Damien Deleruyelle

Bio: Damien Deleruyelle is an academic researcher from Aix-Marseille University. The author has contributed to research in topics: Resistive random-access memory & Non-volatile memory. The author has an hindex of 17, co-authored 49 publications receiving 904 citations. Previous affiliations of Damien Deleruyelle include University of Provence.

Robust Compact Model for Bipolar Oxide-Based Resistive Switching Memories

Abstract: Emerging nonvolatile memories based on resistive switching mechanisms pull intense research and development efforts from both academia and industry. Oxide-based resistive random access memories (OxRAM) gather noteworthy performances, such as fast WRITE/READ speed, low power, high endurance, and large integration density that outperform conventional flash memories. To fully explore new design concepts, such as distributed memory in logic or biomimetic architectures, robust OxRAM compact models must be developed and implemented into electrical simulators to assess performances at a circuit level. In this paper, we propose a physics-based compact model used in electrical simulator for bipolar OxRAM memories. After uncovering the theoretical background and the set of relevant physical parameters, this model is confronted to experimental electrical data. The excellent agreement with these data suggests that this model can be confidently implemented into circuit simulators for design purpose.

Synchronous Non-Volatile Logic Gate Design Based on Resistive Switching Memories

Abstract: Emerging non-volatile memories (NVM) based on resistive switching mechanism (RS) such as STT-MRAM, OxRRAM and CBRAM etc., are under intense R&D investigation by both academics and industries. They provide high write/read speed, low power and good endurance (e.g., > 1012) beyond mainstream NVMs, which allow them to be embedded directly with logic units for computing purpose. This integration could increase significantly the power/die area efficiency, and then overcome definitively the power/speed bottlenecks of modern VLSIs. This paper presents firstly a theoretical investigation of synchronous NV logic gates based on RS memories (RS-NVL). Special design techniques and strategies are proposed to optimize the structure according to different resistive characteristics of NVMs. To validate this study, we simulated a non-volatile full-adder (NVFA) with two types of NVMs: STT-MRAM and OxRRAM by using CMOS 40 nm design kit and compact models, which includes related physics and experimental parameters. They show interesting power, speed and area gain compared with synchronized CMOS FA while keeping good reliability.

Experimental and theoretical study of electrode effects in HfO 2 based RRAM

Abstract: In this work, the impact of Ti electrodes on the electrical behaviour of HfO 2 -based RRAM devices is conclusively clarified. To this aim, devices with Pt, TiN and Ti electrodes have been fabricated (see Fig. 1). We first provide several experiments to clearly demonstrate that switching is driven by creation-disruption of a conductive filament. Thus, the role of TiN/Ti electrodes is explained and modeled based on the presence of HfO x interfacial layer underneath the electrode. In addition, Ti is found responsible to activate bipolar switching. Moreover, it strongly reduces forming and switching voltages with respect to Pt-Pt devices. Finally, it positively impacts on retention. To support and interpret our results we provide physico-chemical measurements, electrical characterization, ab-initio calculations and modeling.

Resistance controllability and variability improvement in a TaOx-based resistive memory for multilevel storage application

Abstract: In order to obtain reliable multilevel cell (MLC) characteristics, resistance controllability between the different resistance levels is required especially in resistive random access memory (RRAM), which is prone to resistance variability mainly due to its intrinsic random nature of defect generation and filament formation. In this study, we have thoroughly investigated the multilevel resistance variability in a TaOx-based nanoscale (<30 nm) RRAM operated in MLC mode. It is found that the resistance variability not only depends on the conductive filament size but also is a strong function of oxygen vacancy concentration in it. Based on the gained insights through experimental observations and simulation, it is suggested that forming thinner but denser conductive filament may greatly improve the temporal resistance variability even at low operation current despite the inherent stochastic nature of resistance switching process.

Self-consistent physical modeling of set/reset operations in unipolar resistive-switching memories

Abstract: This Letter deals with a self-consistent physical model for set/reset operations involved in unipolar resistive switching memories integrating a transition metal oxide. In this model, set operation is described in terms of a local electrochemical reduction of the oxide leading to the formation of metallic conductive filaments. Beside, reset operation relies on the thermally assisted destruction of the formed metallic filaments by Joule heating effect. An excellent agreement is demonstrated with numerous published experimental data suggesting that this model can be confidently implemented into circuit simulators for design purpose.

Emerging memories: resistive switching mechanisms and current status.

Abstract: The resistance switching behaviour of several materials has recently attracted considerable attention for its application in non-volatile memory (NVM) devices, popularly described as resistive random access memories (RRAMs). RRAM is a type of NVM that uses a material(s) that changes the resistance when a voltage is applied. Resistive switching phenomena have been observed in many oxides: (i) binary transition metal oxides (TMOs), e.g. TiO(2), Cr(2)O(3), FeO(x) and NiO; (ii) perovskite-type complex TMOs that are variously functional, paraelectric, ferroelectric, multiferroic and magnetic, e.g. (Ba,Sr)TiO(3), Pb(Zr(x) Ti(1-x))O(3), BiFeO(3) and Pr(x)Ca(1-x)MnO(3); (iii) large band gap high-k dielectrics, e.g. Al(2)O(3) and Gd(2)O(3); (iv) graphene oxides. In the non-oxide category, higher chalcogenides are front runners, e.g. In(2)Se(3) and In(2)Te(3). Hence, the number of materials showing this technologically interesting behaviour for information storage is enormous. Resistive switching in these materials can form the basis for the next generation of NVM, i.e. RRAM, when current semiconductor memory technology reaches its limit in terms of density. RRAMs may be the high-density and low-cost NVMs of the future. A review on this topic is of importance to focus concentration on the most promising materials to accelerate application into the semiconductor industry. This review is a small effort to realize the ambitious goal of RRAMs. Its basic focus is on resistive switching in various materials with particular emphasis on binary TMOs. It also addresses the current understanding of resistive switching behaviour. Moreover, a brief comparison between RRAMs and memristors is included. The review ends with the current status of RRAMs in terms of stability, scalability and switching speed, which are three important aspects of integration onto semiconductors.

Neuromorphic computing using non-volatile memory

Abstract: Dense crossbar arrays of non-volatile memory (NVM) devices represent one possible path for implementing massively-parallel and highly energy-efficient neuromorphic computing systems. We first revie...

Recent progress in 2D group-VA semiconductors: from theory to experiment

Abstract: Phosphorene, an emerging two-dimensional material, has received considerable attention due to its layer-controlled direct bandgap, high carrier mobility, negative Poisson's ratio and unique in-plane anisotropy. As cousins of phosphorene, 2D group-VA arsenene, antimonene and bismuthene have also garnered tremendous interest due to their intriguing structures and fascinating electronic properties. 2D group-VA family members are opening up brand-new opportunities for their multifunctional applications encompassing electronics, optoelectronics, topological spintronics, thermoelectrics, sensors, Li- or Na-batteries. In this review, we extensively explore the latest theoretical and experimental progress made in the fundamental properties, fabrications and applications of 2D group-VA materials, and offer perspectives and challenges for the future of this emerging field.

A Survey of Neuromorphic Computing and Neural Networks in Hardware.

Abstract: Neuromorphic computing has come to refer to a variety of brain-inspired computers, devices, and models that contrast the pervasive von Neumann computer architecture This biologically inspired approach has created highly connected synthetic neurons and synapses that can be used to model neuroscience theories as well as solve challenging machine learning problems The promise of the technology is to create a brain-like ability to learn and adapt, but the technical challenges are significant, starting with an accurate neuroscience model of how the brain works, to finding materials and engineering breakthroughs to build devices to support these models, to creating a programming framework so the systems can learn, to creating applications with brain-like capabilities In this work, we provide a comprehensive survey of the research and motivations for neuromorphic computing over its history We begin with a 35-year review of the motivations and drivers of neuromorphic computing, then look at the major research areas of the field, which we define as neuro-inspired models, algorithms and learning approaches, hardware and devices, supporting systems, and finally applications We conclude with a broad discussion on the major research topics that need to be addressed in the coming years to see the promise of neuromorphic computing fulfilled The goals of this work are to provide an exhaustive review of the research conducted in neuromorphic computing since the inception of the term, and to motivate further work by illuminating gaps in the field where new research is needed

On the c-Si surface passivation mechanism by the negative-charge-dielectric Al2O3

Abstract: Al2O3 is a versatile high-κ dielectric that has excellent surface passivation properties on crystalline Si (c-Si), which are of vital importance for devices such as light emitting diodes and high-efficiency solar cells. We demonstrate both experimentally and by simulations that the surface passivation can be related to a satisfactory low interface defect density in combination with a strong field-effect passivation induced by a negative fixed charge density Qf of up to 1013 cm−2 present in the Al2O3 film at the interface with the underlying Si substrate. The negative polarity of Qf in Al2O3 is especially beneficial for the passivation of p-type c-Si as the bulk minority carriers are shielded from the c-Si surface. As the level of field-effect passivation is shown to scale with Qf2, the high Qf in Al2O3 tolerates a higher interface defect density on c-Si compared to alternative surface passivation schemes.