Fabio Pavanello

Bio: Fabio Pavanello is an academic researcher from University of Colorado Boulder. The author has contributed to research in topics: Terahertz radiation & Photonics. The author has an hindex of 18, co-authored 52 publications receiving 2167 citations. Previous affiliations of Fabio Pavanello include Ghent University & Centre national de la recherche scientifique.

Single-chip microprocessor that communicates directly using light

Abstract: An electronic–photonic microprocessor chip manufactured using a conventional microelectronics foundry process is demonstrated; the chip contains 70 million transistors and 850 photonic components and directly uses light to communicate to other chips. The rapid transfer of data between chips in computer systems and data centres has become one of the bottlenecks in modern information processing. One way of increasing speeds is to use optical connections rather than electrical wires and the past decade has seen significant efforts to develop silicon-based nanophotonic approaches to integrate such links within silicon chips, but incompatibility between the manufacturing processes used in electronics and photonics has proved a hindrance. Now Chen Sun et al. describe a 'system on a chip' microprocessor that successfully integrates electronics and photonics yet is produced using standard microelectronic chip fabrication techniques. The resulting microprocessor combines 70 million transistors and 850 photonic components and can communicate optically with the outside world. This result promises a way forward for new fast, low-power computing systems architectures. Data transport across short electrical wires is limited by both bandwidth and power density, which creates a performance bottleneck for semiconductor microchips in modern computer systems—from mobile phones to large-scale data centres. These limitations can be overcome1,2,3 by using optical communications based on chip-scale electronic–photonic systems4,5,6,7 enabled by silicon-based nanophotonic devices8. However, combining electronics and photonics on the same chip has proved challenging, owing to microchip manufacturing conflicts between electronics and photonics. Consequently, current electronic–photonic chips9,10,11 are limited to niche manufacturing processes and include only a few optical devices alongside simple circuits. Here we report an electronic–photonic system on a single chip integrating over 70 million transistors and 850 photonic components that work together to provide logic, memory, and interconnect functions. This system is a realization of a microprocessor that uses on-chip photonic devices to directly communicate with other chips using light. To integrate electronics and photonics at the scale of a microprocessor chip, we adopt a ‘zero-change’ approach to the integration of photonics. Instead of developing a custom process to enable the fabrication of photonics12, which would complicate or eliminate the possibility of integration with state-of-the-art transistors at large scale and at high yield, we design optical devices using a standard microelectronics foundry process that is used for modern microprocessors13,14,15,16. This demonstration could represent the beginning of an era of chip-scale electronic–photonic systems with the potential to transform computing system architectures, enabling more powerful computers, from network infrastructure to data centres and supercomputers.

Integrating photonics with silicon nanoelectronics for the next generation of systems on a chip.

Abstract: Electronic and photonic technologies have transformed our lives-from computing and mobile devices, to information technology and the internet. Our future demands in these fields require innovation in each technology separately, but also depend on our ability to harness their complementary physics through integrated solutions1,2. This goal is hindered by the fact that most silicon nanotechnologies-which enable our processors, computer memory, communications chips and image sensors-rely on bulk silicon substrates, a cost-effective solution with an abundant supply chain, but with substantial limitations for the integration of photonic functions. Here we introduce photonics into bulk silicon complementary metal-oxide-semiconductor (CMOS) chips using a layer of polycrystalline silicon deposited on silicon oxide (glass) islands fabricated alongside transistors. We use this single deposited layer to realize optical waveguides and resonators, high-speed optical modulators and sensitive avalanche photodetectors. We integrated this photonic platform with a 65-nanometre-transistor bulk CMOS process technology inside a 300-millimetre-diameter-wafer microelectronics foundry. We then implemented integrated high-speed optical transceivers in this platform that operate at ten gigabits per second, composed of millions of transistors, and arrayed on a single optical bus for wavelength division multiplexing, to address the demand for high-bandwidth optical interconnects in data centres and high-performance computing3,4. By decoupling the formation of photonic devices from that of transistors, this integration approach can achieve many of the goals of multi-chip solutions 5 , but with the performance, complexity and scalability of 'systems on a chip'1,6-8. As transistors smaller than ten nanometres across become commercially available 9 , and as new nanotechnologies emerge10,11, this approach could provide a way to integrate photonics with state-of-the-art nanoelectronics.

Monolithic silicon-photonic platforms in state-of-the-art CMOS SOI processes [Invited]

Abstract: Integrating photonics with advanced electronics leverages transistor performance, process fidelity and package integration, to enable a new class of systems-on-a-chip for a variety of applications ranging from computing and communications to sensing and imaging. Monolithic silicon photonics is a promising solution to meet the energy efficiency, sensitivity, and cost requirements of these applications. In this review paper, we take a comprehensive view of the performance of the silicon-photonic technologies developed to date for photonic interconnect applications. We also present the latest performance and results of our "zero-change" silicon photonics platforms in 45 nm and 32 nm SOI CMOS. The results indicate that the 45 nm and 32 nm processes provide a "sweet-spot" for adding photonic capability and enhancing integrated system applications beyond the Moore-scaling, while being able to offload major communication tasks from more deeply-scaled compute and memory chips without complicated 3D integration approaches.

Ultrawide-Bandwidth Single-Channel 0.4-THz Wireless Link Combining Broadband Quasi-Optic Photomixer and Coherent Detection

Abstract: Free space communications with huge data capacity have become a key point for the development of mobile access, services, and network technologies convergence. Wireless links using emerging terahertz technologies, also referred to as T-ray communications, have become an intensive research field within last years since T-rays at the millimeter/submillimeter frontier remain more robust in terms of scintillation, dielectric obstacles, and fog compared with near-infrared signals. Using a passive THz hot-spot which can be fed by fiber optic networks, we investigate up bit rates up to 46 Gbps for a THz wireless transmission system at 400-GHz carrier frequency. Using a THz photomixer integrated with a specific broadband antenna and heterodyne electronic detection, we investigate the eye diagrams using 1-μW received power, highlighting the high sensitivity and ultra-wideband behavior of the whole THz system.

A 45 nm CMOS-SOI Monolithic Photonics Platform With Bit-Statistics-Based Resonant Microring Thermal Tuning

Abstract: The microring resonator is critical for dense wavelength division multiplexed (DWDM) chip-to-chip optical I/O, enabling modulation and channel selection at the $\upmu\text{m}$ -scale suitable for a VLSI chip. Microring-based links, however, require active tuning to counteract process and thermo-optic variations. Here, we present a bit-statistical tuner that decouples tracking of optical one- and zero-levels to realize non-dc-balanced data transmission, an “eye-max”-locking controller, and self-heating cancellation without need for a high-speed sensing frontend. We implement the tuner on a 45 nm CMOS-SOI process with monolithically integrated photonic devices and circuits. The tuner consumes 0.74 mW in the logic while achieving a record 524 GHz ( $>$ 50 K temperature) tuning range at $3.8\;\upmu\text{W/GHz}$ heater efficiency. To our knowledge, this is the highest range and heater efficiency reported by an on-chip closed-loop thermal tuner to date. The tuner integrates with a 5 Gb/s 30 fJ/bit monolithic microring transmitter, achieving wavelength-lock and immunity to both tracking failures and self-heating events caused by arbitrary, non-dc-balanced bitstreams. In addition, the tuner provides critical functionality for an 11- $\lambda$ DWDM transmitter macro capable of $11\ \times\ 8$ Gb/s bandwidth on a fiber. Together with the transmitter, a 10 Gb/s on-chip monolithic optical receiver with $10^{-{\textbf{12}}}$ BER sensitivity of $9\;\upmu\text{A}$ at 10 Gb/s enables a sub-pJ/bit 5 Gb/s optical chip-to-chip link, with the bit-statistical tuner providing thermally robust microring operation.

Deep learning with coherent nanophotonic circuits

Abstract: Artificial Neural Networks have dramatically improved performance for many machine learning tasks. We demonstrate a new architecture for a fully optical neural network that enables a computational speed enhancement of at least two orders of magnitude and three orders of magnitude in power efficiency over state-of-the-art electronics.

Integrated lithium niobate electro-optic modulators operating at CMOS-compatible voltages

Abstract: Electro-optic modulators translate high-speed electronic signals into the optical domain and are critical components in modern telecommunication networks1,2 and microwave-photonic systems3,4. They are also expected to be building blocks for emerging applications such as quantum photonics5,6 and non-reciprocal optics7,8. All of these applications require chip-scale electro-optic modulators that operate at voltages compatible with complementary metal–oxide–semiconductor (CMOS) technology, have ultra-high electro-optic bandwidths and feature very low optical losses. Integrated modulator platforms based on materials such as silicon, indium phosphide or polymers have not yet been able to meet these requirements simultaneously because of the intrinsic limitations of the materials used. On the other hand, lithium niobate electro-optic modulators, the workhorse of the optoelectronic industry for decades9, have been challenging to integrate on-chip because of difficulties in microstructuring lithium niobate. The current generation of lithium niobate modulators are bulky, expensive, limited in bandwidth and require high drive voltages, and thus are unable to reach the full potential of the material. Here we overcome these limitations and demonstrate monolithically integrated lithium niobate electro-optic modulators that feature a CMOS-compatible drive voltage, support data rates up to 210 gigabits per second and show an on-chip optical loss of less than 0.5 decibels. We achieve this by engineering the microwave and photonic circuits to achieve high electro-optical efficiencies, ultra-low optical losses and group-velocity matching simultaneously. Our scalable modulator devices could provide cost-effective, low-power and ultra-high-speed solutions for next-generation optical communication networks and microwave photonic systems. Furthermore, our approach could lead to large-scale ultra-low-loss photonic circuits that are reconfigurable on a picosecond timescale, enabling a wide range of quantum and classical applications5,10,11 including feed-forward photonic quantum computation. Chip-scale lithium niobate electro-optic modulators that rapidly convert electrical to optical signals and use CMOS-compatible voltages could prove useful in optical communication networks, microwave photonic systems and photonic computation.

Advances in terahertz communications accelerated by photonics

Abstract: This Review covers the state-of-the-art technologies on photonics-based terahertz communications, which are compared with competing technologies based on electronics and free-space optical communications. Future prospects and challenges are also discussed. Almost 15 years have passed since the initial demonstrations of terahertz (THz) wireless communications were made using both pulsed and continuous waves. THz technologies are attracting great interest and are expected to meet the ever-increasing demand for high-capacity wireless communications. Here, we review the latest trends in THz communications research, focusing on how photonics technologies have played a key role in the development of first-age THz communication systems. We also provide a comparison with other competitive technologies, such as THz transceivers enabled by electronic devices as well as free-space lightwave communications.

The 2017 terahertz science and technology roadmap

Abstract: Science and technologies based on terahertz frequency electromagnetic radiation (100 GHz–30 THz) have developed rapidly over the last 30 years. For most of the 20th Century, terahertz radiation, then referred to as sub-millimeter wave or far-infrared radiation, was mainly utilized by astronomers and some spectroscopists. Following the development of laser based terahertz time-domain spectroscopy in the 1980s and 1990s the field of THz science and technology expanded rapidly, to the extent that it now touches many areas from fundamental science to 'real world' applications. For example THz radiation is being used to optimize materials for new solar cells, and may also be a key technology for the next generation of airport security scanners. While the field was emerging it was possible to keep track of all new developments, however now the field has grown so much that it is increasingly difficult to follow the diverse range of new discoveries and applications that are appearing. At this point in time, when the field of THz science and technology is moving from an emerging to a more established and interdisciplinary field, it is apt to present a roadmap to help identify the breadth and future directions of the field. The aim of this roadmap is to present a snapshot of the present state of THz science and technology in 2017, and provide an opinion on the challenges and opportunities that the future holds. To be able to achieve this aim, we have invited a group of international experts to write 18 sections that cover most of the key areas of THz science and technology. We hope that The 2017 Roadmap on THz science and technology will prove to be a useful resource by providing a wide ranging introduction to the capabilities of THz radiation for those outside or just entering the field as well as providing perspective and breadth for those who are well established. We also feel that this review should serve as a useful guide for government and funding agencies.

Single-chip microprocessor that communicates directly using light

Abstract: An electronic–photonic microprocessor chip manufactured using a conventional microelectronics foundry process is demonstrated; the chip contains 70 million transistors and 850 photonic components and directly uses light to communicate to other chips. The rapid transfer of data between chips in computer systems and data centres has become one of the bottlenecks in modern information processing. One way of increasing speeds is to use optical connections rather than electrical wires and the past decade has seen significant efforts to develop silicon-based nanophotonic approaches to integrate such links within silicon chips, but incompatibility between the manufacturing processes used in electronics and photonics has proved a hindrance. Now Chen Sun et al. describe a 'system on a chip' microprocessor that successfully integrates electronics and photonics yet is produced using standard microelectronic chip fabrication techniques. The resulting microprocessor combines 70 million transistors and 850 photonic components and can communicate optically with the outside world. This result promises a way forward for new fast, low-power computing systems architectures. Data transport across short electrical wires is limited by both bandwidth and power density, which creates a performance bottleneck for semiconductor microchips in modern computer systems—from mobile phones to large-scale data centres. These limitations can be overcome1,2,3 by using optical communications based on chip-scale electronic–photonic systems4,5,6,7 enabled by silicon-based nanophotonic devices8. However, combining electronics and photonics on the same chip has proved challenging, owing to microchip manufacturing conflicts between electronics and photonics. Consequently, current electronic–photonic chips9,10,11 are limited to niche manufacturing processes and include only a few optical devices alongside simple circuits. Here we report an electronic–photonic system on a single chip integrating over 70 million transistors and 850 photonic components that work together to provide logic, memory, and interconnect functions. This system is a realization of a microprocessor that uses on-chip photonic devices to directly communicate with other chips using light. To integrate electronics and photonics at the scale of a microprocessor chip, we adopt a ‘zero-change’ approach to the integration of photonics. Instead of developing a custom process to enable the fabrication of photonics12, which would complicate or eliminate the possibility of integration with state-of-the-art transistors at large scale and at high yield, we design optical devices using a standard microelectronics foundry process that is used for modern microprocessors13,14,15,16. This demonstration could represent the beginning of an era of chip-scale electronic–photonic systems with the potential to transform computing system architectures, enabling more powerful computers, from network infrastructure to data centres and supercomputers.