observed that critical heat flux was higher when the contact angle difference between the plain surface and the modified region was smaller.

Bioinspired Surfaces with Superwettability: New Insight on Theory, Design, and Applications

Abstract: Design, and Applications Shutao Wang,†,‡ Kesong Liu, Xi Yao, and Lei Jiang*,†,‡,§ †Laboratory of Bio-inspired Smart Interface Science, Technical Institute of Physics and Chemistry, and ‡Beijing National Laboratory for Molecular Science, Institute of Chemistry, Chinese Academy of Sciences, Beijing 100190, People’s Republic of China Key Laboratory of Bio-Inspired Smart Interfacial Science and Technology of Ministry of Education, School of Chemistry and Environment, BeiHang University, Beijing 100191, People’s Republic of China Department of Biomedical Sciences, City University of Hong Kong, Hong Kong P6903, People’s Republic of China

Surface engineering for phase change heat transfer: A review

Abstract: Owing to advances in micro- and nanofabrication methods over the last two decades, the degree of sophistication with which solid surfaces can be engineered today has caused a resurgence of interest in the topic of engineering surfaces for phase change heat transfer. This review aims at bridging the gap between the material sciences and heat transfer communities. It makes the argument that optimum surfaces need to address the specificities of phase change heat transfer in the way that a key matches its lock. This calls for the design and fabrication of adaptive surfaces with multiscale textures and non-uniform wettability. Among numerous challenges to meet the rising global energy demand in a sustainable manner, improving phase change heat transfer has been at the forefront of engineering research for decades. The high heat transfer rates associated with phase change heat transfer are essential to energy and industry applications; but phase change is also inherently associated with poor thermodynamic efficiency at low heat flux, and violent instabilities at high heat flux. Engineers have tried since the 1930s to fabricate solid surfaces that improve phase change heat transfer. The development of micro and nanotechnologies has made feasible the high-resolution control of surface texture and chemistry over length scales ranging from molecular levels to centimeters. This paper reviews the fabrication techniques available for metallic and silicon-based surfaces, considering sintered and polymeric coatings. The influence of such surfaces in multiphase processes of high practical interest, e.g., boiling, condensation, freezing, and the associated physical phenomena are reviewed. The case is made that while engineers are in principle able to manufacture surfaces with optimum nucleation or thermofluid transport characteristics, more theoretical and experimental efforts are needed to guide the design and cost-effective fabrication of surfaces that not only satisfy the existing technological needs, but also catalyze new discoveries.