F. de Paulis

Bio: F. de Paulis is an academic researcher from University of L'Aquila. The author has contributed to research in topics: Equivalent circuit & Metamaterial. The author has an hindex of 16, co-authored 50 publications receiving 860 citations. Previous affiliations of F. de Paulis include Missouri University of Science and Technology & De Montfort University.

Physics-Based Via and Trace Models for Efficient Link Simulation on Multilayer Structures Up to 40 GHz

Abstract: Analytical models for vias and traces are presented for simulation of multilayer interconnects at the package and printed circuit board levels. Vias are modeled using an analytical formulation for the parallel-plate impedance and capacitive elements, whereas the trace-via transitions are described by modal decomposition. It is shown that the models can be applied to efficiently simulate a wide range of structures. Different scenarios are analyzed including thru-hole and buried vias, power vias, and coupled traces routed into different layers. By virtue of the modal decomposition, the proposed method is general enough to handle structures with mixed reference planes. For the first time, these models have been validated against full-wave methods and measurements up to 40 GHz. An improvement on the computation speed of at least two orders of magnitude has been observed with respect to full-wave simulations.

Analytical Evaluation of Via-Plate Capacitance for Multilayer Printed Circuit Boards and Packages

Abstract: The via-plate capacitance for a via transition to a multilayer printed circuit board is evaluated analytically in terms of higher order parallel-plate modes. The Green's function in a bounded coaxial cavity for a concentric magnetic ring current is first derived by introducing reflection coefficients for cylindrical waves at the inner and outer cavity walls. These walls can be perfect electric conductor (PEC)/perfect magnetic conductor(PMC) or a nonreflective perfectly matched layer. By further assuming a magnetic frill current on the via-hole in the metal plate, an analytical formula is derived for the via barrel-plate capacitance by summing the higher order modes in the bounded coaxial cavity. The convergence of the formula with the number of modes, as well as with the radius of the outer PEC/PMC wall is discussed. The analytical formula is validated by both quasi-static numerical methods and measurements. Furthermore, the formula allows the investigation of the frequency dependence of the via-plate capacitance, which is not possible with quasi-static methods.

A Simple and Efficient Design Procedure for Planar Electromagnetic Bandgap Structures on Printed Circuit Boards

Abstract: In this paper, a simple synthesis procedure to design planar electromagnetic bandgap (EBG) structures is proposed. It is based on the consideration of the excess of inductance of a patterned plane with respect to a solid one. The planar EBG structure is sized from the bandgap starting and ending frequencies, and few others specifications employing a closed form formulation. The proposed method is also suitable for the design of embedded planar EBG. The procedure is validated by using measured and numerically computed results.

Compact Configuration for Common Mode Filter Design based on Planar Electromagnetic Bandgap Structures

Abstract: A planar electromagnetic bandgap configuration of a compact common mode filter that is laid out on printed circuit board is studied. This filter is used to mitigate the common mode noise traveling on high-speed differential signal traces. These differential signal lines may be connected to I/O connectors and cables and small amounts of common mode noise can result in significant electromagnetic emissions. The filter is obtained by a very simple planar geometry based on the electromagnetic bandgap structures. A cavity made by a rectangular/square patch (together with a solid plane underneath) has a well known and predictable resonant behavior; the coupling between the differential pair routed on top of the patterned plane and the patch cavity, occurring when the traces cross the gap between adjacent patches, is used to reduce the energy associated with the propagation of the common mode noise. The properties of this filter are studied taking into account the layout of a real differential microstrip and the number of gap crossings. A compact configuration is proposed. Time domain simulations validate the suggested layout approach.

Rapid Rotary Scanner and Portable Coherent Wideband Q-Band Transceiver for High-Resolution Millimeter-Wave Imaging Applications

Abstract: Millimeter-wave imaging techniques, based on synthetic aperture focusing (SAF), have been successfully used for nondestructive testing (NDT) of various composite and aerospace structures. Most current imaging mechanisms utilize raster scanning platforms, whereby the imaging system is scanned in a rectangular grid over the structure-under-test (SUT). Most raster scanning platforms, although relatively simple in design and construction, are inherently slow. Furthermore, SAF techniques necessitates the use of vector-measuring instruments such as a vector network analyzer (VNA), which are typically: 1) bulky; 2) cannot be mounted on scanning platforms; 3) are not suitable for in-field use; and 4) expensive. These factors limit the effectiveness of these millimeter-wave imaging techniques in applications where frequent and rapid inspection of large structures is required. Hence, there is a great demand for rapid mechanical scanning systems combined with portable wideband transceivers in order to increase the utility of these imaging techniques, and provide a real solution to many practical NDT applications. To this end, a unique rotary scanner system, capable of scanning a relatively large area in a relatively short span of time, was designed and constructed. In addition, a custom-designed portable transceiver system operating in the frequency range of 35-45 GHz (Q-band) was developed and incorporated into the rotary scanner system for producing coherent (amplitude and phase) and accurate data suitable for synthetic aperture imaging and the 10-GHz bandwidth allows the generation of relatively high-resolution millimeter-wave holographical images. This paper presents the design of the rotary scanning system, the associated Q-band transceiver and the integration of the two systems via a custom-designed software. To illustrate the efficacy of the complete imaging system, SAF of several complex structures produced using the proposed system, are presented and discussed.

Signal Integrity Design for High-Speed Digital Circuits: Progress and Directions

Abstract: This paper reviews recent progress and future directions of signal integrity design for high-speed digital circuits, focusing on four areas: signal propagation on transmission lines, discontinuity modeling and characterization, measurement techniques, and link-path design and analysis.

Review of applications of TLBO algorithm and a tutorial for beginners to solve the unconstrained and constrained optimization problems

Abstract: Article history: Received June25, 2015 Received in revised format: September 22, 2015 Accepted September 24, 2015 Available online September 25 2015 The teaching-learning-based optimization (TLBO) algorithm is finding a large number of applications in different fields of engineering and science since its introduction in 2011. The major applications are found in electrical engineering, mechanical design, thermal engineering, manufacturing engineering, civil engineering, structural engineering, computer engineering, electronics engineering, physics, chemistry, biotechnology and economics. This paper presents a review of applications of TLBO algorithm and a tutorial for solving the unconstrained and constrained optimization problems. The tutorial is expected to be useful to the beginners.

Overview of Signal Integrity and EMC Design Technologies on PCB: Fundamentals and Latest Progress

Abstract: This paper reviews the fundamentals and latest progress of modeling, analysis, and design technologies for signal integrity and electromagnetic compatibility on PCB and package in the past decades. Most results in this field are based on the very rich and highly educational literature produced by Prof. C. Paul in his long scientific career. The inclusion of parameters variability effects is also considered, and it is demonstrated how statistical simulations can become affordable by means of recently-introduced stochastic methods. Finally, the necessity of practical training of designers is mentioned, and an experience relying on realistic PCB demonstrators is illustrated.