D
Daniel Maurer
Researcher at Infineon Technologies
Publications - 19
Citations - 83
Daniel Maurer is an academic researcher from Infineon Technologies. The author has contributed to research in topics: Substrate (printing) & Thin film. The author has an hindex of 5, co-authored 19 publications receiving 77 citations.
Papers
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Journal ArticleDOI
Inductively-coupled plasma-enhanced chemical vapour deposition of hydrogenated amorphous silicon carbide thin films for MEMS☆
TL;DR: In this article, the impact of various deposition parameters such as the reactive gas flow ratio, plasma power, substrate temperature and chamber back pressure of ICP-CVD deposited a-SiC:H thin films is investigated and the influence on important MEMS-related properties like residual stress, Young's modulus, hardness, mass density and refractive index is evaluated.
Journal ArticleDOI
High temperature annealing effects on the chemical and mechanical properties of inductively-coupled plasma-enhanced chemical vapor deposited a-SiC:H thin films
TL;DR: In this article, the impact of thermal annealing up to temperatures of 1200°C on the chemical and mechanical properties of hydrogenated amorphous silicon carbide (a-SiC:H) thin films was reported.
Journal ArticleDOI
Low temperature deposition of a-SiC:H thin films applying a dual plasma source process
Tobias Frischmuth,Michael Schneider,Iva Bogdanović Radović,Zdravko Siketić,Daniel Maurer,Thomas Grille,Ulrich Schmid +6 more
TL;DR: In this article, the authors reported the deposition of a-SiC:H thin films at a substrate temperature of 250 °C applying a dual plasma process by superimposing a radio frequency (RF) plasma which excites the substrate table to an inductively-coupled RF plasma.
Patent
Micromechanical Structure and Method for Fabricating the Same
Ulrich Schmid,Tobias Frischmuth,Peter Irsigler,Thomas Grille,Daniel Maurer,Ursula Hedenig,Markus Kahn,Guenter Denifl,Michael Schneider +8 more
TL;DR: In this article, a micromechanical structure including a substrate and a functional structure arranged at the substrate is described, where the functional structure has a functional region configured to deflect with respect to the substrate responsive to a force acting on the functional region.
Journal ArticleDOI
Impact of Thermal Treatment on the Residual Stress and Young's Modulus of thin a-SiC:H Membranes Applying Bulge Testing
TL;DR: In this article, the impact of thermal treatment on a 500-nm thin hydrogenated amorphous SiC membrane was evaluated with a uniformly applied pressure load and the bending characteristics of the diaphragm were determined.