A vapor deposition reactor and a method for forming a thin film. The vapor deposition reactor includes at least one first injection portion for injecting a reacting material to a recess in a first portion of the vapor deposition reactor. A second portion is connected to the first space and has a recess connected to the recess of the first portion. The recess of the second portion is maintained to have pressure lower than the pressure in the first space. A third portion is connected to the second space, and an exhaust portion is connected to the third space.

Vapor deposition reactor and method for forming thin film

A vapor deposition reactor includes a reaction module includes a first injection unit for injecting a first material onto a substrate. At least one second injection unit is placed within the first injection unit for injecting a second material onto the substrate. The substrate passes the reaction module through a relative motion between the substrate and the reaction module. The vapor deposition reactor advantageously injects a plurality of materials onto the substrate while the substrate passes the reaction module without exposing the substrate to the atmosphere in a chamber.

Vapor deposition reactor

A vapor deposition reactor may include a first electrode including a first channel and at least one first injection hole connected to the first channel. a second electrode electrically separated from the first electrode, and a power source for applying power between the first electrode and the second electrode to generate plasma from a reactant gas between the first electrode and the second electrode. Also provided is a method for forming thin film using the vapor deposition reactor.

Vapor deposition reactor using plasma and method for forming thin film using the same

A method for forming a thin film using radicals generated by plasma may include generating radicals of a reactant precursor using plasma; forming a first thin film on a substrate by exposing the substrate to a mixture of the radicals of the reactant precursor and a source precursor; exposing the substrate to the source precursor; and forming a second thin film on the substrate by exposing the substrate to the mixture of the radicals of the reactant precursor and the source precursor. Since the substrate is exposed to the source precursor between the formation of the first thin film and the formation of the second thin film, the rate of deposition may be improved.

Method for forming thin film using radicals generated by plasma

Atomic layer deposition is performed by reciprocating a susceptor in two directions, subjecting a substrate on the susceptor to two different sequences of processes By subjecting the susceptor to different sequences of processes, the substrate undergoes different processes that otherwise would have required an additional set of injectors or reactors The reduced number of injectors or reactors enables a more compact deposition device, and reduces the cost associated with the deposition device

Deposition of layer using depositing apparatus with reciprocating susceptor

A plasma processing apparatus for producing a set of Group IV semiconductor nanoparticles from a precursor gas is disclosed. The apparatus includes an outer dielectric tube, the outer tube including an outer tube inner surface and an outer tube outer surface, wherein the outer tube inner surface has an outer tube inner surface etching rate. The apparatus also includes an inner dielectric tube, the inner dielectric tube including an inner tube outer surface, wherein the outer tube inner surface and the inner tube outer surface define an annular channel, and further wherein the inner tube outer surface has an inner tube outer surface etching rate. The apparatus further includes a first outer electrode, the first outer electrode having a first outer electrode inner surface disposed on the outer tube outer surface. The apparatus also includes a first central electrode, the first central electrode being disposed inside the inner dielectric tube, the first central electrode further configured to be coupled to the first outer electrode when a first RF energy source is applied to one of the first outer electrode and the first central electrode; and a first reaction zone defined between the first outer electrode and the central electrode.

Methods and apparatus for the production of group iv nanoparticles in a flow-through plasma reactor

We are introducing our program to study and understand the interactions of photovoltaic module component materials and their impact on module durability from a holistic point of view. While the impact of backsheets and encapsulants on module durability has been studied to a great extent, the role of metallization pastes is significantly less understood. One durability-related aspect of metallization pastes is their adhesion strength to the tabbing ribbons. We have developed methods to control adhesion over a wide range and are among the first to quantify the impact of adhesion on module durability. We present our finding that adhesion does not have a measurable impact on module durability under the conditions tested, even for ultra-low adhesion conditions below 1 N/mm. Another module durability topic that requires a holistic view of interactions between module components is the phenomenon of snail trails on the surface of PV modules, which has become a widespread problem encountered by a large number of module makers and solar farms around the world. Through detailed studies, we have previously been able to link the root cause of snail trails to chemistry in the ethylene-vinyl acetate (EVA), which reacts with silver in the presence of moisture introduced via micro-cracks. We present our continued efforts to develop an in-depth understanding of the mechanisms behind snail trail formation. We investigate the influence of micro-cracks as well as the material properties of encapsulants and backsheets on the rates of water ingression and subsequent snail trail formation. We also discuss the development and effectiveness of accelerated test methodologies replacing the current time-consuming field aging test method to establish snail trail susceptibility and rate of formation and apply them to specific module designs. Data from module field exposure tests is presented to correlate with lab accelerated aging tests.

Holistic view of interactions in modules affecting durability - adhesion and snail trails

A particle collection apparatus is disclosed. The apparatus includes a baghouse housing comprising an entrance port, a collection port, a baghouse configured between the entrance port and the collection port, and a vacuum port coupled to the baghouse. The apparatus also includes a collection mechanism coupled to the collection port; and, a compression mechanism coupled to the baghouse.

Methods and apparatus for the in situ collection of nucleated particles

The expected lifetime performance and degradation of photovoltaic (PV) modules is a major issue facing the levelized cost of electricity of PV as a competitive energy source. Studies that quantify the rates and mechanisms of performance degradation are needed not only for bankability and adoption of these promising technologies, but also for the diagnosis and improvement of their mechanistic degradation pathways. Towards this goal, a generalizable approach to degradation science studies utilizing data science principles has been developed and applied to c-Si PV modules. By combining domain knowledge and data derived insights, mechanistic degradation pathways are indicated that link environmental stressors to the degradation of PV module performance characteristics. Targeted studies guided by these results have yielded predictive equations describing rates of degradation, and further studies are underway to achieve this for additional mechanistic pathways of interest.

A Data Science Approach to Understanding Photovoltaic Module Degradation

Understanding metallization reliability is crucial as two-thirds of all defects detected in fielded modules is directly related to cell and metallization problems. This coupled with the reduction in metallization laydown by 70% over the last 5 years poses a risk to long term module reliability. A critical issue is separating intrinsic vs. extrinsic effects on failure modes seen under testing of silver paste durability. We have varied the flux used in soldering of the ribbons to the cell and seen differentiation in durability. From these learnings we have then tested different silver pastes under damp heat and pressure cooker testing. Finally, we present a series of aged adhesion with temperature cycling to develop accelerated testing of adhesion.

Christopher Alcantara

Papers

Methods and apparatus for the production of group iv nanoparticles in a flow-through plasma reactor

Holistic view of interactions in modules affecting durability - adhesion and snail trails

Methods and apparatus for the in situ collection of nucleated particles

A Data Science Approach to Understanding Photovoltaic Module Degradation

Holistic reliability: Accelerated testing of metallization