A cylindrical heat-generating member is disposed in a valve casing including a valve seat in a flow path connecting main ports, a valve member for opening and closing the valve seat, and a rod connecting the valve member and a piston. A first heater is mounted in the heat-generating member. The heat-generating member and a heat receiving member of the valve member are connected to each other by a heat-transfer member for expansion and contraction. As a result, the valve member is constantly heated through the heat-transfer member irrespective of its open/closed position. When the valve member is open, the heat receiving member comes in contact with the heat-generating member and the valve member is directly heated.

Poppet valve with heater

In a heat radiating member which has a contact portion to be put into contact with a solid-state image sensor fixed to a prism member, and a fin-like heat radiating portion for radiating heat, which has been transferred through the contact portion, into its surrounding gas, the contact portion and the heat radiating portion are formed from a foil member made of a high heat conductivity material. By mounting the heat radiating member on the solid-state image sensor, there is realized a heat radiating structure for cooling the solid-state image sensor while reducing external-force loads applied to the solid-state image sensor with a relatively simple structure.

Heat radiating structure for solid-state image sensor, and solid-state image pickup device

PROBLEM TO BE SOLVED: To provide a heat radiation structure for cooling a solid state imaging element by reducing an external load applied on the solid state imaging element with a relatively simple structure, along with a solid state image pickup device having the heat radiation structure, relating to a heat radiation structure of the solid state image pickup element used for an imaging apparatus comprising the solid state image pickup element as well as a solid state imaging device having the heat radiation structure SOLUTION: The solid state image pickup element includes a heat radiation member which comprises first and second contact parts that are separately fixed to a plurality of prism members and separately contacted to first and second solid state image pickup elements adjoining each other, and a heat radiation part which radiates the heat transmitted through the first and second contact parts into the surrounding air The heat radiation part is arranged between the first and second contact parts The heat radiation member is formed from a series of foil member of which respective contact part and heat radiation part are made from high heat conductivity material The heat radiation part has such shape as a foil member is bent or deflected by a plurality of times COPYRIGHT: (C)2009,JPO&INPIT

Heat radiation structure of solid state image pickup element and solid state image pickup device

PURPOSE:To provide a cooling device, which is suitable to apply to an electronic equipment provided with an electronic device which generates heat when operating CONSTITUTION:A cooling device, which is constituted of an electronic cooling element 2 for cooling a heating unit, a heat dissipation heat pipe 4 and a metallic and elastic thermal conduction mechanism 3, which is good in heat conductivity and has a flexibility and is interposed between the element 2 and the heat pipe 4, is applied to an electronic equipment provided with an electronic device 1, which generates heat while operating

Egami Yoshio

Papers

Cooling device for electronic equipment