The use of gas bubbling to enhance membrane processes

The improvements in the device characteristics of n-channel MOSFET's that occur at low temperatures are considered in this paper. The device parameters for polysilicon gate FET's with channel lengths of the order of 1 µm have been studied both experimentally and theoretically at temperatures ranging from room temperature down to liquid nitrogen temperature. Excellent agreement was found between the experimental dc device characteristics and those predicted by a two-dimensional current transport model, indicating that device behavior is well understood and predictable over this entire temperature range. A device design is presented for an enhancement mode FET with a channel length of I µm that is suitable for operation at liquid nitrogen temperature.

Very small MOSFET's for low-temperature operation

Publisher Summary Thermal control of electronic components has one principal objective, to maintain relatively constant component temperature equal to or below the manufacturer's maximum specified service temperature, typically between 85 and 100°C. It is noted that even a single component operating 10°C beyond this temperature can reduce the reliability of certain systems by as much as 50%. Therefore, it is important for the new thermal control schemes to be capable of eliminating hot spots within the electronic devices, removing heat from these devices and dissipating this heat to the surrounding environment. Several strategies have developed over the years for controlling and removing the heat generated in multichip modules, which include advanced air-cooling schemes, direct cooling, and miniature thermosyphons or free-falling liquid films. The chapter summarizes analytical, numerical, and experimental work in literature, in order to facilitate the improvement of existing schemes and provide a basis for the development of new ones. The chapter focuses on investigations performed over the past decade and includes information on the thermal control of semiconductor devices, modules, and total systems.

E. Baker

Papers

Liquid cooling of microelectronic devices by free and forced convection

Liquid immersion cooling of small electronic devices