Eladio Clemente Delgado

Bio: Eladio Clemente Delgado is an academic researcher from General Electric. The author has contributed to research in topics: Power module & Inverter. The author has an hindex of 12, co-authored 26 publications receiving 471 citations.

Power electronic module packaging

Abstract: A method of power electronic packaging includes a practicable and reliable method of fabricating power circuit modules and associated connections that are compatible with the standard top layer metalization of commercially available power devices. A planar single- or multi-layer membrane structure is attached to a carrier frame, and a via pattern is formed in the membrane. Power devices are aligned and attached to the planar membrane structure; a top layer interconnect structure is formed by metalizing the vias and the film; and a circuit is formed by patterning a deposited metal layer. The carrier frame is removed, and upper and lower thermal base plate sub-assemblies are attached to the power device-on-membrane structure. The planar device-on-membrane structure accommodates different types of power devices having variations in thickness. The thermal base plate sub-assemblies may include integral, high-performance heat exchangers for providing a low thermal resistance path to the ambient.

Layer-to-layer interconnects for photoelectric devices and methods of fabricating the same

Abstract: Interconnects for electronic devices. More specifically, stacked photoelectric devices, such as parallel tandem photovoltaic devices are provided. Each of the photovoltaic devices comprises photovoltaic cells formed between two substrates. Each of the substrates may include one or more interconnects to route a voltage from one side of the substrate to another. Each substrate includes an edge portion extending beyond the edge portion of an immediately adjacent substrate. All interconnects are exposed to one side of the device for easy and flexible electric connectivity and fabrication. The interconnects, which may include conductive vias or conductive edge wraps, are formed in the edge portion of the substrates.

Stationary computed tomography system and method

Abstract: A radiographic imaging system is presented. The system includes a system controller and a plurality of sub-system controllers. Each sub-system controller is configured to facilitate generation of a radiation beam through an imaging volume in a desired sequence. In addition, the system includes a first communication link configured to couple the system controller and each of the sub-system controllers, where the first communication link is configured to communicate sequencing commands and imaging protocol data. The system also includes a second communication link configured to couple the system controller and each of the sub-system controllers, where the second communication link is configured to communicate X-ray source event data. The X-ray source event data comprises a plurality of pulses of individually addressable radiation sources. Additionally, the system includes one or more detector sections configured to receive a transmitted radiation beam.

A new power module packaging technology for enhanced thermal performance

Abstract: A new approach to packaging high performance power devices, Chip on Flex Power Overlay (POL) was presented. It was shown that the GE's cost effective POL power packaging technology is ideally suited for high heat flux and high performance applications. This is primarily due to the elimination of bond wires and the planar geometry which offers cooling of power devices from top, bottom or both sides of the power module. It was also shown that a cost effective, scalable high performance integral heat exchanger can maximize the thermal performance of POL technology thereby helping to utilize its full potential. Due to the excellent thermal and electrical performance, low weight, volume, and cost effectiveness GE's revolutionary POL technology sets a new standard for the future of packaging power electronics modules.

Integrated capacitor shield for balun in MRI receivers

Abstract: A balun is included in a magnetic resonance imaging system. The balun conditions electromagnetic signals received from at least one RF receiver coil. The balun includes a balun shield having an integrated capacitor therein. The balun shield blocks unwanted feedback from effecting performance of any components contained within the balun shield.

Power semiconductor device

Abstract: A power semiconductor device includes trenches disposed in a first base layer of a first conductivity type at intervals to partition main and dummy cells, at a position remote from a collector layer of a second conductivity type. In the main cell, a second base layer of the second conductivity type, and an emitter layer of the first conductivity type are disposed. In the dummy cell, a buffer layer of the second conductivity type is disposed. A gate electrode is disposed, through a gate insulating film, in a trench adjacent to the main cell. A buffer resistor having an infinitely large resistance value is inserted between the buffer layer and emitter electrode. The dummy cell is provided with an inhibiting structure to reduce carriers of the second conductivity type to flow to and accumulate in the buffer layer from the collector layer.

Programmable antenna with programmable impedance matching and methods for use therewith

Abstract: A programmable antenna includes a fixed antenna element and a programmable antenna element that is tunable to one of a plurality of resonant frequencies in response to at least one antenna control signal. A programmable impedance matching network is tunable in response to at least one matching network control signal, to provide, for instance, a substantially constant load impedance. A control module generates the antenna control signals and the matching network control signals, in response to a frequency selection signal.

Light absorption and filtering properties of vertically oriented semiconductor nano wires

Abstract: A nanowire array is described herein. The nanowire array comprises a substrate and a plurality of nanowires extending essentially vertically from the substrate; wherein: each of the nanowires has uniform chemical along its entire length; a refractive index of the nanowires is at least two times of a refractive index of a cladding of the nanowires. This nanowire array is useful as a photodetector, a submicron color filter, a static color display or a dynamic color display.

Multiple energy-source power converter system

Abstract: A flexible integrated power converter system that connects various types of electrical power sources together and supplies a defined type of electrical energy to a load, such as a standard household mains voltage supply, is provided. Each of the electrical power sources is electrically isolated from the load, as well as each other. A respective input converter is coupled to each power source. Each input converter may include a small high-frequency transformer driven by an efficient soft-switched dc-dc converter. The voltages produced by each of the input converters are combined in parallel and delivered to a single output inverter. The output inverter converts the combined voltages to an ac voltage that may be delivered to a load.