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Dirk Vandepitte

Other affiliations: Catholic University of Leuven
Bio: Dirk Vandepitte is an academic researcher from Katholieke Universiteit Leuven. The author has contributed to research in topics: Finite element method & Interval (mathematics). The author has an hindex of 43, co-authored 406 publications receiving 6090 citations. Previous affiliations of Dirk Vandepitte include Catholic University of Leuven.


Papers
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Journal ArticleDOI
TL;DR: The objective of this paper is to critically review the emerging non-probabilistic approaches for uncertainty treatment in finite element analysis and gives a state-of-the-art of the interval finite element algorithms available from literature.

352 citations

Journal ArticleDOI
TL;DR: In this paper, an investigation of the low velocity impact on laminated composite thin disks of epoxy resin reinforced by carbon fiber is presented, where the influence of stacking sequence and energy impact was investigated using load-time histories, displacement-time history and energy-time cycle histories as well as images from NDE.

234 citations

Journal ArticleDOI
TL;DR: In this article, optical full-field strain measurements are applied in studies of textile deformability during composite processing, providing input data for the validation of material drape models and for the prediction of the consolidated part performance via structural finite element analysis.
Abstract: Full-field strain measurements are applied in studies of textile deformability during composite processing: (1) in testing of shear and tensile deformations of textiles (picture frame, bias and biaxial extension test) as an "optical extensometer", allowing accurate assessment of the sample deformation, which may differ significantly from the deformation applied by the testing device; (2) to study mechanisms of the textile deformation on the scale of the textile unit cell and of the individual yarns (meso- and micro-scale full-field strain measurements); (3) to measure the 3D-deformed shape and the distribution of local deformations (e.g., shear angles) of a textile reinforcement after draping, providing input data for the validation of material drape models and for the prediction of the consolidated part performance via structural finite element analysis. This paper discusses these three applications of the full-field strain measurements, providing examples of studies of deformability of woven (glass, glass/PP) and non-crimp (carbon) textile reinforcements. The authors conclude that optical full-field strain techniques are the preferable (sometimes the only) way of assuring correct deformation measurements during tensile or shear tests of textile.

224 citations

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TL;DR: This paper reviews the CAE modelling techniques which can be used for the analysis of time-harmonic acoustic problems and focusses on techniques which have the Trefftz approach as baseline methodology.
Abstract: Over the last decade, Computer Aided Engineering (CAE) tools have become essential in the assessment and optimization of the acoustic characteristics of products and processes. The possibility of evaluating these characteristics on virtual prototypes at almost any stage of the design process reduces the need for very expensive and time consuming physical prototype testing. However, despite their steady improvements and extensions, CAE techniques are still primarily used by analysis specialists. In order to turn them into easy-to-use, versatile tools that are also easily accessible for designers, several bottlenecks have to be resolved. The latter include, amongst others, the lack of efficient numerical techniques for solving system-level functional performance models in a wide frequency range. This paper reviews the CAE modelling techniques which can be used for the analysis of time-harmonic acoustic problems and focusses on techniques which have the Trefftz approach as baseline methodology. The basic properties of the different methods are highlighted and their strengths and limitations are discussed. Furthermore, an overview is given of the state-of-the-art of the extensions and the enhancements which have been recently investigated to enlarge the application range of the different techniques. Specific attention is paid to one very promising Trefftz-based technique, which is the so-called wave based method. This method has all the necessary attributes for putting a next step in the evolution towards truly virtual product design.

138 citations


Cited by
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Journal Article
TL;DR: This book by a teacher of statistics (as well as a consultant for "experimenters") is a comprehensive study of the philosophical background for the statistical design of experiment.
Abstract: THE DESIGN AND ANALYSIS OF EXPERIMENTS. By Oscar Kempthorne. New York, John Wiley and Sons, Inc., 1952. 631 pp. $8.50. This book by a teacher of statistics (as well as a consultant for \"experimenters\") is a comprehensive study of the philosophical background for the statistical design of experiment. It is necessary to have some facility with algebraic notation and manipulation to be able to use the volume intelligently. The problems are presented from the theoretical point of view, without such practical examples as would be helpful for those not acquainted with mathematics. The mathematical justification for the techniques is given. As a somewhat advanced treatment of the design and analysis of experiments, this volume will be interesting and helpful for many who approach statistics theoretically as well as practically. With emphasis on the \"why,\" and with description given broadly, the author relates the subject matter to the general theory of statistics and to the general problem of experimental inference. MARGARET J. ROBERTSON

13,333 citations

01 Jan 1999
TL;DR: Damascene copper electroplating for on-chip interconnections, a process that was conceived and developed in the early 1990s, makes it possible to fill submicron trenches and vias with copper without creating a void or a seam and has thus proven superior to other technologies of copper deposition as discussed by the authors.
Abstract: Damascene copper electroplating for on-chip interconnections, a process that we conceived and developed in the early 1990s, makes it possible to fill submicron trenches and vias with copper without creating a void or a seam and has thus proven superior to other technologies of copper deposition. We discuss here the relationship of additives in the plating bath to superfilling, the phenomenon that results in superconformal coverage, and we present a numerical model which accounts for the experimentally observed profile evolution of the plated metal.

1,006 citations

Journal ArticleDOI
TL;DR: This paper provides the groundwork for an understanding of the reliability issues of LEDs across the supply chain and identifies the relationships between failure causes and their associated mechanisms, issues in thermal standardization, and critical areas of investigation and development in LED technology and reliability.

648 citations