David J. Dingley

TL;DR: It is demonstrated that the shift between similar features in two electron backscatter diffraction patterns can be measured using cross-correlation based methods to +/- 0.05 pixels, which is an impressive and unique combination of high strain sensitivity, high spatial resolution and ease of use.

TL;DR: In this article, the angular resolution of electron backscatter diffraction (EBSD) measurements can be significantly improved using an analysis based on determination of small shifts in features from one pattern to the next using cross-correlation functions.

TL;DR: In this paper, the use of slow-scan charge couple device cameras for phase identification and rapid determination of orientation image micrographs is reviewed, and a procedure for improving lattice spacing measurement by utilizing the full resolution of the camera is described with experimental measurements on silicon and nickel showing relative errors of plus/minus 3%.

TL;DR: In this paper, the diffuseness of electron back scatter patterns (EBSPs) is observed to increase with plastic strain, and the degradation of EBSPs by cold work was thoroughly investigated using the A1 6061 alloy for the purpose.

TL;DR: Calibrant samples of known strain provide a method of measuring the experimental geometry but imprecise stage movement combined with the high depth of field in the SEM could also result in uncertainties in strain of ∼ 10(-3).