Eugene A. Fitzgerald

Bio: Eugene A. Fitzgerald is an academic researcher from Massachusetts Institute of Technology. The author has contributed to research in topics: Wafer & Silicon. The author has an hindex of 62, co-authored 476 publications receiving 17427 citations. Previous affiliations of Eugene A. Fitzgerald include Alcatel-Lucent & TSMC.

Strained Si, SiGe, and Ge channels for high-mobility metal-oxide-semiconductor field-effect transistors

Abstract: This article reviews the history and current progress in high-mobility strained Si, SiGe, and Ge channel metal-oxide-semiconductor field-effect transistors (MOSFETs). We start by providing a chronological overview of important milestones and discoveries that have allowed heterostructures grown on Si substrates to transition from purely academic research in the 1980’s and 1990’s to the commercial development that is taking place today. We next provide a topical review of the various types of strain-engineered MOSFETs that can be integrated onto relaxed Si1−xGex, including surface-channel strained Si n- and p-MOSFETs, as well as double-heterostructure MOSFETs which combine a strained Si surface channel with a Ge-rich buried channel. In all cases, we will focus on the connections between layer structure, band structure, and MOS mobility characteristics. Although the surface and starting substrate are composed of pure Si, the use of strained Si still creates new challenges, and we shall also review the litera...

Totally relaxed GexSi1−x layers with low threading dislocation densities grown on Si substrates

Abstract: We have grown compositionally graded GexSi1−x layers on Si at 900 °C with both molecular beam epitaxy and rapid thermal chemical vapor deposition techniques. Triple‐crystal x‐ray diffraction reveals that for 0.10

Controlling threading dislocation densities in Ge on Si using graded SiGe layers and chemical-mechanical polishing

Abstract: A method of controlling threading dislocation densities in Ge on Si involving graded SiGe layers and chemical-mechanical polishing (CMP) is presented. This method has allowed us to grow a relaxed graded buffer to 100% Ge without the increase in threading dislocation density normally observed in thick graded structures. This sample has been characterized by transmission electron microscopy, etch-pit density, atomic force microscopy, Nomarski optical microscopy, and triple-axis x-ray diffraction. Compared to other relaxed graded buffers in which CMP was not implemented, this sample exhibits improvements in threading dislocation density and surface roughness. We have also made process modifications in order to eliminate particles due to gas-phase nucleation and cracks due to thermal mismatch strain. We have achieved relaxed Ge on Si with a threading dislocation density of 2.1×106 cm−2, and we expect that further process refinements will lead to lower threading dislocation densities on the order of bulk Ge su...

Relaxed GexSi1−x structures for III–V integration with Si and high mobility two‐dimensional electron gases in Si

Abstract: To obtain a large lattice constant on Si, we have grown compositionally graded GexSi1−x on Si. These buffer layers have been characterized with electron‐beam‐induced current, transmission electron microscopy, scanning electron microscopy, x‐ray diffraction, and photoluminescence to determine the extent of relaxation, the threading dislocation density, the surface morphology, and the optical properties. We have observed that it is possible to obtain completely relaxed GexSi1−x layers with 0.1

The structural and luminescence properties of porous silicon

Abstract: A large amount of work world-wide has been directed towards obtaining an understanding of the fundamental characteristics of porous Si. Much progress has been made following the demonstration in 1990 that highly porous material could emit very efficient visible photoluminescence at room temperature. Since that time, all features of the structural, optical and electronic properties of the material have been subjected to in-depth scrutiny. It is the purpose of the present review to survey the work which has been carried out and to detail the level of understanding which has been attained. The key importance of crystalline Si nanostructures in determining the behaviour of porous Si is highlighted. The fabrication of solid-state electroluminescent devices is a prominent goal of many studies and the impressive progress in this area is described.

Gan : processing, defects, and devices

Abstract: The role of extended and point defects, and key impurities such as C, O, and H, on the electrical and optical properties of GaN is reviewed. Recent progress in the development of high reliability contacts, thermal processing, dry and wet etching techniques, implantation doping and isolation, and gate insulator technology is detailed. Finally, the performance of GaN-based electronic and photonic devices such as field effect transistors, UV detectors, laser diodes, and light-emitting diodes is covered, along with the influence of process-induced or grown-in defects and impurities on the device physics.

Metal-Assisted Chemical Etching of Silicon: A Review

Abstract: This article presents an overview of the essential aspects in the fabrication of silicon and some silicon/germanium nanostructures by metal-assisted chemical etching. First, the basic process and mechanism of metal-assisted chemical etching is introduced. Then, the various influences of the noble metal, the etchant, temperature, illumination, and intrinsic properties of the silicon substrate (e.g., orientation, doping type, doping level) are presented. The anisotropic and the isotropic etching behaviors of silicon under various conditions are presented. Template-based metal-assisted chemical etching methods are introduced, including templates based on nanosphere lithography, anodic aluminum oxide masks, interference lithography, and block-copolymer masks. The metal-assisted chemical etching of other semiconductors is also introduced. A brief introduction to the application of Si nanostructures obtained by metal-assisted chemical etching is given, demonstrating the promising potential applications of metal-assisted chemical etching. Finally, some open questions in the understanding of metal-assisted chemical etching are compiled.

Thin Film Materials: Stress, Defect Formation and Surface Evolution

Abstract: 1. Introduction and overview 2. Film stress and substrate curvature 3. Stress in anisotropic and patterned films 4. Delamination and fracture 5. Film buckling, bulging and peeling 6. Dislocation formation in epitaxial systems 7. Dislocation interactions and strain relaxation 8. Equilibrium and stability of surfaces 9. The role of stress in mass transport.

Light-emitting diodes

Abstract: Light-Emitting Diodes. (Monographs in Electrical and Electronic Engineering.) By A. A. Bergh and P. J. Dean. Pp. viii+591. (Clarendon: Oxford; Oxford University: London, 1976.) £22.