E
Elliott Forbes
Researcher at North Carolina State University
Publications - 11
Citations - 63
Elliott Forbes is an academic researcher from North Carolina State University. The author has contributed to research in topics: Microarchitecture & Multi-core processor. The author has an hindex of 4, co-authored 11 publications receiving 62 citations. Previous affiliations of Elliott Forbes include University of Wisconsin–La Crosse.
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Proceedings ArticleDOI
Rationale for a 3D heterogeneous multi-core processor
Eric Rotenberg,Brandon H. Dwiel,Elliott Forbes,Zhenqian Zhang,Randy Widialaksono,Rangeen Basu Roy Chowdhury,Nyunyi M. Tshibangu,Steve Lipa,W. Rhett Davis,Paul D. Franzon +9 more
TL;DR: Single-ISA heterogeneous multi-core processors are comprised of multiple core types that are functionally equivalent but microarchitecturally diverse.
Proceedings ArticleDOI
EXACT: explicit dynamic-branch prediction with active updates
TL;DR: It is proposed that stores to the memory addresses on which a dynamic branch depends, directly update its prediction in the predictor, and this novel "active update" concept avoids mispredictions that are otherwise incurred by conventional passive training.
Proceedings ArticleDOI
Under 100-cycle thread migration latency in a single-ISA heterogeneous multi-core processor
Elliott Forbes,Zhenqian Zhang,Randy Widialaksono,Brandon H. Dwiel,Rangeen Basu Roy Chowdhury,Vinesh Srinivasan,Steve Lipa,Eric Rotenberg,W. Rhett Davis,Paul D. Franzon +9 more
TL;DR: This article proposes hardware support for fast thread migration in Single-ISA Heterogeneous Multi-core, which combines general purpose cores with different microarchitectures, tuned for different energy/performance points.
Proceedings ArticleDOI
H3 (Heterogeneity in 3D): A Logic-on-Logic 3D-Stacked Heterogeneous Multi-Core Processor
Vinesh Srinivasan,Rangeen Basu Roy Chowdhury,Elliott Forbes,Randy Widialaksono,Zhenqian Zhang,Joshua Schabel,Sungkwan Ku,Steve Lipa,Eric Rotenberg,W. Rhett Davis,Paul D. Franzon +10 more
TL;DR: The H3 chip is presented, that uses 3D die stacking and novel microarchitecture to implement a heterogeneous multi-core processor (HMP) with low-latency fast thread migration capabilities and can reduce power consumption of benchmarks by up to 26%.
Proceedings ArticleDOI
Computing in 3D
Paul D. Franzon,Eric Rotenberg,James Tuck,W. Rhett Davis,Huiyang Zhou,Joshua Schabel,Zhenquian Zhang,J. Brandon Dwiel,Elliott Forbes,Joonmoo Huh,Steve Lipa +10 more
TL;DR: 3D technologies offer significant potential to improve total performance and performance per unit of power, and the next frontier is to create sophisticated logic on logic solutions that promise further increases in performance/power beyond those attributable to memory interfaces alone.