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D. S. Green

Researcher at RF Micro Devices

Publications -  48
Citations -  1999

D. S. Green is an academic researcher from RF Micro Devices. The author has contributed to research in topics: High-electron-mobility transistor & Molecular beam epitaxy. The author has an hindex of 22, co-authored 47 publications receiving 1827 citations. Previous affiliations of D. S. Green include University of California, San Diego & DARPA.

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Realization of wide electron slabs by polarization bulk doping in graded III–V nitride semiconductor alloys

TL;DR: In this article, the concept and experimental realization of polarization-induced bulk electron doping in III-V nitride semiconductors was presented, by exploiting the large polarization charges in the 3-D electron slabs.
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Realization of wide electron slabs by polarization bulk doping in graded III-V nitride semiconductor alloys

TL;DR: In this article, the concept and experimental realization of polarization-induced bulk electron doping in III-V nitride semiconductors was presented, where the large polarization charge was exploited to create wide slabs of high density mobile electrons without introducing shallow donors.
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Memory Effect and Redistribution of Mg into Sequentially Regrown GaN Layer by Metalorganic Chemical Vapor Deposition

TL;DR: In this article, the role of memory effect, surface segregation, and diffusion associated with Mg was investigated in metalorganic chemical vapor deposition (MOCVD) and showed that a Mg-rich film is present on MOCVD as-grown GaN:Mg base layers and can be removed by acid etch.
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Impact of deep levels on the electrical conductivity and luminescence of gallium nitride codoped with carbon and silicon

TL;DR: In this article, the impact of C incorporation on the deep level spectrum of n-type and semi-insulating GaN:C:Si films grown by rf plasma-assisted molecular-beam epitaxy (MBE) was investigated by the combination of deep level transient spectroscopy, steady-state photocapacitance, and transient deep-level optical spectra.
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AlGaN/GaN HFET reliability

TL;DR: In this paper, the gate leakage phenomenon described in this article produces electrons on the surface of the AlGaN layer adjacent to the gate electrode, and this creates a negative charge layer that partially depletes the conducting channel, thereby producing a degradation in dc current and RF output power.