The objective of this paper is to outline a methodology for the computation of the response of a multiconductor transmission line terminated by linear networks. The lines are embedded in a multilayered lossy dielectric media and have arbitrary cross sections, but uniform along the length. To check the accuracy of the theoretical results, extensive experimental verification has been carried out.

Analysis of Multiconductor Transmission Lines

Electromagnetic interference shielding mechanisms of CNT/polymer composites

An important strategy for realizing flexible electronics is to use solution-processable materials that can be directly printed and integrated into high-performance electronic components on plastic. Although examples of functional inks based on metallic, semiconducting and insulating materials have been developed, enhanced printability and performance is still a challenge. Printable high-capacitance dielectrics that serve as gate insulators in organic thin-film transistors are a particular priority. Solid polymer electrolytes (a salt dissolved in a polymer matrix) have been investigated for this purpose, but they suffer from slow polarization response, limiting transistor speed to less than 100 Hz. Here, we demonstrate that an emerging class of polymer electrolytes known as ion gels can serve as printable, high-capacitance gate insulators in organic thin-film transistors. The specific capacitance exceeds that of conventional ceramic or polymeric gate dielectrics, enabling transistor operation at low voltages with kilohertz switching frequencies.

Printable ion-gel gate dielectrics for low-voltage polymer thin-film transistors on plastic

Are Power Line Communications (PLC) a good candidate for Smart Grid applications? The objective of this paper is to address this important question. To do so, we provide an overview of what PLC can deliver today by surveying its history and describing the most recent technological advances in the area. We then address Smart Grid applications as instances of sensor networking and network control problems and discuss the main conclusions one can draw from the literature on these subjects. The application scenario of PLC within the Smart Grid is then analyzed in detail. Because a necessary ingredient of network planning is modeling, we also discuss two aspects of engineering modeling that relate to our question. The first aspect is modeling the PLC channel through fading models. The second aspect we review is the Smart Grid control and traffic modeling problem which allows us to achieve a better understanding of the communications requirements. Finally, this paper reports recent studies on the electrical and topological properties of a sample power distribution network. Power grid topological studies are very important for PLC networking as the power grid is not only the information source but also the information delivery system-a unique feature when PLC is used for the Smart Grid.

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For the Grid and Through the Grid: The Role of Power Line Communications in the Smart Grid

The time-domain transmission-line equations for uniform multiconductor transmission lines in a conductive, homogeneous medium excited by a transient, nonuniform electromagnetic (EM) field, are derived from Maxwell's equations. Depending on how the line voltage is defined, two formulations are possible. One of these formulations is considerably more convenient to apply than the other. The assumptions made in the derivation of the transmission-line equations and the boundary conditions at the terminations are discussed. For numerical calculations, the transmission -line equations are represented by finite-difference techniques, and numerical examples are included.

Transient Response of Multiconductor Transmission Lines Excited by a Nonuniform Electromagnetic Field

Preface. 1. Introduction to Electromagnetic Compatibility (EMC). 2. EMC Requirements for Electronic Systems. 3. Signal Spectra-The Relationship Between theTime Domain and the Frequency Domain. 4. Transmission Lines and Signal Integrity. 5. Nonideal Behavior of Components. 6. Conducted Emissions and Susceptibility. 7. Antennas. 8. Radiated Emissions and Susceptibility. 9. Crosstalk. 10. Shielding. 11. System Design for EMC. Appendix A: The Phasor Solution Method. Appendix B: The Electromagnetic Field Equations and Waves. Appendix C: Computer Codes for Calculating the Per-Unit-Length Parameters and Crosstalk of Multiconductor Transmission Lines. Appendix D: Spice (PSPICE) Tutorial. Index.

/pdf/introduction-to-electromagnetic-compatibility-1xa61wdauz.pdf

Introduction to Electromagnetic Compatibility

The essential textbook for electrical engineering students and professionals-now in a valuable new edition The increasing use of high-speed digital technology requires that all electrical engineers have a working knowledge of transmission lines However, because of the introduction of computer engineering courses into already-crowded four-year undergraduate programs, the transmission line courses in many electrical engineering programs have been relegated to a senior technical elective, if offered at all Now, Analysis of Multiconductor Transmission Lines, Second Edition has been significantly updated and reorganized to fill the need for a structured course on transmission lines in a senior undergraduate- or graduate-level electrical engineering program In this new edition, each broad analysis topic, eg, per-unit-length parameters, frequency-domain analysis, time-domain analysis, and incident field excitation, now has a chapter concerning two-conductor lines followed immediately by a chapter on MTLs for that topic This enables instructors to emphasize two-conductor lines or MTLs or both In addition to the reorganization of the material, this Second Edition now contains important advancements in analysis methods that have developed since the previous edition, such as methods for achieving signal integrity (SI) in high-speed digital interconnects, the finite-difference, time-domain (FDTD) solution methods, and the time-domain to frequency-domain transformation (TDFD) method Furthermore, the content of Chapters 8 and 9 on digital signal propagation and signal integrity application has been considerably expanded upon to reflect all of the vital information current and future designers of high-speed digital systems need to know Complete with an accompanying FTP site, appendices with descriptions of numerous FORTRAN computer codes that implement all the techniques in the text, and a brief but thorough tutorial on the SPICE/PSPICE circuit analysis program, Analysis of Multiconductor Transmission Lines, Second Edition is an indispensable textbook for students and a valuable resource for industry professionals

Preface. 1 Introduction. 1.1 Historical Background. 1.2 Fundamental Concepts of Lumped Circuits. 1.3 Outline of the Book. 1.4 "Loop" Inductance vs. "Partial" Inductance. 2 Magnetic Fields of DC Currents (Steady Flow of Charge). 2.1 Magnetic Field Vectors and Properties of Materials. 2.2 Gauss's Law for the Magnetic Field and the Surface Integral. 2.3 The Biot-Savart Law. 2.4 Ampere's Law and the Line Integral. 2.5 Vector Magnetic Potential. 2.5.1 Leibnitz's Rule: Differentiate Before You Integrate. 2.6 Determining the Inductance of a Current Loop:. A Preliminary Discussion. 2.7 Energy Stored in the Magnetic Field. 2.8 The Method of Images. 2.9 Steady (DC) Currents Must Form Closed Loops. 3 Fields of Time-Varying Currents (Accelerated Charge). 3.1 Faraday's Fundamental Law of Induction. 3.2 Ampere's Law and Displacement Current. 3.3 Waves, Wavelength, Time Delay, and Electrical Dimensions. 3.4 How Can Results Derived Using Static (DC) Voltages and Currents be Used in Problems Where the Voltages and Currents are Varying with Time?. 3.5 Vector Magnetic Potential for Time-Varying Currents. 3.6 Conservation of Energy and Poynting's Theorem. 3.7 Inductance of a Conducting Loop. 4 The Concept of "Loop" Inductance. 4.1 Self Inductance of a Current Loop from Faraday's Law of Induction. 4.1.1 Rectangular Loop. 4.1.2 Circular Loop. 4.1.3 Coaxial Cable. 4.2 The Concept of Flux Linkages for Multiturn Loops. 4.2.1 Solenoid. 4.2.2 Toroid. 4.3 Loop Inductance Using the Vector Magnetic Potential. 4.3.1 Rectangular Loop. 4.3.2 Circular Loop. 4.4 Neumann Integral for Self and Mutual Inductances Between Current Loops. 4.4.1 Mutual Inductance Between Two Circular Loops. 4.4.2 Self Inductance of the Rectangular Loop. 4.4.3 Self Inductance of the Circular Loop. 4.5 Internal Inductance vs. External Inductance. 4.6 Use of Filamentary Currents and Current Redistribution Due to the Proximity Effect. 4.6.1 Two-Wire Transmission Line. 4.6.2 One Wire Above a Ground Plane. 4.7 Energy Storage Method for Computing Loop Inductance. 4.7.1 Internal Inductance of a Wire. 4.7.2 Two-Wire Transmission Line. 4.7.3 Coaxial Cable. 4.8 Loop Inductance Matrix for Coupled Current Loops. 4.8.1 Dot Convention. 4.8.2 Multiconductor Transmission Lines. 4.9 Loop Inductances of Printed Circuit Board Lands. 4.10 Summary of Methods for Computing Loop Inductance. 4.10.1 Mutual Inductance Between Two Rectangular Loops. 5 The Concept of "Partial" Inductance. 5.1 General Meaning of Partial Inductance. 5.2 Physical Meaning of Partial Inductance. 5.3 Self Partial Inductance of Wires. 5.4 Mutual Partial Inductance Between Parallel Wires. 5.5 Mutual Partial Inductance Between Parallel Wires that are Offset. 5.6 Mutual Partial Inductance Between Wires at an Angle to Each Other. 5.7 Numerical Values of Partial Inductances and Significance of Internal Inductance. 5.8 Constructing Lumped Equivalent Circuits with Partial Inductances. 6 Partial Inductances of Conductors of Rectangular Cross Section. 6.1 Formulation for the Computation of the Partial Inductances of PCB Lands. 6.2 Self Partial Inductance of PCB Lands. 6.3 Mutual Partial Inductance Between PCB Lands. 6.4 Concept of Geometric Mean Distance. 6.4.1 Geometrical Mean Distance Between a Shape and Itself and the Self Partial Inductance of a Shape. 6.4.2 Geometrical Mean Distance and Mutual Partial Inductance Between Two Shapes. 6.5 Computing the High-Frequency Partial Inductances of Lands and Numerical Methods. 7 "Loop" Inductance vs. "Partial" Inductance. 7.1 Loop Inductance vs. Partial Inductance: Intentional Inductors vs. Nonintentional Inductors. 7.2 To Compute "Loop" Inductance, the "Return Path" for the Current Must be Determined. 7.3 Generally, There is no Unique Return Path for all Frequencies, Thereby Complicating the Calculation of a "Loop" Inductance. 7.4 Computing the "Ground Bounce" and "Power Rail Collapse" of a Digital Power Distribution System Using "Loop" Inductances. 7.5 Where Should the "Loop" Inductance of the Closed Current Path be Placed When Developing a Lumped-Circuit Model of a Signal or Power Delivery Path?. 7.6 How Can a Lumped-Circuit Model of a Complicated System of a Large Number of Tightly Coupled Current Loops be Constructed Using "Loop" Inductance?. 7.7 Modeling Vias on PCBs. 7.8 Modeling Pins in Connectors. 7.9 Net Self Inductance of Wires in Parallel and in Series. 7.10 Computation of Loop Inductances for Various Loop Shapes. 7.11 Final Example: Use of Loop and Partial Inductance to Solve a Problem. Appendix A: Fundamental Concepts of Vectors. A.1 Vectors and Coordinate Systems. A.2 Line Integral. A.3 Surface Integral. A.4 Divergence. A.4.1 Divergence Theorem. A.5 Curl. A.5.1 Stokes's Theorem. A.6 Gradient of a Scalar Field. A.7 Important Vector Identities. A.8 Cylindrical Coordinate System. A.9 Spherical Coordinate System. Table of Identities, Derivatives, and Integrals Used in this Book. References and Further Readings. Index .

Inductance: Loop and Partial

It is shown that radiated emissions due to common-mode currents on printed circuit board lands can greatly exceed those due to differential-mode currents. It is concluded that predictions of radiated emissions based solely on differential-mode (transmission line) currents can bear little, if any, resemblance to actual measured emissions. Therefore, radiated emission prediction models that use only differential-mode (transmission-line) currents and ignore common-mode (antenna) currents are not adequate for the prediction of radiated emissions from printed circuit boards (as well as cables). >

A comparison of the contributions of common-mode and differential-mode currents in radiated emissions

A comprehensive discussion is presented of the method of decoupling the multiconductor transmission line (MTL) equations by the method of transformation of the voltages and currents to mode voltages and currents in order to obtain their general solution. Various ways of defining and obtaining the transformations are shown which serve to connect the myriad of such definitions and also point out where inconsistencies in those definitions can result. Structures for which the decoupling is assured are also discussed. The MTL equations to be decoupled are in the frequency domain, and extensions to their applicability in the time-domain are shown.

Clayton R. Paul

Papers

Introduction to Electromagnetic Compatibility

Analysis of Multiconductor Transmission Lines

Inductance: Loop and Partial

A comparison of the contributions of common-mode and differential-mode currents in radiated emissions

Decoupling the multiconductor transmission line equations