scispace - formally typeset
E

Eckart Uhlmann

Researcher at Technical University of Berlin

Publications -  471
Citations -  7117

Eckart Uhlmann is an academic researcher from Technical University of Berlin. The author has contributed to research in topics: Machining & Grinding. The author has an hindex of 36, co-authored 438 publications receiving 5902 citations. Previous affiliations of Eckart Uhlmann include Bundesanstalt für Materialforschung und -prüfung & Heidelberg University.

Papers
More filters
Journal ArticleDOI

Thermal issues in machine tools

TL;DR: This paper presents a review of the latest research activities and gives an overview of the state of the art in understanding changes in machine tool performance due to changes in thermal conditions (thermal errors of machine tools).
Book

Handbook of Machining with Grinding Wheels

TL;DR: In this article, the authors discuss the importance of the use of a brasive wheel for a purpose problem-solving task and the nature of the abrasive wheel's mechanism.
Journal ArticleDOI

Advances in Modeling and Simulation of Grinding Processes

TL;DR: In this paper, the authors present an overview of the current state of the art in modeling and simulation of grinding processes: physical process models (analytical and numerical models) and empirical process models(regression analysis, artificial neural net models) as well as rule based models (rule based models) are taken into account.
Journal ArticleDOI

Additive Manufacturing of Titanium Alloy for Aircraft Components

TL;DR: In this article, a high performance titanium alloy was evaluated in the selective laser melting (SLM) process for aeronautical application, as well as the investigation of optimized process parameters and positioning strategies of the structures produced in the SLM machine.
Journal ArticleDOI

Machining of micro/miniature dies and moulds by electrical discharge machining—Recent development

TL;DR: An overview on the state of the art of applicable micro-electrical discharge machining technologies for applications in the field of micro/miniature die and mold making can be found in this article.