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Daniel J. Dickrell

Other affiliations: Sandia National Laboratories
Bio: Daniel J. Dickrell is an academic researcher from University of Florida. The author has contributed to research in topics: Electrical contacts & Contact resistance. The author has an hindex of 9, co-authored 22 publications receiving 306 citations. Previous affiliations of Daniel J. Dickrell include Sandia National Laboratories.

Papers
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01 Mar 2005
TL;DR: In this paper, a simulated gold-platinum metal microelectromechanical system contact was hot-switched to determine the sensitivity of the contact resistance degradation to current level and environment, and the mechanism responsible for resistance degradation was found to be arc-induced decomposition of adsorbed surface contaminants.
Abstract: Electrical contact resistance testing was performed by hot-switching a simulated gold-platinum metal microelectromechanical systems contact. The experimental objective was to determine the sensitivity of the contact resistance degradation to current level and environment. The contact resistance increased sharply after 100 hot-switched cycles in air. Hot-switching at a reduced current and in nitrogen atmosphere curtailed contact resistance degradation by several orders of magnitude. The mechanism responsible for the resistance degradation was found to be arc-induced decomposition of adsorbed surface contaminants.

59 citations

Journal ArticleDOI
TL;DR: In this paper, a simulated gold-platinum metal microelectromechanical system contact was hot-switched to determine the sensitivity of the contact resistance degradation to current level and environment, and the mechanism responsible for resistance degradation was found to be arc-induced decomposition of adsorbed surface contaminants.
Abstract: Electrical contact resistance testing was performed by hot-switching a simulated gold-platinum metal microelectromechanical systems contact. The experimental objective was to determine the sensitivity of the contact resistance degradation to current level and environment. The contact resistance increased sharply after 100hot-switched cycles in air. Hot-switching at a reduced current and in nitrogen atmosphere curtailed contact resistance degradation by several orders of magnitude. The mechanism responsible for the resistance degradation was found to be arc-induced decomposition of adsorbed surface contaminants

47 citations

Journal ArticleDOI
TL;DR: In this article, the tribological properties of cosputtered metal/MoS2 solid lubricant films with low metal content were investigated and the results showed that they are tribologically sound.

41 citations

Journal ArticleDOI
TL;DR: In this article, the evolution of the geometry of a simple two-dimensional circular cam as a result of wear is studied using three complementary approaches: a closed form analytical expression, a computer simulation, and the development of an experimental apparatus.
Abstract: The evolution of the geometry of a simple two-dimensional circular cam as a result of wear is studied using three complementary approaches: a closed form analytical expression, a computer simulation, and the development of an experimental apparatus. Experiments were run for over 1.5 million cycles, and measurements of cam shape and follower motion were recorded and compared favorably to the predictions of both techniques. Errors associated with an accelerated computational approach are discussed.

34 citations

Proceedings ArticleDOI
17 Oct 2005
TL;DR: In this article, a modified nano-indentation apparatus was used to bring electrically-biased gold and platinum surfaces into contact at a load of 100 /spl mu/N. The applied normal force and electrical contact resistance of the contact materials were measured simultaneously.
Abstract: This work investigated the relationship between the resistance degradation in low-force metal contacts and hot-switched operational conditions representative of MEMS devices. A modified nano-indentation apparatus was used to bring electrically-biased gold and platinum surfaces into contact at a load of 100 /spl mu/N. The applied normal force and electrical contact resistance of the contact materials was measured simultaneously. The influence of parallel discharge paths for stored electrical energy in the contact circuit is discussed in relation to surface contamination decomposition and the observed resistance degradation.

27 citations


Cited by
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Journal ArticleDOI
TL;DR: In this article, the authors present a focused review of solid lubrication with molybdenum disulfide by highlighting its structure, synthesis, applications and the fundamental mechanisms underlying its lubricative properties, together with a discussion of their environmental and temperature dependence.
Abstract: Molybdenum disulfide (MoS2) is one of the most broadly utilized solid lubricants with a wide range of applications, including but not limited to those in the aerospace/space industry. Here we present a focused review of solid lubrication with MoS2 by highlighting its structure, synthesis, applications and the fundamental mechanisms underlying its lubricative properties, together with a discussion of their environmental and temperature dependence. The review also includes an extensive overview of the structure and tribological properties of doped MoS2, followed by a discussion of potential future research directions.

257 citations

Journal ArticleDOI
TL;DR: In this article, an overview of recent advances that have been achieved in understanding the basic physics of friction and energy dissipation in molecularly thin adsorbed films and the associated impact on friction at microscopic and macroscopic length scales.
Abstract: This review provides an overview of recent advances that have been achieved in understanding the basic physics of friction and energy dissipation in molecularly thin adsorbed films and the associated impact on friction at microscopic and macroscopic length scales. Topics covered include a historical overview of the fundamental understanding of macroscopic friction, theoretical treatments of phononic and electronic energy dissipation mechanisms in thin films, and current experimental methods capable of probing such phenomena. Measurements performed on adsorbates sliding in unconfined geometries with the quartz crystal microbalance technique receive particular attention. The final sections review the experimental literature of how measurements of sliding friction in thin films reveal energy dissipation mechanisms and how the results can be linked to film-spreading behavior, lubrication, film phase transitions, superconductivity-dependent friction, and microelectromechanical systems applications. Materials s...

190 citations

Journal ArticleDOI
TL;DR: A computer modeling approach that uses fluoroscopically measured motions as inputs and predicts patient-specific implant damage using computationally efficient dynamic contact and tribological analyses is reported, providing a robust tool for accurately predicting clinically relevant wear in total knee replacements.

184 citations

Journal ArticleDOI
TL;DR: The common failure mechanisms in MEMS, including mechanical fracture, fatigue, creep, stiction, wear, electrical short and open, contamination, their effects on devices' performance, inspection techniques, and approaches to mitigate those failures through structure optimization and material selection are reviewed.
Abstract: Microelectromechanical systems (MEMS) represents a technology that integrates miniaturized mechanical and electromechanical components (i.e., sensors and actuators) that are made using microfabrication techniques. MEMS devices have become an essential component in a wide range of applications, ranging from medical and military to consumer electronics. As MEMS technology is implemented in a growing range of areas, the reliability of MEMS devices is a concern. Understanding the failure mechanisms is a prerequisite for quantifying and improving the reliability of MEMS devices. This paper reviews the common failure mechanisms in MEMS, including mechanical fracture, fatigue, creep, stiction, wear, electrical short and open, contamination, their effects on devices' performance, inspection techniques, and approaches to mitigate those failures through structure optimization and material selection.

150 citations

Journal ArticleDOI
TL;DR: In this article, a review of the important characteristics of the contact interface such as modeling and material choice is discussed. And a brief comparison of actuation methods is provided to show why electrostatic actuation is most commonly used by radio frequency microelectromechanical systems designers.
Abstract: Innovations in relevant micro-contact areas are highlighted, these include, design, contact resistance modeling, contact materials, performance and reliability. For each area the basic theory and relevant innovations are explored. A brief comparison of actuation methods is provided to show why electrostatic actuation is most commonly used by radio frequency microelectromechanical systems designers. An examination of the important characteristics of the contact interface such as modeling and material choice is discussed. Micro-contact resistance models based on plastic, elastic-plastic and elastic deformations are reviewed. Much of the modeling for metal contact micro-switches centers around contact area and surface roughness. Surface roughness and its effect on contact area is stressed when considering micro-contact resistance modeling. Finite element models and various approaches for describing surface roughness are compared. Different contact materials to include gold, gold alloys, carbon nanotubes, composite gold-carbon nanotubes, ruthenium, ruthenium oxide, as well as tungsten have been shown to enhance contact performance and reliability with distinct trade offs for each. Finally, a review of physical and electrical failure modes witnessed by researchers are detailed and examined.

122 citations