D
Didier Cottet
Researcher at ETH Zurich
Publications - 23
Citations - 769
Didier Cottet is an academic researcher from ETH Zurich. The author has contributed to research in topics: Microstrip & Inductor. The author has an hindex of 9, co-authored 23 publications receiving 746 citations. Previous affiliations of Didier Cottet include École Polytechnique Fédérale de Lausanne.
Papers
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Journal ArticleDOI
Electronic textiles: a platform for pervasive computing
Diana Marculescu,Radu Marculescu,Nicholas H. Zamora,Phillip Stanley-Marbell,Pradeep K. Khosla,Sungmee Park,Sundaresan Jayaraman,S. Jung,C. Lauterbach,W. Weber,Tünde Kirstein,Didier Cottet,Janusz Grzyb,G. Troster,Mark T. Jones,Thomas L. Martin,Zahi Nakad +16 more
TL;DR: A look at the synergistic relationship between textiles and computing and identify the need for their "integration" using tools provided by an emerging new field of research that combines the strengths and capabilities of electronics and textiles into one: electronic textiles, or e-textiles.
Journal ArticleDOI
Electrical characterization of textile transmission lines
TL;DR: In this paper, electrical characterization and modeling of conductive textiles are presented, and a dedicated measurement setup has been developed to allow reliable connection of the textile samples with the equipment cables.
Book ChapterDOI
High-Level Area and Performance Estimation of Hardware Building Blocks on FPGAs
TL;DR: This paper proposes a high-level estimation methodology for area and performance parameters of regular FPGA designs to be found in multimedia, telecommunications or cryptography and presents the estimation approach as well as evaluation results that prove the suitability of the proposed estimation approach.
Textiles for Signal Transmission in Wearables
TL;DR: This work investigated the electrical performance of textile transmission lines and presented methods for measuring as well as for modeling the high frequency properties of textiles to predict the electrical properties of different textiles.
Proceedings ArticleDOI
An investigation of the material and process parameters for thin-film MCM-D and MCM-L technologies up to 100GHz
TL;DR: In this paper, the authors propose a procedure for the extraction and separation of dielectric material parameters and metalization-related process properties up to mm-wave frequencies based on the measurements of general microstrip lines set of different line cross-sections and lengths.