This guide is a reference for understanding the various aspects of microelectromechanical systems, or MEMS, with an emphasis on device reliability. Material properties, failure mechanisms, processing techniques, device structures, and packaging techniques common to MEMS are addressed in detail. Design and qualification methodologies provide the reader with the means to develop suitable qualification plans for the insertion of MEMS into the space environment.

MEMS Reliability Assurance Guidelines for Space Applications

The mixed convection transport from an isolated thermal source, with a uniform surface heat flux input and located in a rectangular enclosure, is studied numerically. The enclosure simulates a practical system such as an oven or an air-cooled electronic device, where an airstream flows through the openings on the two vertical walls. The heat source represents a heater or an electronic component located in such an enclosure. The interaction of the cooling stream with the buoyancy-induced flow from the heat source is of interest in this work. Laminar, two-dimensional flow is assumed, and the problem lies in the mixed convection regime, governed by the buoyancy parameter GrIRe1 and the Reynolds number Re. Other significant variables include the locations of the heat source and the outflow opening. The inflow is kept at a fixed position. The mathematical model is developed with vorticity and stream function, along with temperature, as the dependent variables. The unsteady terms are retained in the vo...

Mixed convection from an isolated heat source in a rectangular enclosure

Although ion channels are attractive targets for drug discovery, the systematic screening of ion channel-targeted drugs remains challenging. To facilitate automated single ion-channel recordings for the analysis of drug interactions with the intra- and extracellular domain, we have developed a parallel recording methodology using artificial cell membranes. The use of stable lipid bilayer formation in droplet chamber arrays facilitated automated, parallel, single-channel recording from reconstituted native and mutated ion channels. Using this system, several types of ion channels, including mutated forms, were characterised by determining the protein orientation. In addition, we provide evidence that both intra- and extracellular amyloid-beta fragments directly inhibit the channel open probability of the hBK channel. This automated methodology provides a high-throughput drug screening system for the targeting of ion channels and a data-intensive analysis technique for studying ion channel gating mechanisms.

/pdf/automated-parallel-recordings-of-topologically-identified-c8ugl3w7ad.pdf

Automated Parallel Recordings of Topologically Identified Single Ion Channels

http://ws.binghamton.edu/park/publications/2011-1_Da_Yu_High-cycle_fatigue.pdf

High-cycle fatigue life prediction for Pb-free BGA under random vibration loading

https://www.prognostics.umd.edu/calcepapers/07_Jie_prgnsticImplemntationVibrtionLodng_Microelectronics%20Reliability.pdf

Prognostics implementation of electronics under vibration loading

Vibrations of simple electronic systems lumped masses for electronic assemblies beam structures for electronic subassemblies electronic components, frames, and rings printed-circuit boards and flat plates preventing sinusoidal vibration failures understanding random vibration designing for shock environments designing electronic boxes vibration fixtures and vibration testing fatigue in electronic structures.

Vibration analysis for electronic equipment

Evaluating the Cooling Requirements. Designing the Electronic Chassis. Conduction Cooling for Chassis and Circuit Boards. Mounting and Cooling Techniques for Electronic Components. Practical Guides for Natural Convection and Radiation Cooling. Forced--Air Cooling for Electronics. Thermal Stresses in Lead Wires, Solder Joints, and Plated Throughholes. Predicting the Fatigue Life in Thermal Cycling and Vibration Environment. Transient Cooling for Electronic Systems. Special Applications for Tough Cooling Jobs. Effective Cooling for Large Racks and Cabinets. Finite Element Methods for Mathematical Modeling. Environmental Stress Screening Techniques. References. Index.

Cooling techniques for electronic equipment

Vibration Analysis for Electronic Equipment, 2nd Edition

Preface. Symbols. Physics of Failure In Electronic Systems. Thermal Expansion Displacements, Forces, and Stresses. Vibration of Beams and Other Simple Structures. Vibration of Printed Circuit Boards and Flat Plates. Estimating Fatigue Life in Thermal Cycling and Vibration Environments. Octave Rule, Snubbers, Dampers, and Isolation for Preventing Vibration Damage to Electronic Systems. Displacements, Forces, and Stresses in Axial Leaded Component Wires Due to Thermal Expansions. Designing Electronic Equipment for Sinusoidal Vibration. Assessment of Random Vibration on Electronic Design. Combining Fatigue Damage for Random Vibration and Thermal Cycling. Thermal Cycling Failures in Surface-Mounted Components. Stresses and Fatigue Life in Component Lead Wires and Solder Joints Due to Dynamic Forces and PCB Displacements. Fatigue Life of Long Components, Tall Components, and Small Components Mounted on PCBs. Wear and Interface Surface Fretting Corrosion in Electrical Connectors. Case Histories of Failures and Failure Analyses. Bibliography. Index.

Dave S. Steinberg

Papers

Vibration analysis for electronic equipment

Cooling techniques for electronic equipment

Vibration Analysis for Electronic Equipment, 2nd Edition

Preventing Thermal Cycling and Vibration Failures in Electronic Equipment