Ching-Hsiang Cheng

Bio: Ching-Hsiang Cheng is an academic researcher from Hong Kong Polytechnic University. The author has contributed to research in topics: Capacitive micromachined ultrasonic transducers & Ultrasonic sensor. The author has an hindex of 19, co-authored 56 publications receiving 1250 citations. Previous affiliations of Ching-Hsiang Cheng include Stanford University.

Volumetric ultrasound imaging using 2-D CMUT arrays

Abstract: Recently, capacitive micromachined ultrasonic transducers (CMUTs) have emerged as a candidate to overcome the difficulties in the realization of 2-D arrays for real-time 3-D imaging. In this paper, we present the first volumetric images obtained using a 2-D CMUT array. We have fabricated a 128/spl times/128-element 2-D CMUT array with through-wafer via interconnects and a 420-/spl mu/m element pitch. As an experimental prototype, a 32/spl times/64-element portion of the 128/spl times/128-element array was diced and flip-chip bonded onto a glass fanout chip. This chip provides individual leads from a central 16/spl times/16-element portion of the array to surrounding bondpads. An 8/spl times/16-element portion of the array was used in the experiments along with a 128-channel data acquisition system. For imaging phantoms, we used a 2.37-mm diameter steel sphere located 10 mm from the array center and two 12-mm-thick Plexiglas plates located 20 mm and 60 mm from the array. A 4/spl times/4 group of elements in the middle of the 8/spl times/16-element array was used in transmit, and the remaining elements were used to receive the echo signals. The echo signal obtained from the spherical target presented a frequency spectrum centered at 4.37 MHz with a 100% fractional bandwidth, whereas the frequency spectrum for the echo signal from the parallel plate phantom was centered at 3.44 MHz with a 91% fractional bandwidth. The images were reconstructed by using RF beamforming and synthetic phased array approaches and visualized by surface rendering and multiplanar slicing techniques. The image of the spherical target has been used to approximate the point spread function of the system and is compared with theoretical expectations. This study experimentally demonstrates that 2-D CMUT arrays can be fabricated with high yield using silicon IC-fabrication processes, individual electrical connections can be provided using through-wafer vias, and flip-chip bonding can be used to integrate these dense 2-D arrays with electronic circuits for practical 3-D imaging applications.

An efficient electrical addressing method using through-wafer vias for two-dimensional ultrasonic arrays

Abstract: This paper presents a technology for high density and low parasitic capacitance electrical interconnects to arrays of Capacitive Micromachined Ultrasonic Transducers (CMUTs) on a silicon chip. Vertical wafer feedthroughs (vias) connect an array of sensors or actuators from the front side (transducer side) to the backside (packaging side) of the chip. A 20 to 1 high aspect ratio 20 /spl mu/m diameter via is achieved by using Deep Reactive Ion Etching (DRIE). Reduction of the parasitic capacitance of the polysilicon pads to the substrate can be achieved by using Metal Insulator Semiconductor (MIS) operating in the depletion region. This three-dimensional architecture allows for elegant packaging through simple flip-chip bonding of the chip's back side to a printed circuit board (PCB) or a signal processing chip.

Capacitive micromachined ultrasonic transducer array with through-substrate electrical connection and method of fabricating same

Abstract: The embodiments of the present invention provide a CMUT array and method of fabricating the same. The CMUT array has CMUT elements individually or respectively addressable from a backside of a substrate on which the CMUT array is fabricated. In one embodiment, a CMUT array is formed on a front side of a very high conductivity silicon substrate. Through wafer trenches are etched into the substrate from the backside of the substrate to electrically isolate individual CMUT elements formed on the front side of the substrate. Electrodes are formed on the backside of the substrate to individually address the CMUT elements through the substrate.

Silicon Micromachined Ultrasonic Transducers

Abstract: This paper reviews capacitor micromachined ultrasonic transducers (cMUTs). Transducers for air-borne and immersion applications are made from parallel-plate capacitors whose dimensions are controlled through traditional integrated circuit manufacturing methods. Transducers for airborne ultrasound applications have been operated in the frequency range of 0.1–11 MHz, while immersion transducers have been operated in the frequency range of 1–20 MHz. The Mason model is used to represent the cMUT and highlight the important parameters in the design of both airborne and immersion transducers. Theory is used to compare the dynamic range and the bandwidth of the cMUTs to piezoelectric transducers. It is seen that cMUTs perform at least as well if not better than piezoelectric transducers. Examples of single-element transducers, linear-array transducers, and two-dimensional arrays of transducers will be presented.

Electrical through-wafer interconnects with sub-picofarad parasitic capacitance [MEMS packaging]

Abstract: This paper presents a technology for high density and low parasitic capacitance electrical through-wafer interconnects to an array of capacitive micromachined ultrasonic transducers (CMUTs) on a silicon wafer. Vertical wafer feedthroughs (interconnects) connect an array of sensors or actuators from the front side (transducer side) to the backside (packaging side) of the wafer. A 20 to 1 high aspect ratio 400 /spl mu/m long and 20 /spl mu/m diameter interconnect is achieved by using deep reactive ion etching (DRIE). Reduction of the parasitic capacitance of the polysilicon pads to the substrate can be achieved by using reversed-biased pn-junction diodes operating in the depletion region. A parasitic capacitance of 0.3 pF has been achieved by this means. This three-dimensional architecture allows for elegant packaging through simple flip-chip bonding of the chip's back side to a printed circuit board (PCB) or a signal processing wafer.

Microscale acoustofluidics: Microfluidics driven via acoustics and ultrasonics

Abstract: This article reviews acoustic microfiuidics: the use of acoustic fields, principally ultrasonics, for application in microfiuidics. Although acoustics is a classical field, its promising, and indeed perplexing, capabilities in powerfully manipulating both fluids and particles within those fluids on the microscale to nanoscale has revived interest in it. The bewildering state of the literature and ample jargon from decades of research is reorganized and presented in the context of models derived from first principles. This hopefully will make the area accessible for researchers with experience in materials science, fluid mechanics, or dynamics. The abundance of interesting phenomena arising from nonlinear interactions in ultrasound that easily appear at these small scales is considered, especially in surface acoustic wave devices that are simple to fabricate with planar lithography techniques common in microfluidics, along with the many applications in microfluidics and nanofluidics that appear through the literature.

Ultrasonic arrays for non-destructive evaluation: A review

Abstract: An ultrasonic array is a single transducer that contains a number of individually connected elements. Recent years have seen a dramatic increase in the use of ultrasonic arrays for non-destructive evaluation. Arrays offer great potential to increase inspection quality and reduce inspection time. Their main advantages are their increased flexibility over traditional single element transducer methods, meaning that one array can be used to perform a number of different inspections, and their ability to produce immediate images of the test structure. These advantages have led to the rapid uptake of arrays by the engineering industry. These industrial applications are underpinned by a wide range of published research which describes new piezoelectric materials, array geometries, modelling methods and inspection modalities. The aim of this paper is to bring together the most relevant published work on arrays for non-destructive evaluation applications, comment on the state-of the art and discuss future directions. There is also a significant body of published literature referring to use of arrays in the medical and sonar fields and the most relevant papers from these related areas are also reviewed. However, although there is much common ground, the use of arrays in non-destructive evaluation offers some distinctly different challenges to these other disciplines.

Design and Fabrication of Soft Artificial Skin Using Embedded Microchannels and Liquid Conductors

Abstract: We describe the design, fabrication, and calibration of a highly compliant artificial skin sensor. The sensor consists of multilayered mircochannels in an elastomer matrix filled with a conductive liquid, capable of detecting multiaxis strains and contact pressure. A novel manufacturing method comprised of layered molding and casting processes is demonstrated to fabricate the multilayered soft sensor circuit. Silicone rubber layers with channel patterns, cast with 3-D printed molds, are bonded to create embedded microchannels, and a conductive liquid is injected into the microchannels. The channel dimensions are 200 μm (width) × 300 μm (height). The size of the sensor is 25 mm × 25 mm, and the thickness is approximately 3.5 mm. The prototype is tested with a materials tester and showed linearity in strain sensing and nonlinearity in pressure sensing. The sensor signal is repeatable in both cases. The characteristic modulus of the skin prototype is approximately 63 kPa. The sensor is functional up to strains of approximately 250%.

Electrical Modeling and Characterization of Through Silicon via for Three-Dimensional ICs

Abstract: Three-dimensional ICs provide a promising option to build high-performance compact SoCs by stacking one or more chips vertically. Through silicon vias (TSVs) form an integral component of the 3-D IC technology by enabling vertical interconnections in 3-D ICs. TSV resistance, inductance, and capacitance need to be modeled to determine their impact on the performance of a 3-D circuit. In this paper, the RLC parameters of the TSV are modeled as a function of physical parameters and material characteristics. Models are validated with the numerical simulators like Raphael and Sdevice and with experimental measurements. The TSV RLC model is applied to predict the resistance, inductance, and capacitances of small-geometry TSV architectures. Finally, this paper also proposes a simplified lumped TSV model that can be used to simulate 3-D circuits.

Capacitive micromachined ultrasonic transducers: next-generation arrays for acoustic imaging?

Abstract: Piezoelectric materials have dominated the ultrasonic transducer technology. Recently, capacitive micromachined ultrasonic transducers (CMUTs) have emerged as an alternative technology offering advantages such as wide bandwidth, ease of fabricating large arrays, and potential for integration with electronics. The aim of this paper is to demonstrate the viability of CMUTs for ultrasound imaging. We present the first pulse-echo phased array B-scan sector images using a 128-element, one-dimensional (1-D) linear CMUT array. We fabricated 64- and 128-element 1-D CMUT arrays with 100% yield and uniform element response across the arrays. These arrays have been operated in immersion with no failure or degradation in performance over the time. For imaging experiments, we built a resolution test phantom roughly mimicking the attenuation properties of soft tissue. We used a PC-based experimental system, including custom-designed electronic circuits to acquire the complete set of 128/spl times/128 RF A-scans from all transmit-receive element combinations. We obtained the pulse-echo frequency response by analyzing the echo signals from wire targets. These echo signals presented an 80% fractional bandwidth around 3 MHz, including the effect of attenuation in the propagating medium. We reconstructed the B-scan images with a sector angle of 90 degrees and an image depth of 210 mm through offline processing by using RF beamforming and synthetic phased array approaches. The measured 6-dB lateral and axial resolutions at 135 mm depth were 0.0144 radians and 0.3 mm, respectively. The electronic noise floor of the image was more than 50 dB below the maximum mainlobe magnitude. We also performed preliminary investigations on the effects of crosstalk among array elements on the image quality. In the near field, some artifacts were observable extending out from the array to a depth of 2 cm. A tail also was observed in the point spread function (PSF) in the axial direction, indicating the existence of crosstalk. The relative amplitude of this tail with respect to the mainlobe was less than -20 dB.