Numerical Initial Value Problems in Ordinary Differential Equations

The nodal method has been widely used for formulating circuit equations in computer-aided network analysis and design programs. However, several limitations exist in this method including the inability to process voltage sources and current-dependent circuit elements in a simple and efficient manner. A modified nodal analysis (MNA) method is proposed here which retains the simplicity and other advantages of nodal analysis while removing its limitations. A simple and effective pivoting scheme is also given. Numerical examples are used to compare the MNA method with the tableau method. Favorable results are observed for the MNA method in terms of the dimension, number of nonzeros, and fill-ins for comparable circuit matrices.

https://cseweb.ucsd.edu/classes/fa04/cse245/Reading/MNA.pdf

The modified nodal approach to network analysis

Part I: Background and Fundamentals Introduction, Mohamed Gad-el-Hak, University of Notre Dame Scaling of Micromechanical Devices, William Trimmer, Standard MEMS, Inc., and Robert H. Stroud, Aerospace Corporation Mechanical Properties of MEMS Materials, William N. Sharpe, Jr., Johns Hopkins University Flow Physics, Mohamed Gad-el-Hak, University of Notre Dame Integrated Simulation for MEMS: Coupling Flow-Structure-Thermal-Electrical Domains, Robert M. Kirby and George Em Karniadakis, Brown University, and Oleg Mikulchenko and Kartikeya Mayaram, Oregon State University Liquid Flows in Microchannels, Kendra V. Sharp and Ronald J. Adrian, University of Illinois at Urbana-Champaign, Juan G. Santiago and Joshua I. Molho, Stanford University Burnett Simulations of Flows in Microdevices, Ramesh K. Agarwal and Keon-Young Yun, Wichita State University Molecular-Based Microfluidic Simulation Models, Ali Beskok, Texas A&M University Lubrication in MEMS, Kenneth S. Breuer, Brown University Physics of Thin Liquid Films, Alexander Oron, Technion, Israel Bubble/Drop Transport in Microchannels, Hsueh-Chia Chang, University of Notre Dame Fundamentals of Control Theory, Bill Goodwine, University of Notre Dame Model-Based Flow Control for Distributed Architectures, Thomas R. Bewley, University of California, San Diego Soft Computing in Control, Mihir Sen and Bill Goodwine, University of Notre Dame Part II: Design and Fabrication Materials for Microelectromechanical Systems Christian A. Zorman and Mehran Mehregany, Case Western Reserve University MEMS Fabrication, Marc J. Madou, Nanogen, Inc. LIGA and Other Replication Techniques, Marc J. Madou, Nanogen, Inc. X-Ray-Based Fabrication, Todd Christenson, Sandia National Laboratories Electrochemical Fabrication (EFAB), Adam L. Cohen, MEMGen Corporation Fabrication and Characterization of Single-Crystal Silicon Carbide MEMS, Robert S. Okojie, NASA Glenn Research Center Deep Reactive Ion Etching for Bulk Micromachining of Silicon Carbide, Glenn M. Beheim, NASA Glenn Research Center Microfabricated Chemical Sensors for Aerospace Applications, Gary W. Hunter, NASA Glenn Research Center, Chung-Chiun Liu, Case Western Reserve University, and Darby B. Makel, Makel Engineering, Inc. Packaging of Harsh-Environment MEMS Devices, Liang-Yu Chen and Jih-Fen Lei, NASA Glenn Research Center Part III: Applications of MEMS Inertial Sensors, Paul L. Bergstrom, Michigan Technological University, and Gary G. Li, OMM, Inc. Micromachined Pressure Sensors, Jae-Sung Park, Chester Wilson, and Yogesh B. Gianchandani, University of Wisconsin-Madison Sensors and Actuators for Turbulent Flows. Lennart Loefdahl, Chalmers University of Technology, and Mohamed Gad-el-Hak, University of Notre Dame Surface-Micromachined Mechanisms, Andrew D. Oliver and David W. Plummer, Sandia National Laboratories Microrobotics Thorbjoern Ebefors and Goeran Stemme, Royal Institute of Technology, Sweden Microscale Vacuum Pumps, E. Phillip Muntz, University of Southern California, and Stephen E. Vargo, SiWave, Inc. Microdroplet Generators. Fan-Gang Tseng, National Tsing Hua University, Taiwan Micro Heat Pipes and Micro Heat Spreaders, G. P. "Bud" Peterson, Rensselaer Polytechnic Institute Microchannel Heat Sinks, Yitshak Zohar, Hong Kong University of Science and Technology Flow Control, Mohamed Gad-el-Hak, University of Notre Dame) Part IV: The Future Reactive Control for Skin-Friction Reduction, Haecheon Choi, Seoul National University Towards MEMS Autonomous Control of Free-Shear Flows, Ahmed Naguib, Michigan State University Fabrication Technologies for Nanoelectromechanical Systems, Gary H. Bernstein, Holly V. Goodson, and Gregory L. Snider, University of Notre Dame Index

The MEMS Handbook

Silicon integrated circuit spiral inductors and transformers are analyzed using electromagnetic analysis. With appropriate approximations, the calculations are reduced to electrostatic and magnetostatic calculations. The important effects of substrate loss are included in the analysis. Classic circuit analysis and network analysis techniques are used to derive two-port parameters from the circuits. From two-port measurements, low-order, frequency-independent lumped circuits are used to model the physical behavior over a broad-frequency range. The analysis is applied to traditional square and polygon inductors and transformer structures as well as to multilayer metal structures and coupled inductors. A custom computer-aided-design tool called ASITIC is described, which is used for the analysis, design, and optimization of these structures. Measurements taken over a frequency range from 100 MHz to 5 GHz show good agreement with theory.

/pdf/analysis-design-and-optimization-of-spiral-inductors-and-2lhr7rsegu.pdf

Analysis, design, and optimization of spiral inductors and transformers for Si RF ICs

A radio frequency identification device comprises an integrated circuit including a receiver, a transmitter, and a microprocessor. The receiver and transmitter together define an active transponder. The integrated circuit is preferably a monolithic single die integrated circuit including the receiver, the transmitter, and the microprocessor. Because the device includes an active transponder, instead of a transponder which relies on magnetic coupling for power, the device has a much greater range.

Radio frequency data communications device

Spice (simulation program with integrated circuit emphasis)

A macromodel has been developed for integrated circuit (IC) op amps which provides an excellent pin-for-pin representation. The model elements are those which are common to most circuit simulators. The macromodel is a factor of more than six times less complex than the original circuit, and provides simulated circuit responses that have run times which are an order of magnitude faster and less costly in comparison to modeling the op amp at the electronic device level. Expressions for the values of the elements of the macromodel are developed starting from values of typical response characteristics of the op amp. Examples are given for three representative op amps. In addition, the performance of the macromodel in linear and nonlinear systems is presented. For comparison, the simulated circuit performance when modeling at the device level is also demonstrated.

Macromodeling of integrated circuit operational amplifiers

Within the Circuits and Systems (CAS) Society, developments in computer-aided circuit analysis and circuit design commenced in the early 1950's using the earliest digital computers. Initially, computer-aided circuit analysis of linear circuits was used in design optimization, design centering, and in determining the effects of parasitics on circuit performance. Although this use of computer-aided circuit analysis has continued, computer-aided design (CAD) and circuit design automation within the CAS Society are now principally concerned with problems associated with the overall design and evaluation of very large circuits and systems. This paper is a review of a major thread of CAD activity which has occurred within CAS from the earliest and remains of major interest. This thread involves computer-aided circuit analysis (circuit simulation) and its use in CAD systems. Fortunately, several excellent review papers have appeared within the past year or two to document well the technical milestones, as well as the problems of interest at the present time. It is possible then, in this paper, to concentrate on the developments in our present capability of circuit simulators, stressing the significant trends, noting some early developments which did not become major aspects, and observing the interchange between theory and practice.

A historical review of circuit simulation

Analog Integrated Circuits for Communication: Principles, Simulation and Design, Second Edition covers the analysis and design of nonlinear analog integrated circuits that form the basis of present-day communication systems. Both bipolar and MOS transistor circuits are analyzed and several numerical examples are used to illustrate the analysis and design techniques developed in this book. Especially unique to this work is the tight coupling between the first-order circuit analysis and circuit simulation results. Extensive use has been made of the public domain circuit simulator Spice, to verify the results of first-order analyses, and for detailed simulations with complex device models. Highlights of the new edition include: A new introductory chapter that provides a brief review of communication systems, transistor models, and distortion generation and simulation. Addition of new material on MOSFET mixers, compression and intercept points, matching networks. Revisions of text and explanations where necessary to reflect the new organization of the book Spice input files for all the circuit examples that are available to the reader from a website. Problem sets at the end of each chapter to reinforce and apply the subject matter. An instructors solutions manual is available on the book's webpage at springer.com. Analog Integrated Circuits for Communication: Principles, Simulation and Design, Second Edition is for readers who have completed an introductory course in analog circuits and are familiar with basic analysis techniques as well as with the operating principles of semiconductor devices. This book also serves as a useful reference for practicing engineers.

Analog Integrated Circuits for Communication: Principles, Simulation and Design

The problem of transient simulation of lossy transmission lines is investigated in this paper. Two refinements are made to the existing convolution approach for the case of a single lossy line analytical formulae are derived for the line’s impulse-responses, and an accurate numerical convolution technique that utilises these formulae are devised. It is shown that a special case of lossy multiconductor lines can be decomposed into uncoupled lossy lines and linear memoryless networks, leading to a simple simulation algorithm. Simulation results on industrial circuits with single and mtdticonductor lossy lines are presented and compared with results obtained using lumped and pseudo-lumped approximations of lossy lines. The comparison indicates that the convolution technique with the above enhancements can be an order-ofmagnitude faster than lumped and pseudo-lumped segmenting techniques for equivalent or better accuracy.

Donald O. Pederson

Papers

Spice (simulation program with integrated circuit emphasis)

Macromodeling of integrated circuit operational amplifiers

A historical review of circuit simulation

Analog Integrated Circuits for Communication: Principles, Simulation and Design

Efficient transient simulation of lossy interconnect